SD 3.01 物理层简化规范：SD/SDIO/SDHC开发者的权威指南

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"《SD Specifications Part 1：物理层简化规格版本3.01最终版（100518）》是一份由SD Group（包括松下、SanDisk和东芝公司）以及SD卡协会共同编撰的文档，于2010年5月18日发布。这份技术规范主要针对SD 3.0标准，适用于SD/SDIO/SDHC等存储设备的软硬件开发者。它详细规定了SD卡的物理层技术细节，旨在提供一个简化易懂的开发指南，便于工程师进行产品设计和实现。修订历史表明，该规格经历了多个版本的发展。最初的1.10版在2006年4月发布，随后的2.00版在同年9月推出，直至3.01版在2010年5月进行了更新。这个版本的更新可能包含了对先前版本（如1.0和1.01）的集成，并且强调了如果采用该规格，相关成员必须遵循SD-3C, LLC的知识产权政策，确保对1.0或1.01版本SD规范中涉及的部分获取必要的许可，以便合法使用这些部分的技术。此规格的重点在于物理层，这是SD卡功能的基础，涉及到信号传输、接口规范、电气特性、数据传输速率等方面。它详细描述了卡片与读卡器之间的通信协议，包括数据传输模式、时序、电源管理以及错误检测和纠正机制。这对于保证设备间的兼容性和互操作性至关重要，是开发SD卡产品时不可或缺的技术参考。对于SD 3.0的开发者来说，理解并遵循这份简化规格，可以确保他们的产品符合行业标准，提高产品的市场接受度和稳定性。此外，随着技术的不断进步，后续的3.01版可能还涵盖了新的功能特性、性能提升以及对现有问题的改进，因此对于保持与最新技术同步的开发者而言，这份文档是至关重要的学习资料和工作指南。"

Physical Layer Simplified Specification Version 3.01

• Protocol attributes of the communication channel:

SD Memory Card Communication Channel

Six-wire communication channel

(clock, command, 4 data lines)

Error-protected data transfer

Single or Multiple block oriented data transfer

• SD Memory Card Form-factor

There are three Part 1 mechanical addenda as follows:

Standard Size SD Memory Card: Specified in "Part 1 Standard Size SD Card Addendum"

miniSD Memory Card: Specified in "Part 1 miniSD Card Addendum"

microSD Memory Card: Specified in "Part 1 microSD Card Addendum"

• Standard Size SD Memory Card thickness is defined as both 2.1 mm (normal) and 1.4 mm (Thin

SD Memory Card).

Physical Layer Simplified Specification Version 3.01

3. SD Memory Card System Concept

Description here is a blank for the Simplified Specification.

3.1 Read-Write Property

In terms of read-write property, two types of SD Memory Cards are defined:

• Read/Write (RW) cards (Flash, One Time Programmable - OTP, Multiple Time Programmable -

MTP). These cards are typically sold as blank (empty) media and are used for mass data storage,

end user video, audio or digital image recording

• Read Only Memory (ROM) cards. These cards are manufactured with fixed data content. They are

typically used as a distribution media for software, audio, video etc.

3.2 Supply Voltage

In terms of operating supply voltage, one type of SD Memory Cards is defined:

• High Voltage SD Memory Cards that can operate within the voltage range of 2.7-3.6 V.

3.3 Card Capacity

3.3.1 User Area and Protected Area

SD Memory Card has two accessible independent areas: User Area and Protected Area. User Area is

main memory area and Protected Area can be accessed by the authentication defined by the Part 3

Security Specification. Card Capacity means the sum of User Area Capacity and Protected Area

Capacity.

3.3.2 Card Capacity Classification

In terms of card capacity, three types of SD Memory Cards are defined:

• Standard Capacity SD Memory Card (SDSC) supports capacity up to and including 2 G bytes (2

bytes). All versions of the Physical Layer Specifications define the Standard Capacity SD Memory

Card.

• High Capacity SD Memory Card (SDHC) supports capacity more than 2 G bytes (2

bytes) up to 32

G bytes and is defined from the Physical Layer Specification Version 2.00.

• Extended Capacity SD Memory Card (SDXC) supports more than 32 G bytes (2

bytes) up to 2TB.

Only hosts that are compliant to the Physical Layer Specification Version 2.00 or later and the File

System Specification Ver2.00 or higher can access High Capacity SD Memory Cards and Extended

Capacity SD Memory Cards. Other hosts fail to initialize High Capacity SD Memory Cards and

Extended Capacity SD Memory Cards.

Only hosts that are compliant to the Physical Layer Specification Version 3.00 or higher and the File

System Specification Ver3.00 or later (exFAT supported) can access Extended Capacity SD Memory

Note:

1. The Part 1 Physical Layer Specification Version 3.00 and Part 2 File System Specification Version

3.00 allow Standard Capacity SD Memory Cards to have capacity up to and including 2 GB, High

Capacity SD Memory Cards to have capacity up to and including 32 GB and Extended Capacity

SD Memory Card to have capacity up to 2 TB.

2. Hosts that can access (read and/or write) SD Memory Cards with a capacity greater than 2 GB

and up to and including 32 GB, shall also be able to access SD Memory Cards with a capacity of

2 GB or less.

3. Hosts that can access (read and/or write) SD Memory Cards with a capacity greater than 32 GB

and up to 2 TB, shall also be able to access SD Memory Cards with a capacity of 32 GB or less.

Physical Layer Simplified Specification Version 3.01

3.6 Bus Protocol

3.6.1 SD Bus

Communication over the SD bus is based on command and data bit streams that are initiated by a start

bit and terminated by a stop bit.

• Command: a command is a token that starts an operation. A command is sent from the host either

to a single card (addressed command) or to all connected cards (broadcast command). A command

is transferred serially on the CMD line.

• Response: a response is a token that is sent from an addressed card, or (synchronously) from all

connected cards, to the host as an answer to a previously received command. A response is

transferred serially on the CMD line.

• Data: data can be transferred from the card to the host or vice versa. Data is transferred via the

data lines.

Figure 3-1: "no response" and "no data" Operations

Card addressing is implemented using a session address, assigned to the card during the initialization

phase. The structure of commands, responses and data blocks is described in Chapter 4. The basic

transaction on the SD bus is the command/response transaction (refer to Figure 3-1). This type of bus

transaction transfers their information directly within the command or response structure. In addition,

some operations have a data token.

Data transfers to/from the SD Memory Card are done in blocks. Data blocks are always succeeded by

CRC bits. Single and multiple block operations are defined. Note that the Multiple Block operation mode

is better for faster write operation. A multiple block transmission is terminated when a stop command

follows on the CMD line. Data transfer can be configured by the host to use single or multiple data lines.

command response

block read operation

data stop operation

CMD

DAT

from

host

to card

stop command

stops data transfer

data from card

to host

from

card

to host

data block crc

data block crc data block crc

multiple block read operation

Figure 3-2: (Multiple) Block Read Operation

The block write operation uses a simple busy signaling of the write operation duration on the DAT0 data

line (see Figure 3-3) regardless of the number of data lines used for transferring the data.

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SD 3.01 物理层简化规范：SD/SDIO/SDHC开发者的权威指南

SD Memory Card Specifications(完整版)

SD协议中文版

PCIE 3.0 Spec

part1_physical_layer_simplified_specification_ver6.00

physical layer simplified specification

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