PECL DC CHARACTERISTICS
TTL DC CHARACTERISTICS
AC CHARACTERISTICS
SN65ELT21
www.ti.com
....................................................................................................................................................................................................... SLLS923 – JUNE 2009
At V
CC
= 5.0 V, GND = 0.0 V (unless otherwise noted)
(1) (2)
T
A
= – 40 ° C T
A
= 25 ° C T
A
= 85 ° C
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
V
IH
High-level input voltage, 3835 4120 3835 4120 3835 4120 mV
single-ended
V
IL
Low-leveI input voltage, 3190 3525 3190 3525 3190 3525 mV
single-ended
V
BB
Output reference voltage 3.62 3.69 3.74 3.62 3.69 3.74 3.62 3.69 3.74 V
V
IHCMR
High-level input voltage, See
(3)
2.2 5.0 2.2 5.0 2.2 5.0 V
common-mode range,
differential
I
IH
High-level input current 150 150 150 µ A
I
IL
Low-level input current 0.5 0.5 0.5 µ A
(1) The device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board
with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
(2) Input parameters vary 1:1 with V
CC
. V
CC
can vary +0.7 V / – 0.8 V.
(3) V
IHCMR(min)
varies 1:1 with GND, V
IHCMR(max)
varies 1:1 with V
CC
.
At V
CC
= 4.2 V to 5.7 V, T
A
= – 40 ° C to 85 ° C (unless otherwise noted)
(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
CCH
Power supply current 20 mA
I
CCL
Power supply current 20 mA
V
OH
High-level output voltage I
OH
= – 3.0 mA 2.4 See
(2)
V
V
OL
Low-level output voltage I
OL
= 24 mA 0.5 V
I
OS
Output short circuit current – 150 – 60 mA
(1) The device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board
with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
(2) V
OH(max) level
is V
CC
– 0.7.
At V
CC
= 4.2 V to 5.7 V, GND = 0.0 V (unless otherwise noted)
(1) (2)
T
A
= – 40 ° C T
A
= 25 ° C T
A
= 85 ° C
TEST
PARAMETER UNIT
CONDITIONS
MIN TYP MAX MIN TYP MAX MIN TYP MAX
f
MAX
Maximum switching At Vol < 0.5V 200 200 200 MHz
frequency (See Figure 4)
t
PLH
/t
PHL
Propagation delay times At 1.5 V 2 4.5 2 4.5 2 4.5 ns
t
JITTER
Random clock jitter (RMS) 5 20 5 20 5 20 ps
V
PP
Input swing See
(3)
200 1000 200 1000 200 1000 mV
t
r
/t
f
Output rise/fall times Q (10% – 90%) 750 780 910 ps
(1) The device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
(2) R
L
= 500 Ω to GND and C
L
= 20 pF to GND. See Figure 1 .
(3) V
PP(min)
is minimum input swing for which ac parameters are assured.
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