Xilinx DDR3 7Series FPGA内存接口用户指南

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"DDR3用户指南，Xilinx DDR3的开发手册，是开发DDR3内存系统不可或缺的参考资料。" 本文档是Xilinx公司针对其7系列FPGA中的DDR3内存接口解决方案提供的用户指南，旨在帮助开发者理解和实现DDR3内存系统的设计。DDR3（Double Data Rate 3）是一种高速同步动态随机存取内存（SDRAM），相较于前一代DDR2，它提供了更高的数据传输速率和更低的功耗。在7系列FPGAs中，Xilinx提供了一系列的内存接口解决方案，包括物理层（PHY）、控制器逻辑和配置工具，以支持DDR3内存模块的高效集成。这些解决方案考虑了时序、信号完整性、电源管理以及兼容性等多个方面，确保在FPGA中实现稳定可靠的DDR3接口。用户指南的内容可能包括以下关键知识点： 1. **DDR3内存规范**：介绍DDR3内存的基本工作原理、时序特性、数据速率、功耗规范等，这些都是设计DDR3接口的基础。 2. **FPGA中的DDR3控制器**：详述如何在FPGA内部实现DDR3控制器，包括地址和命令的生成、读写操作的控制逻辑、数据包的处理等。 3. **PHY设计**：讨论物理层接口的设计，包括信号调理、差分传输、时钟恢复、眼图分析等，确保信号质量和数据传输的准确性。 4. **时序分析与约束**：阐述如何设置正确的时序约束，确保DDR3内存与FPGA之间的数据同步，避免出现数据丢失或错误。 5. **电源管理**：讲解DDR3内存的电源需求，以及如何在FPGA设计中考虑电源的分配和稳定性，降低功耗。 6. **IP核集成**：介绍Xilinx提供的DDR3 IP核，包括如何配置和集成到设计中，以及如何利用IP核的自动生成工具简化设计流程。 7. **测试与调试**：提供测试策略和调试工具的使用方法，帮助开发者在硬件平台上验证DDR3内存系统的正确性和性能。 8. **故障排查与问题解决**：列出常见的设计问题和解决方法，帮助开发者快速定位和修复设计中的错误。 9. **合规性与兼容性**：探讨如何确保设计符合DDR3标准，并与其他设备和系统组件兼容。 10. **安全与可靠性**：讨论在高可靠性应用中，如何增强DDR3内存系统的稳定性和安全性。这份用户手册对于任何需要在Xilinx 7系列FPGA中实现DDR3内存接口的开发者来说，都是一个宝贵的资源，它涵盖了从理论基础到实践操作的全方位指导。通过深入学习和理解，开发者可以有效地构建高性能、低功耗的DDR3内存系统。

16 www.xilinx.com 7 Series FPGAs Memory Interface Solutions

UG586 July 25, 2012

Chapter 1: DDR3 and DDR2 SDRAM Memory Interface Solution

Creating 7 Series FPGA DDR3 Memory Controller Block Design

Memory Selection

This page displays all memory types that are supported by the selected FPGA family.

1. Select the DDR3 SDRAM controller type.

2. Click Next to display the Controller Options page (Figure 1-10).

X-Ref Target - Figure 1-10

Figure 1-10: Memory Type and Controller Selection

UG586_c1_11_120311

18 www.xilinx.com 7 Series FPGAs Memory Interface Solutions

UG586 July 25, 2012

Chapter 1: DDR3 and DDR2 SDRAM Memory Interface Solution

If the design has multiple controllers, the controller options page is repeated for each of the

controllers. This page is partitioned into a maximum of nine sections. The number of

partitions depends on the type of memory selected. The controller options page also

contains these pull-down menus to modify different features of the design:

• Frequency: This feature indicates the operating frequency for all the controllers. The

frequency block is limited by factors such as the selected FPGA and device speed

grade. In the EDK flow, an extra check box (selected by default) allows the user to

specify that the frequency information should be calculated automatically from EDK.

• Input Clock Period: The desired input clock period is selected from the list. These

values are determined by the memory clock period chosen and the allowable limits of

the parameters. See Design Guidelines, page 129 for more information on the PLL

parameter limits.

• PHY to Controller Clock Ratio: This feature determines the ratio of the physical layer

(memory) clock frequency to the controller and user interface clock frequency. The 2:1

ratio lowers the maximum memory interface frequency due to fabric timing

limitations. The user interface data bus width of the 2:1 ratio is 4 times the width of

the physical memory interface width, while the bus width of the 4:1 ratio is 8 times the

physical memory interface width. The 2:1 ratio has lower latency. The 4:1 ratio is

necessary for the highest data rates.

• Vccaux_io: Vccaux_io is set based on the period/frequency setting. 2.0V is required at

the highest frequency settings in the High Performance column. The MIG tool

automatically selects 2.0V when required. Either 1.8 or 2.0V can be used at lower

frequencies. Groups of banks share the Vccaux_io supply. See the 7 Series FPGAs

SelectIO Resources User Guide [Ref 1] and the 7 Series FPGAs Packaging and Pinout

Specification [Ref 2] for more information.

• Memory Type: This feature selects the type of memory parts used in the design.

• Memory Part: This option selects a memory part for the design. Selections can be

made from the list or a new part can be created.

• Data Width: The data width value can be selected here based on the memory type

selected earlier. The list shows all supported data widths for the selected part. One of

the data widths can be selected. These values are generally multiples of the individual

device data widths. In some cases, the width might not be an exact multiple. For

example, 16 bits is the default data width for x16 components, but 8 bits is also a valid

value.

• Data Mask: This option allocates data mask pins when selected. This option should

be deselected to deallocate data mask pins and increase pin efficiency. This option is

disabled for memory parts that do not support data mask.

• Ordering: This feature allows the memory controller to reorder commands to

improve the memory bus efficiency.

• Memory Details: The bottom of the Controller Options page (Figure 1-11, page 17)

displays the details for the selected memory configuration (Figure 1-12).

1. Select the appropriate frequency. Either use the spin box or enter a valid value using

the keyboard. Values entered are restricted based on the minimum and maximum

frequencies supported.

X-Ref Target - Figure 1-12

Figure 1-12: Memory Details

UG586_c1_20_091410

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