emWin在嵌入式人机交互中的应用与实战教程

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emWin是一款强大的嵌入式图形用户界面(GUI)库,特别适用于资源受限的嵌入式系统。它集成了丰富的功能,包括2D图形绘制(如圆形、椭圆、多边形等)、位图文件显示(BMP、JPEG、GIF和PNG)、文本显示(支持多国语言),以及用户输入处理(如键盘、鼠标和触摸屏)。这些特性使得emWin能够解决人机交互设计中的复杂问题,且内存占用相对较低,官方数据显示一个基本示例(显示“HelloWorld”)只需60KB的ROM和7KB的RAM,对于许多嵌入式平台来说是可行的。 emWin不仅适用于单任务系统,还能在多任务环境中运行,因此非常适合嵌入式系统的开发,特别是在设备资源有限、需要简洁高效的界面设计时。它提供了一系列图形控件,如菜单、窗口、按钮和复选框等,这些控件使开发者能够快速构建类似于Windows系统的用户界面。 在《emWin实战指南》中,作者WildFireTeam@野火科技介绍了如何在野火STM32ISO/ISO-MINI开发板上使用emWin,该教程基于STM32系统,并使用了StemWinGUI库,这是一个对emWin进行了扩展的库。教程详细涵盖了emWin的基础知识、获取方法、软件架构、Windows模拟环境的搭建、工程文件结构、HelloemWin示例、以及如何利用《emWin用户手册》进行学习。 此外,教程还涉及到了emWin在其他硬件平台和软件系统上的应用,比如ucGUI和uCOS-II移植,以及与其他模块如GSM、GPS的集成。整个教程旨在帮助开发者在实际项目中熟练掌握emWin,实现高效、美观的嵌入式GUI设计,鼓励开源共享,共同推动技术进步。 通过阅读和实践《emWin实战指南》,开发者将能够更好地理解和运用这款强大的工具,提升嵌入式系统的用户体验,同时也能适应不断变化的开发需求。
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1. INTRODUCTION............................................................................................................... 46 1.1. A THIRD GENERATION I/O INTERCONNECT ................................................................... 46 1.2. PCI EXPRESS LINK......................................................................................................... 49 1.3. PCI EXPRESS FABRIC TOPOLOGY .................................................................................. 50 1.3.1. Root Complex........................................................................................................ 50 1.3.2. Endpoints .............................................................................................................. 51 1.3.3. Switch .................................................................................................................... 54 1.3.4. Root Complex Event Collector .............................................................................. 55 1.3.5. PCI Express to PCI/PCI-X Bridge........................................................................ 55 1.4. PCI EXPRESS FABRIC TOPOLOGY CONFIGURATION ....................................................... 55 1.5. PCI EXPRESS LAYERING OVERVIEW.............................................................................. 56 1.5.1. Transaction Layer ................................................................................................. 57 1.5.2. Data Link Layer .................................................................................................... 57 1.5.3. Physical Layer ...................................................................................................... 58 1.5.4. Layer Functions and Services............................................................................... 58 TRANSACTION LAYER SPECIFICATION ................................................................. 62 2.1. TRANSACTION LAYER OVERVIEW.................................................................................. 62 2.1.1. Address Spaces, Transaction Types, and Usage................................................... 63 2.1.2. Packet Format Overview ...................................................................................... 65 2.2. TRANSACTION LAYER PROTOCOL - PACKET DEFINITION............................................... 67 2.2.1. Common Packet Header Fields ............................................................................ 67 2.2.2. TLPs with Data Payloads - Rules ......................................................................... 70 2.2.3. TLP Digest Rules .................................................................................................. 74 2.2.4. Routing and Addressing Rules .............................................................................. 74 2.2.5. First/Last DW Byte Enables Rules........................................................................ 78 2.2.6. Transaction Descriptor ......................................................................................... 81 2.2.7. Memory, I/O, and Configuration Request Rules................................................... 87 2.2.8. Message Request Rules ......................................................................................... 94 2.2.9. Completion Rules ................................................................................................ 115 2.2.10. TLP Prefix Rules ................................................................................................. 118 2.3. HANDLING OF RECEIVED TLPS.................................................................................... 123 2.3.1. Request Handling Rules...................................................................................... 126 2.3.2. Completion Handling Rules................................................................................ 138 2.4. TRANSACTION ORDERING ............................................................................................ 142 2.4.1. Transaction Ordering Rules ............................................................................... 142 ......