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1
Diagonal 8.92 mm (Type 1/1.8) CMOS Image Sensor with Square Pixel for Color
Cameras
IMX178LQJ-C
Description
The IMX178LQJ-C is a diagonal 8.92 mm (Type 1/1.8) CMOS active pixel type image sensor with a square pixel
array and 6.44 M effective pixels. This chip operates with analog 2.9 V, digital 1.2 V and interface 1.8 V triple power
supply, and has low power consumption.
High sensitivity, low dark current and no smear are achieved through the adoption of R, G and B primary color
mosaic filters.
This chip features an electronic shutter with variable charge-integration time.
(Applications: Surveillance cameras, FA cameras, Industrial cameras)
Features
◆ CMOS active pixel type dots
◆ Built-in timing adjustment circuit, H/V driver and serial communication circuit
◆ Input frequency
54 MHz or 27 MHz / 74.25 MHz or 37.125 MHz
◆ Number of recommended recording pixels: 3072 (H) × 2048 (V) approx. 6.29M pixels
◆ Readout mode
6M pixels in all-pixel scan mode (3:2)
5M pixels in each format (4:3 / 5:4 QSXGA / 16:9)
Horizontal / Vertical 2 × 2 binning mode, Horizontal / Vertical arbitrary cropping mode
1080p-Full HD readout
720p-HD readout (2 × 2 binning)
Vertical/Horizontal direction-normal/inverted readout
◆ Readout rate
Maximum frame rate in 5M-pixel readout mode: 12 bit 60 frame/s, 14 bit 30 frame/s
Maximum frame rate in 6M-pixel all readout mode: 10 bit 59.94 frame/s, 12 bit 29.97 frame/s
◆ Variable-speed shutter function (resolution 1H units)
◆ 10-bit / 12-bit / 14-bit A/D converter
◆ CDS/PGA function
High light Performance mode : 0 dB to 48 dB (step pitch 0.1 dB)
0 dB to 24 dB:Analog Gain
24.1 dB to 48 dB: Analog Gain + Digital Gain 0.1 dB to 24 dB
Low light Performance mode : 3 dB to 51 dB (step pitch 0.1 dB)
3 dB to 27 dB:Analog Gain
27.1 dB to 51 dB: Analog Gain + Digital Gain 0.1 dB to 24 dB
◆ Supports I/O switching
Low voltage LVDS (150 mVp-p) serial (4 ch / 8 ch / 10 ch switching) DDR output
◆ Recommended exit pupil distance: –30 mm to –∞
* Exmor R is a trademark of Sony Corporation. The Exmor R is a Sony's CMOS image sensor with significantly enhanced imaging
characteristics including sensitivity and low noise by changing fundamental structure of Exmor
TM
pixel adopted column parallel A/D converter
to back-illuminated type.
Sony reserves the right to change products and specifications without prior notice.
This information does not convey any license by any implication or otherwise under any patents or other right.
Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits.
CONFIDENTIAL
HiSilicon Technologies Co., Ltd. only
IMX178LQJ-C
2
Device Structure
◆ CMOS image sensor
◆ Image size, format
Diagonal 8.92 mm (Type 1/1.8) approx. 6.38 M pixels (3:2)
Diagonal 7.83 mm (Type 1/2.0) approx. 5.11 M pixels (4:3)
Diagonal 7.92 mm (Type 1/2.0) approx. 5.32 M pixels (5:4) QSXGA
Diagonal 8.51 mm (Type 1/1.9) approx. 5.39 M pixels (16:9)
◆ Total number of pixels
3096 (H) × 2094 (V) approx. 6.48 M pixels (3:2)
◆ Number of effective pixels
3096 (H) × 2080 (V) approx. 6.44 M pixels (3:2)
2616 (H) × 1976 (V) approx. 5.17 M pixels (4:3)
2584 (H) × 2080 (V) approx. 5.37 M pixels (5:4) QSXGA
3096 (H) × 1760 (V) approx. 5.45 M pixels (16:9)
◆ Number of active pixels
3089 (H) × 2064 (V) approx. 6.38 M pixels (3:2)
2609 (H) × 1960 (V) approx. 5.11 M pixels (4:3)
2577 (H) × 2064 (V) approx. 5.32 M pixels (5:4) QSXGA
3089 (H) × 1744 (V) approx. 5.39 M pixels (16:9)
◆ Number of recommended recording pixels
3072 (H) × 2048 (V) approx. 6.29 M pixels (3:2)
2592 (H) × 1944 (V) approx. 5.04 M pixels (4:3)
2560 (H) × 2048 (V) approx. 5.24 M pixels (5:4) QSXGA
3072 (H) × 1728 (V) approx. 5.31 M pixels (16:9)
◆ Unit cell size
2.4 µm (H) × 2.4 µm (V)
◆ Optical black
Horizontal (H) direction: Front 0 pixel, rear 0 pixel
Vertical (V) direction: Front 14 pixels, rear 0 pixel
◆ Substrate material
Silicon
CONFIDENTIAL
HiSilicon Technologies Co., Ltd. only
IMX178LQJ-C
3
