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tps54331数据手册
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3.5 to 28-V Input Voltage Range; Typical 1-μA Shutdown Quiescent Current; Programmable UVLO Threshold; Cycle-by-Cycle Current Limit, Frequency Fold cycle-by-cycle current-limit scheme, frequency Back, and Thermal Shutdown Protection
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Efficiency-%
I -LoadCurrent- A
L
V =3.3V
O
V =12V
I
V =18V
I
V =24V
I
V =28V
I
V =5V
I
PH
VIN
GND
BOOT
VSENSE
COMP
SS
C
SS
D1
VIN
EN
C
I
C
BOOT
L
O
C
O
Ren1
R
O2
C
1
C
2
R
3
Ren2
R
O1
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TPS54331
SLVS839F –JULY 2008–REVISED OCTOBER 2014
TPS54331 3-A, 28-V Input, Step Down DC-DC Converter With Eco-mode™
1 Features 3 Description
The TPS54331 device is a 28-V, 3-A non-
1
• 3.5 to 28-V Input Voltage Range
synchronous buck converter that integrates a low
• Adjustable Output Voltage Down to 0.8 V
R
DS(on)
high-side MOSFET. To increase efficiency at
• Integrated 80-m Ω High-Side MOSFET Supports
light loads, a pulse skipping Eco-mode feature is
up to 3-A Continuous Output Current
automatically activated. Furthermore, the 1- μA
shutdown supply-current allows the device to be used
• High Efficiency at Light Loads With a Pulse
in battery-powered applications. Current mode control
Skipping Eco-mode™
with internal slope compensation simplifies the
• Fixed 570 kHz Switching Frequency
external compensation calculations and reduces
• Typical 1-μA Shutdown Quiescent Current
component count while allowing the use of ceramic
output capacitors. A resistor divider programs the
• Adjustable Slow-Start Limits Inrush Currents
hysteresis of the input undervoltage lockout. An
• Programmable UVLO Threshold
overvoltage transient protection circuit limits voltage
• Overvoltage Transient Protection
overshoots during startup and transient conditions. A
cycle-by-cycle current-limit scheme, frequency
• Cycle-by-Cycle Current Limit, Frequency Fold
foldback and thermal shutdown protect the device
Back, and Thermal Shutdown Protection
and the load in the event of an overload condition.
• Available in Easy-to-Use SOIC8 Package or
The TPS54331 device is available in an 8-pin SOIC
Thermally Enhanced SOIC8 PowerPAD™
package and 8-pin SO PowerPAD package that have
Package
been internally optimized to improve thermal
• Supported by WEBENCH
®
Software Tool
performance.
(www.TI.com/WEBENCH)
Device Information
(1)
2 Applications PART NUMBER PACKAGE BODY SIZE (NOM)
SOIC (8)
• Consumer Applications such as Set-Top Boxes,
TPS54331 4.90 mm × 3.90 mm
SO PowerPAD (8)
CPE Equipment, LCD Displays, Peripherals, and
Battery Chargers
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
• Industrial and Car-Audio Power Supplies
• 5-V, 12-V, and 24-V Distributed Power Systems
4 Simplified Schematic
TPS54331 (D Package) Efficiency
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS54331
SLVS839F –JULY 2008–REVISED OCTOBER 2014
www.ti.com
Table of Contents
8.3 Feature Description................................................. 10
1 Features.................................................................. 1
8.4 Device Functional Modes........................................ 13
2 Applications ........................................................... 1
9 Application and Implementation ........................ 14
3 Description ............................................................. 1
9.1 Application Information............................................ 14
4 Simplified Schematic............................................. 1
9.2 Typical Application .................................................. 14
5 Revision History..................................................... 2
10 Power Supply Recommendations ..................... 24
6 Pin Configuration and Functions......................... 4
11 Layout................................................................... 24
7 Specifications......................................................... 5
11.1 Layout Guidelines ................................................. 24
7.1 Absolute Maximum Ratings ..................................... 5
11.2 Layout Example .................................................... 25
7.2 Handling Ratings....................................................... 5
11.3 Electromagnetic Interference (EMI)
7.3 Recommended Operating Conditions....................... 5
Considerations ......................................................... 25
7.4 Thermal Information.................................................. 6
12 Device and Documentation Support ................. 26
7.5 Electrical Characteristics........................................... 6
12.1 Device Support...................................................... 26
7.6 Switching Characteristics.......................................... 7
12.2 Trademarks ........................................................... 26
7.7 Typical Characteristics.............................................. 7
12.3 Electrostatic Discharge Caution............................ 26
8 Detailed Description.............................................. 9
12.4 Glossary ................................................................ 26
8.1 Overview ................................................................... 9
13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram ....................................... 10
Information ........................................................... 26
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (February 2012) to Revision F Page
• Added Handling Ratings table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section. .............................................................. 1
• Updated the inductor current equations for I
L(RMS)
and I
L(PK)
............................................................................................... 16
Changes from Revision D (January 2012) to Revision E Page
• Deleted Feature Item: For SWIFT™ Documentation, See the TI Website at www.ti.com/swift............................................. 1
• Removed Swift™ from the data sheet title............................................................................................................................. 1
Changes from Revision C (March 2010) to Revision D Page
• Added the DDA Package to the Pin Assignments ................................................................................................................. 4
• Added TPS54331 device DDA option to the Ordering Information table ............................................................................... 4
• Changed Figure 21............................................................................................................................................................... 22
• Added Figure 24 ................................................................................................................................................................... 23
Changes from Revision B (October 2008) to Revision C Page
• Changed the ABSOLUTE MAXIMUM RATINGS table, Input Voltage - EN pin max value From: 5V to 6V.......................... 5
• Added a new table to the Description - For additional design needs................................................................................... 14
2 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated
Product Folder Links: TPS54331

