dsPIC33FJ64MC804微控制器芯片手册：资源、存储与特性解析

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"dsPIC33FJ64MC804是Microchip Technology Inc.生产的一款高性能16位数字信号控制器(DSC)，适用于各种嵌入式应用，特别是电机控制领域。该芯片的手册包含了详细的资源介绍、存储配置以及其他关键功能的说明。" dsPIC33FJ64MC804芯片具有以下主要特点： 1. **操作条件**：该芯片支持宽电压范围，从3.0V到3.6V，工作温度区间在-40ºC到+150ºC（对于低功耗应用，最高可工作至+125ºC），并且能够在20MIPS（每秒百万指令）的速度下运行。 2. **时钟管理**：内建2%精度的内部振荡器，以及可编程的锁相环(PLL)和振荡器时钟源。此外，它还配备了失效安全时钟监控器(FSCM)、独立看门狗定时器以及低功耗管理模式。快速唤醒和启动功能使其在待机模式与工作模式之间切换更为高效。 3. **核心性能**：dsPIC33FJ64MC804搭载了高达40MIPS的16位dsPIC33F CPU，拥有两个40位宽的累加器，支持单周期乘法累加(MAC/MPY)和双数据预取功能，以及单周期乘法加硬件除法操作。 4. **电机控制PWM**：芯片内置多达四个PWM发生器，每个具有八个输出，死区时间控制支持上升沿和下降沿，提供25ns的PWM分辨率。支持无刷直流(BLDC)、永磁同步电机(PMSM)、交流感应电机(ACIM)和开关磁阻电机(SRM)等多种电机控制应用。还包含可编程故障输入和灵活的触发机制，用于ADC转换和配置。 5. **高级模拟特性**：集成10/12位ADC，采样率可达1.1Msps/500ksps，最多九个ADC输入通道和四个采样保持器。独立且灵活的触发源可供选择。另外，芯片还拥有高速比较器，可配置为两个模拟比较器模块，并带有4位DAC，支持两个电压范围，适用于各种模拟信号处理。 6. **其他功能**：除了上述特点，dsPIC33FJ64MC804还提供了丰富的数字外设接口、串行通信接口如I²C、SPI和UART，以及丰富的中断系统，以满足复杂的系统集成需求。 dsPIC33FJ64MC804是一款高度集成、高性能的微控制器，尤其适合需要高效电机控制和高级模拟功能的应用场景。其强大的计算能力和丰富的外设使得它成为嵌入式系统设计中的理想选择。

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04

NOTES:

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04

2.0 GUIDELINES FOR GETTING

STARTED WITH 16-BIT

DIGITAL SIGNAL

CONTROLLERS

2.1 Basic Connection Requirements

Getting started with the dsPIC33FJ32MC302/304,

dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/

X04 family of 16-bit Digital Signal Controllers (DSC)

requires attention to a minimal set of device pin

connections before proceeding with development. The

following is a list of pin names, which must always be

connected:

• All V

DD and VSS pins

(see Section 2.2 “Decoupling Capacitors”)

• All AV

DD and AVSS pins (regardless if ADC module

is not used)

(see Section 2.2 “Decoupling Capacitors”)

•V

CAP

(see Section 2.3 “CPU Logic Filter Capacitor

Connection (VCAP)”)

•MCLR

(see Section 2.4 “Master Clear (MCLR) Pin”)

• PGECx/PGEDx pins used for In-Circuit Serial

Programming™ (ICSP™) and debugging purposes

(see Section 2.5 “ICSP Pins”)

• OSC1 and OSC2 pins when external oscillator

source is used

(see Section 2.6 “External Oscillator Pins”)

Additionally, the following pins may be required:

•V

REF+/VREF- pins used when external voltage

reference for ADC module is implemented

2.2 Decoupling Capacitors

The use of decoupling capacitors on every pair of

power supply pins, such as VDD, VSS, AVDD and

SS is required.