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Remarks
Supply voltage (analog 2.9 V)
AV
DD
–0.3
to
+3.3
V
Supply voltage (interface 1.8 V)
OV
DD
–0.3
to
+3.3
V
Supply voltage (digital 1.2 V)
DV
DD
–0.3
to
+2.0
V
Input voltage
VI
–0.3
to
OV
DD
+ 0.3
V
Not exceed 3.3 V.
Output voltage
VO
–0.3
to
OV
DD
+ 0.3
V
Not exceed 3.3 V.
Operating guarantee temperature
Topr
–30
to
+85
˚C
Storage guarantee temperature
Tstg
–40
to
+85
˚C
Performance guarantee temperature
Tspec
–10
to
+60
˚C
Recommended Operating Conditions
Item
Symbol
Min.
Typ.
Max.
Unit
Supply voltage (analog 2.9 V)
AV
DD
2.80
2.90
3.00
V
Supply voltage (interface 1.8 V)
OV
DD
1.70
1.80
1.90
V
Supply voltage (digital 1.2 V)
DV
DD
1.10
1.20
1.30
V
CONFIDENTIAL
HiSilicon Technologies Co., Ltd. only
IMX178LQJ-C
4
USE RESTRICTION NOTICE
This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the
image sensor products ("Products") set forth in this specifications book. Sony Corporation ("Sony") may,
at any time, modify this Notice which will be available to you in the latest specifications book for the
Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its
own use restriction notice on the Products, such a use restriction notice will additionally apply between
you and the subsidiary or distributor. You should consult a sales representative of the subsidiary or
distributor of Sony on such a use restriction notice when you consider using the Products.
Use Restrictions
The Products are intended for incorporation into such general electronic equipment as office products,
communication products, measurement products, and home electronics products in accordance with
the terms and conditions set forth in this specifications book and otherwise notified by Sony from time
to time.
You should not use the Products for critical applications which may pose a life- or injury-threatening
risk or are highly likely to cause significant property damage in the event of failure of the Products. You
should consult your sales representative beforehand when you consider using the Products for such
critical applications. In addition, you should not use the Products in weapon or military equipment.
Sony disclaims and does not assume any liability and damages arising out of misuse, improper use,
modification, use of the Products for the above-mentioned critical applications, weapon and military
equipment, or any deviation from the requirements set forth in this specifications book.
Design for Safety
Sony is making continuous efforts to further improve the quality and reliability of the Products; however,
failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care
to ensure the safe design of your products such as component redundancy, anti-conflagration features,
and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or
other social damage as a result of such failure.
Export Control
If the Products are controlled items under the export control laws or regulations of various countries,
approval may be required for the export of the Products under the said laws or regulations.
You should be responsible for compliance with the said laws or regulations.
No License Implied
The technical information shown in this specifications book is for your reference purposes only. The
availability of this specifications book shall not be construed as giving any indication that Sony and its
licensors will license any intellectual property rights in such information by any implication or otherwise.
Sony will not assume responsibility for any problems in connection with your use of such information or
for any infringement of third-party rights due to the same. It is therefore your sole legal and financial
responsibility to resolve any such problems and infringement.
Governing Law
This Notice shall be governed by and construed in accordance with the laws of Japan, without reference
to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating
to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the
court of first instance.