TPS54331
www.ti.com
SLVS839F –JULY 2008–REVISED OCTOBER 2014
Changes from Revision A (August 2008) to Revision B Page
• Added 25°C to the Switching frequency test condition in the Elect Char table. .................................................................... 7
• Changed the Switching frequency Max value From: 740kHz To: 684kHz, and the Min value From: 400kHz To:
456kHz ................................................................................................................................................................................... 7
• Added 25°C to the Minimum controllable on time test condition in the Elec Char table........................................................ 7
• Changed the Minimum controllable on time TYP value From: 110ns To: 105ns, and the Max value From: 160ns to
130ns...................................................................................................................................................................................... 7
• Changed Rsense = 1Ω/11 To: 1Ω/12 in Equation 18 legend............................................................................................... 18
• Changed equation From: (V
INmax
- I
Omin
x Rin) To: (V
INmax
- I
Omin
x R
DS(on) min
)...................................................................... 20
Changes from Original (July 2008) to Revision A Page
• Changed the Elect Char - Shutdown supply current test condition From: -40°C to 25°C To: From: -40°C to 85°C and
the MAX value from 10µA to 4µA........................................................................................................................................... 6
Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: TPS54331

1
2
3
4
5
6
7
8
BOOT
VIN
EN
SS
PH
GND
COMP
VSENSE
PowerPAD
(Pin 9)
TM
1
2
3
4
5
6
7
8
BOOT
VIN
EN
SS
PH
GND
COMP
VSENSE
TPS54331
SLVS839F –JULY 2008–REVISED OCTOBER 2014
www.ti.com
6 Pin Configuration and Functions
D Package
DDA Package
8-Pin SOIC
8-Pin SO With PowerPAD™
Top View
Top View
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
A 0.1-μF bootstrap capacitor is required between the BOOT and PH pins. If the voltage on this
1 BOOT O capacitor falls below the minimum requirement, the high-side MOSFET is forced to switch off
until the capacitor is refreshed.
2 VIN I This pin is the 3.5- to 28-V input supply voltage.
This pin is the enable pin. To disable, pull below 1.25 V. Float this pin to enable. Programming
3 EN I
the input undervoltage lockout with two resistors is recommended.
4 SS I This pin is slow-start pin. An external capacitor connected to this pin sets the output rise time.
5 VSENSE I This pin is the inverting node of the transconductance (gm) error amplifier.
This pin is the error-amplifier output and the input to the PWM comparator. Connect frequency
6 COMP O
compensation components to this pin.
7 GND — Ground pin
8 PH O The PH pin is the source of the internal high-side power MOSFET.
The PowerPAD is only available on the DDA package. For proper operation, the GND pin
9 PowerPAD™ —
must be connected to the exposed pad
4 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated
Product Folder Links: TPS54331

TPS54331
www.ti.com
SLVS839F –JULY 2008–REVISED OCTOBER 2014
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN –0.3 30
EN –0.3 6
BOOT 38
Input voltage V
VSENSE –0.3 3
COMP –0.3 3
SS –0.3 3
BOOT-PH 8
Output voltage PH –0.6 30 V
PH (10-ns transient from ground to negative peak) –5
EN 100 μA
BOOT 100 mA
Source current
VSENSE 10 μA
PH 9 A
VIN 9 A
Sink current COMP 100
μA
SS 200
Operating junction temperature, T
J
–40 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
–2 2 kV
pins
(1)
V
(ESD)
Electrostatic discharge
Charged device model (CDM), per JEDEC specification
–500 500 V
JESD22-C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating Input Voltage on (VIN pin) 3.5 28 V
T
J
Operating junction temperature –40 150 °C
Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: TPS54331
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