xviii Copyright © 2015 IEEE. All rights reserved.
83A.7.6 Electrical measurement methods .................................................................................... 103
Annex 83B (normative) Chip-to-module 40 Gb/s Attachment Unit Interface (XLAUI) and 100 Gb/s
ten-lane Attachment Unit Interface (CAUI-10)
.............................................................................. 104
83B.1 Overview ....................................................................................................................
.............. 104
83B.2 Compliance point specifications for chip-to-m
odule XLAUI/CAUI-10 ................................. 105
83B.2.1 Module specifications ..................................................................................................... 105
83B.2.2 Host specifications........................................................................................................
.. 106
83B.2.3 Host input signal tolerance ..........................
................................................................... 106
83B.3 Environmental specifications .................................................................................................
.. 107
83B.3.4 Electromagnetic compatibility........................................................................................ 107
83B.3.5 Temperature and humidity.............................................................................................. 107
83B.4 Protocol implementation conformance statem
ent (PICS) proforma for Annex 83B, Chip-
to-module 40 Gb/s Attachment Unit Interface
(XLAUI) and 100 Gb/s ten-lane
Attachment Unit Interface (CAUI-10)
..................................................................................... 107
83B.4.1 Introduction.............................................................................................................
........ 107
83B.4.2 Identification...........................................................................................................
........ 107
83B.4.2.2 Protocol summary ................................................................................................. 107
83B.4.3 Major capabilities/options............................................................................................... 108
83B.4.4 Module requirements ...................................................................................................... 108
83B.4.5 Host requirements .........................................................................................................
.. 108
Annex 83C (normative) PMA sublayer partitioning examples .................................................................. 109
83C.1 Partitioning examples with FEC
.............................................................................................. 109
83C.1.2 FEC implemented with PMD ......................................................................................... 109
83C.1a Partitioning examples with RS-FEC
........................................................................................ 110
83C.1a.2 Single CAUI-10 with RS-FEC
....................................................................................... 110
83C.2 Partitioning examples without FEC
......................................................................................... 111
83C.2.2 Single XLAUI/CAUI-4 without FEC
............................................................................. 111
83C.2.3 Separate SERDES for optical module interface
............................................................. 112
Annex 83D (normative) Chip-to-chip 100 Gb/s four-lane Attachment Unit Interface
(CAUI-4).............. 113
83D.1 Overview....................................................................................................................
.............. 113
83D.2 CAUI-4 chip-to-chip compliance point definition
................................................................... 115
83D.3 CAUI-4 chip-to-chip electrical characteristics
........................................................................ 115
83D.3.1 CAUI-4 transmitter characteristics ................................................................................. 115
83D.3.1.1 Transmitter equalization settings .......................................................................... 116
83D.3.2 Optional EEE operation .................................................................................................. 117
83D.3.3 CAUI-4 receiver characteristics...................................................................................... 118
83D.3.3.1 Receiver interference tolerance
............................................................................ 118
83D.3.3.2 Transmitter equalization feedback (optional) ....................................................... 119
83D.3.4 Global energy detect function for optional EEE oper
ation............................................. 119
83D.4 CAUI-4 chip-to-chip channel characteristics
........................................................................... 119
83D.5 Example usage of the optional transmitter equalization feedback
........................................... 121
83D.5.1 Overview.................................................................................................................
........ 121
83D.5.2 Tuning equalization settings on lane 0 in the transmit direction
.................................... 122
83D.5.3 Tuning equaliza
tion settings on lane 0 in the receive direction...................................... 122
83D.6 Protocol implementation conformance statem
ent (PICS) proforma for Annex 83D, Chip-
to-chip 100 Gb/s four-lane Attachment Unit Interface (C
AUI-4) ........................................... 123
83D.6.1 Introduction.............................................................................................................
........ 123
83D.6.2 Identification ...........................................................................................................
........ 123
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