硅晶圆加工：制造集成电路的关键步骤

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"Silicon Wafer Processing - A Manufacturing Overview for Integrated Circuits" 在IT行业中，硅晶圆处理（wafer process）是集成电路制造的核心步骤。这个过程涉及到将空白的硅晶圆转化为承载复杂电路的半导体器件。这篇由Dr. Seth P. Bates编写的资料旨在为制造系统的学生提供一个关于这一过程的全面概述，特别是使用Applied Materials、Lam Research等公司设备的工艺流程。一、介绍硅晶圆处理始于对硅材料的准备，这包括选择高质量的硅源，因为硅是半导体的基础材料。处理过程严谨且精确，每一环节都至关重要，因为任何微小的缺陷都可能影响最终产品的性能和可靠性。二、硅晶圆媒体的准备 1. 晶体生长：首先，通过Czochralski工艺（CZ）从高纯度多晶硅中拉出单晶硅棒。这个过程控制晶体的晶体结构和方向，影响后续的加工和器件性能。 2. 硅片切割：晶棒被切割成薄薄的硅片，即晶圆。切割方法通常采用线锯或激光，确保切片的平整度和边缘质量。 3. 厚度筛选：切割后的晶圆需进行厚度筛选，确保所有晶圆的厚度在允许的公差范围内，以保证一致性。 4. 研磨与蚀刻：晶圆表面可能不平，通过研磨（lapping）和化学机械抛光（CMP）去除不平整，同时去除切割产生的损伤层。 5. 平整度检查与厚度测量：确保晶圆的平面度，这对后续的光刻工艺至关重要。 6. 终检：对晶圆的尺寸和电学特性进行最终的检测，保证其满足制造集成电路的要求。三、硅晶圆处理步骤 1. 集成电路制造：在这个阶段，电路图案被转移到硅片上。首先，晶圆会被清洗以去除可能的杂质。 2. 扩散：通过高温过程将 dopant（掺杂剂）引入硅晶圆，改变其导电性，创建P型和N型半导体区域。 3. 覆盖层和烘烤：在晶圆上涂覆光敏材料（光阻），然后在烘箱中固化，形成抗蚀剂层。 4. 对准：利用精密的光学设备将电路图案对准到晶圆上。 5. 曝光：将晶圆暴露于特定波长的光下，使光阻材料在图案对应区域发生变化。 6. 开发：通过化学溶液去除曝光后的光阻，留下暴露硅表面的图案。这些步骤构成了半导体制造的基本流程，每一个步骤都是一个独立的模块，可以通过互联网访问学习。了解并掌握这些工艺对于理解现代电子设备的制造过程至关重要，也是IT行业中的核心知识。

Seth Bates SJSU / Applied Materials / IISME-ETP page 2

Introduction

The processing of Silicon wafers to produce integrated circuits involves a good deal of chemistry and

physics. In order to alter the surface conditions and properties, it is necessary to use both inert and toxic

chemicals, specific and unusual conditions, and to manipulate those conditions with both plasma-state

elements and with RF (Radio Frequency) energies. Starting with thin, round wafers of silicon crystal, in

diameters of 150, 200, and 300mm, the processes described here build up a succession of layers of

materials and geometries to produce thousands of electronic devices at tiny sizes, which together

function as integrated circuits (ICs). The devices which now occupy the surface of a one-inch square IC

would have occupied the better part of a medium-sized room 20 years ago, when all these devices

(transistors, resistors, capacitors, and so on) were only available as discreet units.

The conditions under which these processes can work to successfully transform the silicon into ICs

require an absolute absence of contaminants. Thus, the process chambers normally operate under

vacuum, with elemental, molecular, and other particulate contaminants rigorously controlled. In order to

understand these processes, then, we will begin the study of semiconductor processing with an overview

of vacuum systems and theory, of gas systems and theory, as applied specifically to these tools, and of

clean room processes and procedures

The semiconductor industry reflects and serves an extraordinary revolution in both materials science and

in data processing and storage. As recently as 1980, most individuals had no idea that computers would

ever impact their personal lives. Today, many families own one or two computers, and use many other

computers and dedicated processor systems in their appliances and automobiles. The intrusion of

electronics and computer technology into our lives and the devices we use daily is growing at an

exponential rate, and Moore’s Law still applied in the computer world. This is one of the few markets in

which, as time passes, the power and capacity of the products grows steadily, while the cost of that

power and capacity drops.

Today, only twenty years later, we are continually pushing the envelope of capabilities of the data

processing and storage systems that are now in the mainstream. Ingenuity and creativity, along with

great strides in quality control, process control, and worker productivity, are leading daily to new ideas

about how to further reduce device size and data density. On the horizon are visions of biochemically-

based devices which will be far smaller, work faster, and generate less heat than current devices. It is

worth spending some time imagining where this evolving technology will take us, and the society we

live in.

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