© Semiconductor Components Industries, LLC, 2008
October, 2008 − Rev. 3
1 Publication Order Number:
ESD7L5.0D/D
ESD7L5.0DT5G
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra−Low
Capacitance
The ESD7L5.0DT5G is designed to protect voltage sensitive
components from damage due to ESD in applications that require ultra
low capacitance to preserve signal integrity. Excellent clamping
capability, low leakage and fast response time are combined with an
ultra low diode capacitance of 0.5 pF to provide best in class
protection from IC damage due to ESD. The ultra small SOT−723
package is ideal for designs where board space is at a premium. The
ESD7L5.0DT5G can be used to protect two uni−directional lines or
one bi−directional line. When used to protect one bi−directional line,
the effective capacitance is 0.25 pF. Because of its low capacitance, it
is well suited for protecting high frequency signal lines such as
USB2.0 high speed and antenna line applications.
Specification Features:
• Low Capacitance 0.5 pF Typical
• Low Clamping Voltage
• Small Body Outline Dimensions:
0.047” x 0.047” (1.20 mm x 1.20 mm)
• Low Body Height: 0.020″ (0.5 mm)
• Stand−off Voltage: 5 V
• Low Leakage
• Response Time is Typically < 1.0 ns
• IEC61000−4−2 Level 4 ESD Protection
• This is a Pb−Free Device
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Symbol Value Unit
IEC 61000−4−2 (ESD) Contact ±10 kV
Total Power Dissipation on FR−5 Board
(Note 1) @ T
A
= 25°C
°P
D
° 150 mW
Storage Temperature Range T
stg
−55 to +150 °C
Junction Temperature Range T
J
−55 to +125 °C
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
Device Package Shipping
†
ORDERING INFORMATION
ESD7L5.0DT5G SOT−723
(Pb−Free)
8000/Tape & Reel
MARKING DIAGRAM
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
DEVICE MARKING INFORMATION
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
http://onsemi.com
SOT−723
CASE 631AA
XX = Specific Device Code
M = Date Code
XX M
1
1
3
2
PIN 1. CATHODE
2. CATHODE
3. ANODE