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TMS320C62x™ DSP GENERATION PRODUCT SPECIFICATION GUIDE – FIXED-POINT DSPs
Typical Activity
RAM (Bytes) Cycle Total Internal Power Voltage (V)
Part Number Data Prog McBSP DMA COM MHz (ns) MIPS (W) (Full Device Speed) Core I/O Packaging 1 KU ($U.S.)
+
TMS320C6211BGFN167 4K/4K/64K* 2 16
†
HPI/16 167 6 1336 1.0 1.8 3.3 256 BGA, 27 mm 26.93
TMS320C6211BGFN150 4K/4K/64K* 2 16
†
HPI/16 150 6.7 1200 0.9 1.8 3.3 256 BGA, 27 mm 21.54
TMS32C6211BGFNA150
¤
4K/4K/64K* 2 16
†
HPI/16 150 6.7 1200 0.9 1.8 3.3 256 BGA, 27 mm 25.85
TMS320C6205GHK200 64K 64K 2 4 PCI/32 200 5 1600 0.8 1.5 3.3 288 BGA, 16 mm 10.74
TMS320C6205GHKA200
¤
64K 64K 2 4 PCI/32 200 5 1600 0.8 1.5 3.3 288 BGA, 16 mm 12.89
TMS320C6204GLW200 64K 64K 2 4 Exp. Bus/32 200 5 1600 0.8 1.5 3.3 340 BGA, 18 mm 20.92
TMS320C6204GHK200 64K 64K 2 4 Exp. Bus/32 200 5 1600 0.8 1.5 3.3 288 BGA, 16 mm 9.95
TMS320C6204GHKA200
¤
64K 64K 2 4 Exp. Bus/32 200 5 1600 0.8 1.5 3.3 288 BGA, 16 mm 11.94
TMS320C6203BGNZ300 512K 384K 3 4 Exp. Bus/32 300 3.3 2400 1.3 1.5 3.3 352 BGA, 27 mm 71.62
TMS320C6203BGNY300 512K 384K 3 4 Exp. Bus/32 300 3.3 2400 1.3 1.5 3.3 384 BGA, 18 mm 71.62
TMS320C6203BGNZ173 512K 384K 3 4 Exp. Bus/32 250 4 2000 1.1 1.5° 3.3 352 BGA, 27 mm 60.43
TMS320C6203BGNY173 512K 384K 3 4 Exp. Bus/32 250 4 2000 1.1 1.5° 3.3 384 BGA, 18 mm 60.43
TMS32C6203BGNZA250
¤
512K 384K 3 4 Exp. Bus/32 250 4 2000 1.1 1.5 3.3 352 BGA, 27 mm 71.62
TMS320C6202BGNZ300 128K 256K 3 4 Exp. Bus/32 300 3.3 2400 1.0 1.5 3.3 352 BGA, 27 mm 67.14
TMS320C6202BGNY300 128K 256K 3 4 Exp. Bus/32 300 3.3 2400 1.0 1.5 3.3 384 BGA, 18 mm 67.14
TMS320C6202BGNZ250 128K 256K 3 4 Exp. Bus/32 250 4 2000 0.9 1.5 3.3 352 BGA, 27 mm 55.95
TMS320C6202BGNY250 128K 256K 3 4 Exp. Bus/32 250 4 2000 0.9 1.5 3.3 384 BGA, 18 mm 55.95
TMS32C6202BGNZA250
¤
128K 256K 3 4 Exp. Bus/32 250 4 2000 0.9 1.5 3.3 352 BGA, 27 mm 67.14
TMS320C6202GJL250 128K 256K 3 4 Exp. Bus/32 250 4 2000 2.1 1.8 3.3 352 BGA, 27 mm 110.08
TMS320C6202GLS250 128K 256K 3 4 Exp. Bus/32 250 4 2000 2.1 1.8 3.3 384 BGA, 18 mm 110.08
TMS320C6202GJL200 128K 256K 3 4 Exp. Bus/32 200 5 1600 1.7 1.8 3.3 352 BGA, 27 mm 94.03
TMS320C6202GLS200 128K 256K 3 4 Exp. Bus/32 200 5 1600 1.7 1.8 3.3 384 BGA, 18 mm 94.03
TMS320C6202GJLA200
¤
128K 256K 3 4 Exp. Bus/32 200 5 1600 1.7 1.8 3.3 352 BGA, 27 mm 112.84
TMS320C6202GJLA233
¤
128K 256K 3 4 Exp. Bus/32 233 4.3 1864 2.0 1.8 3.3 352 BGA, 27 mm 121.09
TMS320C6201GJC200 64K 64K 2 4 HPI/16 200 5 1600 1.3 1.8 3.3 352 BGA, 35 mm 82.70
TMS320C6201GJL200 64K 64K 2 4 HPI/16 200 5 1600 1.3 1.8 3.3 352 BGA, 27 mm 82.70
TMS320C6201GJCA200
¤
64K 64K 2 4 HPI/16 200 5 1600 1.3 1.8 3.3 352 BGA, 35 mm 99.24
TMS320C6201GJLA200
¤
64K 64K 2 4 HPI/16 200 5 1600 1.3 1.8 3.3 352 BGA, 27 mm 99.24
* The C6211 DSP’s 72 KBytes of cache memory is comprised of 4 KBytes data cache, 4 KBytes program cache and 64 KBytes unified cache memory. New devices are listed in red.