Other Applicable Terms and Conditions
The terms and conditions in the Sony additional specifications, which will be made available to you when
you order the Products, shall also be applicable to your use of the Products as well as to this
specifications book. You should review those terms and conditions when you consider purchasing
and/or using the Products.
CONFIDENTIAL
HiSilicon Technologies Co., Ltd. only
IMX178LQJ-C
5
Contents
Description ......................................................................................................................................................................1
Features ..........................................................................................................................................................................1
Device Structure ..............................................................................................................................................................2
Absolute Maximum Ratings ..............................................................................................................................................3
Recommended Operating Conditions ...............................................................................................................................3
USE RESTRICTION NOTICE ..........................................................................................................................................4
Chip Center and Optical Center ........................................................................................................................................7
Pixel Array .......................................................................................................................................................................8
Block Diagram and Pin Configuration ...............................................................................................................................9
Pin Description .............................................................................................................................................................. 11
Electrical Characteristics ................................................................................................................................................ 14
DC Characteristics ..................................................................................................................................................... 14
Power Consumption ................................................................................................................................................... 15
AC Characteristics...................................................................................................................................................... 16
Master clock (INCK) ................................................................................................................................................ 16
XVS / XHS Input Characteristics In Slave Mode (XMASTER = High) ........................................................................ 17
Serial Communication ............................................................................................................................................. 18
DCKPx/DCKMx, DLOPx/DLOMx ............................................................................................................................. 20
I/O Equivalent Circuit Diagram ....................................................................................................................................... 21
Spectral Sensitivity Characteristics ................................................................................................................................. 22
Image Sensor Characteristics ........................................................................................................................................ 23
Zone Definition of Image Sensor Characteristics ......................................................................................................... 23
Image Sensor Characteristics Measurement Method ...................................................................................................... 24
Measurement conditions ............................................................................................................................................. 24
Color coding of this image sensor and readout ............................................................................................................ 24
Definition of standard imaging conditions .................................................................................................................... 24
Measurement method................................................................................................................................................. 25
Setting Registers Using Serial Communication ............................................................................................................... 26
Description of Setting Registers (4-wire) ..................................................................................................................... 26
Register Communication Timing ................................................................................................................................. 27
Register Write and Read ............................................................................................................................................ 28
Description of Setting Registers (I
2
C) .......................................................................................................................... 29
Pin connection of serial communication ....................................................................................................................... 29
Register Communication Timing ................................................................................................................................. 30
Communication Protocol ............................................................................................................................................. 31
I
2
C Register Write and Read ....................................................................................................................................... 32
Register Map ................................................................................................................................................................. 35
Readout Drive Modes .................................................................................................................................................... 44
Sync code .................................................................................................................................................................. 46
Sync Code Output Timing ........................................................................................................................................ 46
Image Data Output Format ......................................................................................................................................... 47
All-Pixel Scan 6.3 M (3:2) ........................................................................................................................................ 47
Window cropping 5.0 M (4:3) ................................................................................................................................... 50
Window cropping 5.2 M (5:4) QSXGA ...................................................................................................................... 53
All-Pixel Scan 1.6 M (3:2) 2 × 2 Binning ................................................................................................................... 56
Window cropping 1.3 M (4:3) 2 × 2 Binning .............................................................................................................. 59
Window cropping 1.3 M (5:4) QSXGA 2 × 2 Binning ................................................................................................. 62
Window cropping 5.3 M (16:9) ................................................................................................................................. 65
HD 1080p ............................................................................................................................................................... 68
HD 720p 2 × 2 Binning ............................................................................................................................................ 71
Arbitrary cropping.................................................................................................................................................... 74
Description of Various Function ...................................................................................................................................... 79
Standby Mode ............................................................................................................................................................ 79
Slave Mode and Master Mode .................................................................................................................................... 80
Gain Adjustment Function ........................................................................................................................................... 81
Black Level Adjustment Function ................................................................................................................................ 82
Vertical Normal Operation and Inverted Drive .............................................................................................................. 82
Horizontal Normal Operation and Inverted Drive .......................................................................................................... 83
CONFIDENTIAL
HiSilicon Technologies Co., Ltd. only
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