Consider the following criteria when using decoupling

capacitors:

• Value and type of capacitor: Recommendation

of 0.1 µF (100 nF), 10-20V. This capacitor should

be a low-ESR and have resonance frequency in

the range of 20 MHz and higher. It is

recommended that ceramic capacitors be used.

• Placement on the printed circuit board: The

decoupling capacitors should be placed as close

to the pins as possible. It is recommended to

place the capacitors on the same side of the

board as the device. If space is constricted, the

capacitor can be placed on another layer on the

PCB using a via; however, ensure that the trace

length from the pin to the capacitor is within

one-quarter inch (6 mm) in length.

• Handling high frequency noise: If the board is

experiencing high frequency noise, upward of

tens of MHz, add a second ceramic-type capacitor

in parallel to the above described decoupling

capacitor. The value of the second capacitor can

be in the range of 0.01 µF to 0.001 µF. Place this

second capacitor next to the primary decoupling

capacitor. In high-speed circuit designs, consider

implementing a decade pair of capacitances as

close to the power and ground pins as possible.

For example, 0.1 µF in parallel with 0.001 µF.

• Maximizing performance: On the board layout

from the power supply circuit, run the power and

return traces to the decoupling capacitors first,

and then to the device pins. This ensures that the

decoupling capacitors are first in the power chain.

Equally important is to keep the trace length

between the capacitor and the power pins to a

minimum thereby reducing PCB track inductance.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32MC302/304,

dsPIC33FJ64MCX02/X04 and

dsPIC33FJ128MCX02/X04 family of

devices. It is not intended to be a

comprehensive reference source. To

complement the information in this data

sheet, refer to the “dsPIC33F/PIC24H

Family Reference Manual”. Please see

the Microchip web site

(www.microchip.com) for the latest

dsPIC33F/PIC24H Family Reference

Manual sections.

2: Some registers and associated bits

described in this section may not be

available on all devices. Refer to

Section 4.0 “Memory Organization” in

this data sheet for device-specific register

and bit information.

Note: The AV

DD and AVSS pins must be

connected independent of the ADC

voltage reference source.

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04

FIGURE 2-1: RECOMMENDED

MINIMUM CONNECTION

2.2.1 TANK CAPACITORS

On boards with power traces running longer than six

inches in length, it is suggested to use a tank capacitor

for integrated circuits including DSCs to supply a local

power source. The value of the tank capacitor should

be determined based on the trace resistance that

connects the power supply source to the device, and

the maximum current drawn by the device in the

application. In other words, select the tank capacitor so

that it meets the acceptable voltage sag at the device.

Typical values range from 4.7 µF to 47 µF.

2.3 CPU Logic Filter Capacitor

Connection (V

CAP)

A low-ESR (< 5 Ohms) capacitor is required on the

VCAP pin, which is used to stabilize the voltage

regulator output voltage. The V

CAP pin must not be

connected to VDD, and must have a capacitor between

4.7 µF and 10 µF, preferably surface mount connected

within one-eights inch of the V

CAP pin connected to

ground. The type can be ceramic or tantalum. Refer to

Section 31.0 “Electrical Characteristics” for

additional information.

The placement of this capacitor should be close to the

CAP. It is recommended that the trace length not

exceed one-quarter inch (6 mm). Refer to Section 28.2

“On-Chip Voltage Regulator” for details.

2.4 Master Clear (MCLR) Pin

The MCLR pin provides for two specific device

functions:

• Device Reset

• Device programming and debugging

During device programming and debugging, the

resistance and capacitance that can be added to the

pin must be considered. Device programmers and

debuggers drive the MCLR

pin. Consequently,

specific voltage levels (V

IH and VIL) and fast signal

transitions must not be adversely affected. Therefore,

specific values of R and C will need to be adjusted

based on the application and PCB requirements.

For example, as shown in Figure 2-2, it is

recommended that the capacitor C be isolated from the

MCLR

pin during programming and debugging

operations.

Place the components shown in Figure 2-2 within

one-quarter inch (6 mm) from the MCLR

pin.