†
Enhanced DMA.
¤
Extended temperature device, –40 to 105°C case temperature operation. ° Device may operate at 300 MHz with 1.7-V core.
+
Prices are quoted per unit in U.S. dollars at 1 KU quantities. Prices represent year 2003 suggested resale pricing. Note: All devices include two timers.
Note: Enhanced plastic and Military DSP versions are available for selected DSPs.
Resources
Tools TMS320C3x™ TMS320C2000™ TMS320C5000™ TMS320C6000™
System Solutions
TMS320C67x™ DSP GENERATION PRODUCT SPECIFICATION GUIDE – FLOATING-POINT DSPs
Typical Activity
RAM (Bytes) Cycle Total Internal Power Voltage (V)
Part Number Data/Prog McBSP DMA COM MHz (ns) MFLOPS (W) (Full Device Speed) Core I/O Packaging 1 KU ($U.S.)
+
TMS320C6713GDP225 4K/4K/256K* 2
#
16° HPI/16 225 4.4 1350 1.2 1.26 3.3 272 BGA, 27 mm 28.99
TMS320C6713GDPA200
†
4K/4K/256K* 2
#
16° HPI/16 200 5 1200 1.2 1.26 3.3 272 BGA, 27 mm 28.99
TMS320C6713PYP200 4K/4K/256K* 2
#
16° HPI/16 200 5 1200 1.0 1.2 3.3 208 TQFP, 28 mm 23.25
TMS320C6713PYPA167
†
4K/4K/256K* 2
#
16° HPI/16 167 6 1000 1.0 1.2 3.3 208 TQFP, 28 mm 23.25
TMS320C6712CGDP150 4K/4K/64K* 2 16° – 150 6.7 900 0.7 1.26 3.3 272 BGA, 27 mm 14.95
TMS320C6712GFN100 4K/4K/64K* 2 16° – 100 10 600 0.8 1.8 3.3 256 BGA, 27 mm 18.06
TMS320C6711CGDP200 4K/4K/64K* 2 16° HPI/16 200 5 1200 0.9 1.26 3.3 272 BGA, 27 mm 21.55
TMS32C6711CGDPA167
†
4K/4K/64K* 2 16° HPI/16 167 6 1000 0.9 1.26 3.3 272 BGA, 27 mm 21.55
TMS320C6711BGFN150 4K/4K/64K* 2 16° HPI/16 150 6.7 900 1.1 1.8 3.3 256 BGA, 27 mm 30.77
TMS32C6711BGFNA100
†
4K/4K/64K* 2 16° HPI/16 100 10 600 1.1 1.8 3.3 256 BGA, 27 mm 25.85
TMS320C6711BGFN100 4K/4K/64K* 2 16° HPI/16 100 10 600 0.8 1.8 3.3 256 BGA, 27 mm 21.54
TMSC6701GJC16719V 64K/64K 2 4 HPI/16 167 6 1000 1.4 1.9 3.3 352 BGA, 35 mm 113.13
TMS320C6701GJC150 64K/64K 2 4 HPI/16 150 6.7 900 1.3 1.8 3.3 352 BGA, 35 mm 78.57
TMS320C6701GJCA120
†
64K/64K 2 4 HPI/16 120 8.3 720 1.3 1.8 3.3 352 BGA, 35 mm 94.28
* Format represents cache memory architecture: [data cache] / [program cache] / [unified cache] New devices are listed in red.
° Enhanced DMA.
†
Extended temperature device, –40 to 105°C case temperature operation. Note: All devices include two timers.
#
The C6713 DSP can be configured to have up to three serial ports in various McASP/McBSP combinations by not utilizing the HPI. Other configurable serial options include I
2
C and
additional GPIO.
+
Prices are quoted per unit in U.S. dollars at 1 KU quantities. Prices represent year 2003 suggested resale pricing.
Note: Enhanced plastic and Military DSP versions are available for selected DSPs.