FIGURE 2-2: EXAMPLE OF MCLR PIN

CONNECTIONS

dsPIC33F

VDD

VSS

VDD

VSS

VDD

AVDD

AVSS

VDD

VSS

0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

MCLR

0.1 µF

Ceramic

VCAP

(1)

10 µF

Tantalum

Note 1: As an option, instead of a hard-wired connection, an

inductor (L1) can be substituted between V

DD and

DD to improve ADC noise rejection. The inductor

impedance should be less than 1Ω and the inductor

capacity greater than 10 mA.

Where:

FCNV

--------------=

2π LC()

-----------------------=

2πfC()

---------------------

⎝⎠

⎛⎞

(i.e., ADC conversion rate/2)

Note 1: R ≤ 10 kΩ is recommended. A suggested

starting value is 10 kΩ. Ensure that the MCLR

pin VIH and VIL specifications are met.

2: R1 ≤ 470Ω will limit any current flowing into

MCLR

from the external capacitor C, in the

event of MCLR

pin breakdown due to

Electrostatic Discharge (ESD) or Electrical

Overstress (EOS). Ensure that the MCLR

IH and VIL specifications are met.

(2)

(1)

VDD

MCLR

dsPIC33F

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04

2.5 ICSP Pins

The PGECx and PGEDx pins are used for In-Circuit

Serial Programming™ (ICSP™) and debugging

purposes. It is recommended to keep the trace length

between the ICSP connector and the ICSP pins on the

device as short as possible. If the ICSP connector is

expected to experience an ESD event, a series resistor

is recommended with a value in the range of a few tens

of Ohms, not to exceed 100 Ohms.

Pull-up resistors, series diodes, and capacitors on the

PGECx and PGEDx pins are not recommended as they

will interfere with the programmer/debugger

communications to the device. If such discrete

components are an application requirement, they

should be removed from the circuit during

programming and debugging. Alternatively, refer to the

AC/DC characteristics and timing requirements

information in the respective device Flash

programming specification for information on

capacitive loading limits and pin input voltage high (V

IH)

and input low (V

IL) requirements.

Ensure that the “Communication Channel Select” (i.e.,

PGECx/PGEDx pins) programmed into the device

matches the physical connections for the ICSP to

MPLAB

ICD 3 or MPLAB REAL ICE™.

For more information on ICD 3 and REAL ICE

connection requirements, refer to the following

documents that are available on the Microchip web

site.

• “Using MPLAB

ICD 3” (poster) (DS51765)

• “MPLAB

ICD 3 Design Advisory” (DS51764)

• “MPLAB

REAL ICE™ In-Circuit Emulator User’s

Guide” (DS51616)

• “Using MPLAB

REAL ICE™” (poster) (DS51749)

2.6 External Oscillator Pins

Many DSCs have options for at least two oscillators: a

high-frequency primary oscillator and a low-frequency

secondary oscillator (refer to Section 9.0 “Oscillator

Configuration” for details).

The oscillator circuit should be placed on the same

side of the board as the device. Also, place the

oscillator circuit close to the respective oscillator pins,

not exceeding one-half inch (12 mm) distance

between them. The load capacitors should be placed

next to the oscillator itself, on the same side of the

board. Use a grounded copper pour around the

oscillator circuit to isolate them from surrounding

circuits. The grounded copper pour should be routed

directly to the MCU ground. Do not run any signal

traces or power traces inside the ground pour. Also, if

using a two-sided board, avoid any traces on the

other side of the board where the crystal is placed. A

suggested layout is shown in Figure 2-3.

Recommendations for crystals and ceramic

resonators are provided in Table 2-1 and Table 2-2,

respectively.

FIGURE 2-3: SUGGESTED PLACEMENT

OF THE OSCILLATOR

CIRCUIT

TABLE 2-1: CRYSTAL RECOMMENDATIONS

Main Oscillator

Guard Ring

Guard Trace

Secondary

Oscillator

Part

Number

Vendor Freq.

Load

Cap.

Package

Case

Frequency

Tolerance

Mounting

Type

Operating

Temperature

ECS-40-20-4DN ECS Inc. 4 MHz 20 pF HC49/US ±30 ppm TH -40°C to +85°C

ECS-80-18-4DN ECS Inc. 8 MHz 18 pF HC49/US ±30 ppm TH -40°C to +85°C

ECS-100-18-4-DN ECS Inc. 10 MHz 18 pF HC49/US ±30 ppm TH -40°C to +85°C

ECS-200-20-4DN ECS Inc. 20 MHz 20 pF HC49/US ±30 ppm TH -40°C to +85°C

ECS-40-20-5G3XDS-TR ECS Inc. 4 MHz 20 pF HC49/US ±30 ppm SM -40°C to +125°C

ECS-80-20-5G3XDS-TR ECS Inc. 8 MHz 20 pF HC49/US ±30 ppm SM -40°C to +125°C

ECS-100-20-5G3XDS-TR ECS Inc. 10 MHz 20 pF HC49/US ±30 ppm SM -40°C to +125°C

ECS-200-20-5G3XDS-TR ECS Inc. 20 MHz 20 pF HC49/US ±30 ppm SM -40°C to 125°C

NX3225SA 20MHZ AT-W NDK 20 MHz 8 pF 3.2 mm x 2.5 mm ±50 ppm SM -40°C to 125°C

Legend: TH = Through Hole SM = Surface Mount

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04

TABLE 2-2: RESONATOR RECOMMENDATIONS

2.7 Oscillator Value Conditions on

Device Start-up

If the PLL of the target device is enabled and

configured for the device start-up oscillator, the

maximum oscillator source frequency must be limited

to less than or equal to 8 MHz for start-up with PLL

enabled to comply with device PLL start-up conditions.

This means that if the external oscillator frequency is

outside this range, the application must start-up in the

FRC mode first. The default PLL settings after a POR

with an oscillator frequency outside this range will

violate the device operating speed.

Once the device powers up, the application firmware

can initialize the PLL SFRs, CLKDIV and PLLDBF to a

suitable value, and then perform a clock switch to the

Oscillator + PLL clock source. Note that clock switching

must be enabled in the device Configuration word.

2.8 Configuration of Analog and

Digital Pins During ICSP

Operations

If MPLAB ICD 3 or REAL ICE is selected as a debug-

ger, it automatically initializes all of the analog-to-digital

input pins (ANx) as “digital” pins, by setting all bits in the

AD1PCFGL register.

The bits in this register that correspond to the

analog-to-digital pins that are initialized by MPLAB ICD

3 or REAL ICE, must not be cleared by the user

application firmware; otherwise, communication errors

will result between the debugger and the device.

If your application needs to use certain analog-to-digital

pins as analog input pins during the debug session, the

user application must clear the corresponding bits in

the AD1PCFGL register during initialization of the ADC

module.

When MPLAB ICD 3 or REAL ICE is used as a

programmer, the user application firmware must

correctly configure the AD1PCFGL register. Automatic

initialization of this register is only done during

debugger operation. Failure to correctly configure the

recognized as analog input pins, resulting in the port

value being read as a logic ‘0’, which may affect user

application functionality.

2.9 Unused I/Os

Unused I/O pins should be configured as outputs and

driven to a logic-low state.

Alternatively, connect a 1k to 10k resistor between V

and the unused pin.

Part

Number

Vendor Freq.

Load

Cap.

Package

Case

Frequency

Tolerance

Mounting

Type

Operating

Temperature

FCR4.0M5T TDK Corp. 4 MHz N/A Radial ±0.5% TH -40°C to +85°C

FCR8.0M5 TDK Corp. 8 MHz N/A Radial ±0.5% TH -40°C to +85°C

HWZT-10.00MD TDK Corp. 10 MHz N/A Radial ±0.5% TH -40°C to +85°C

HWZT-20.00MD TDK Corp. 20 MHz N/A Radial ±0.5% TH -40°C to +85°C

Legend: TH = Through Hole

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