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Preliminary Specifications IC Version: c_A
Datasheet Revision: 0.5 September 29, 2016
U
UU
ULTRA
LTRALTRA
LTRAC
CC
CHIP
HIPHIP
HIP
The Coolest LCD Driver, Ever!!
163 x 256 STN LCD Controller-Driver
HIGH-VOLTAGE MIXED-SIGNAL IC
Ultrachip Confidential
U
UU
ULTRA
LTRALTRA
LTRAC
CC
CHIP
HIPHIP
HIP
UC1628C_A0.5
©1999~2016 163x256 STN Controller-Driver
2
TABLE OF CONTENT
Introduction ........................................................................................3
Ordering Information .........................................................................4
Block Diagram ....................................................................................5
Pin Description...................................................................................6
Recommended COG Layout..............................................................8
Control Registers .............................................................................10
Command Summary ........................................................................13
Command Description .....................................................................15
LCD Voltage Setting.........................................................................25
V
LCD
Quick Reference.......................................................................26
LCD Display Controls ......................................................................28
ITO Layout Considerations .............................................................29
Host Interface ...................................................................................30
Display Data RAM.............................................................................37
Reset & Power Management ...........................................................39
One-Time Program (OTP) NV Memory............................................42
OTP Operation for LCM Makers ......................................................43
Absolute Maximum Ratings ............................................................46
Specifications...................................................................................47
AC Characteristics ...........................................................................48
Physical Dimensions .......................................................................53
Alignment Mark Information............................................................54
Pad Coordinates...............................................................................55
Tray Information...............................................................................61
Revision History...............................................................................62
Ultrachip Confidential
U
UU
ULTRA
LTRALTRA
LTRAC
CC
CHIP
HIPHIP
HIP
UC1628C_A0.5
©1999~2016 163x256 STN Controller-Driver
3
UC1628
Single-Chip, Ultra-Low Power
163COM x 256SEG Matrix
Passive LCD Controller-Driver
INTRODUCTION
UC1628c is an advanced high-voltage mixed-signal CMOS IC,
especially designed for the display needs of low power hand-
held devices.
This chip employs UltraChip’s unique DCC (Direct Capacitor
Coupling) driver architecture to achieve near crosstalk free
images.
In addition to low power COM and SEG drivers, UC1628c
contains all necessary circuits for high-V LCD power supply,
bias voltage generation, temperature compensation, timing
generation and graphics data memory.
Advanced circuit design techniques are employed to minimize
external component counts and reduce connector size while
achieving extremely low power consumption.
MAIN APPLICATIONS
• Cellular Phones, battery operated hand held devices or
portable Instruments
FEATURE HIGHLIGHTS
• Single chip controller-driver for 163x256 graphics STN
LCD panels.
• A software-readable ID pin to support configurable
vender identification.
• Partial scroll function and programmable data update
window to support flexible manipulation of screen data.
• Support both page ordered and column ordered display
buffer RAM access.
• Support industry standard 4-wire (S8), and 2-wire (I
2
C)
serial interface and 8-bit parallel bus (8080 or 6800).
• Fully programmable Mux Rate, partial display window,
Bias Ratio and Line Rate allow many flexible power
management options.
• Four software programmable frame rates. Support the
use of fast Liquid Crystal material for speedy LCD
response.
• Software programmable 5 temperature compensation
coefficients.
• Self-configuring 9x charge pump with on-chip pumping
capacitors. Only 3 external capacitors are required to
operate.
• Flexible data addressing/mapping schemes to support
wide ranges of software models and LCD layout
placements.
• Very low pin count (7 pins for S8 or 5 pins for I
2
C)
allows exceptional image quality in COG format on
conventional ITO glass.
• Built-in temperature sensor
• Many on-chip and I/O pad layout features to support
optimized COG applications.
• V
DD
(digital) range (Typ.) : 1.8V ~ 3.3V
V
DD
2/3
(analog) range (Typ.) : 2.8V ~ 3.3V
LCD V
OP
range: 6.35V ~ 17.52V
• OTP trimming available to support precise LCD contrast
matching.
• Suitable ACF size: 3uM or 4uM
• Available in gold bump dies
Bump pitch: 23.2 µM
Bump space: 12 µM ± 3µM
Bump surface: 1500.8 µM
2
Remark: Contact UltraChip for a visual inspection document
(03-DOC-093).
Ultrachip Confidential
U
UU
ULTRA
LTRALTRA
LTRAC
CC
CHIP
HIPHIP
HIP
UC1628C_A0.5
©1999~2016 163x256 STN Controller-Driver
4
ORDERING INFORMATION
Part Number OTP I
2
C Description
UC1628cGAA Yes Yes Gold bumped die, Bump Height: 10uM
UC1628cGBA Yes Yes Gold bumped die, Bump Height: 15uM
General Notes
APPLICATION INFORMATION
For improved readability, the specification contains many application data points. When application information is given, it is advisory and does
not form part of the specification for the device.
USE OF I
2
C
The implementation of I
2
C is already included and tested in all silicon.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing. There is no post waffle saw/pack testing
performed on individual die. Although the latest processes are utilized for wafer sawing and die pick-&-place into waffle pack carriers, UltraChip
has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, it is the responsibility of the customer to test
and qualify their applications in which the die is to be used. UltraChip assumes no liability for device functionality or performance of the die or
systems after handling, packing or assembly of the die.
LIFE SUPPORT APPLICATIONS
These devices are not designed for use in life support appliances, or systems where malfunction of these products can reasonably be expected to
result in personal injuries. Customer using or selling these products for use in such applications do so at their own risk.
CONTENT DISCLAIMER
UltraChip believes the information contained in this document to be accurate and reliable. However, it is subject to change without notice. No
responsibility is assumed by UltraChip for its use, nor for infringement of patents or other rights of third parties. No part of this publication may be
reproduced, or transmitted in any form or by any means without the prior consent of UltraChip Inc. UltraChip's terms and conditions of sale apply
at all times.
CONTACT INFORMATION
ULTRACHIP INC. (Headquarter)
4F, No. 618, Recom Road,
Neihu District, Taipei 114,
Taiwan, R. O. C.
Tel: +886 (2) 8797-8947
Fax: +886 (2) 8797-8910
Sales e-mail: sales@ultrachip.com
Web site: http://www.ultrachip.com
Ultrachip Confidential
U
UU
ULTRA
LTRALTRA
LTRAC
CC
CHIP
HIPHIP
HIP
UC1628C_A0.5
©1999~2016 163x256 STN Controller-Driver
5
BLOCK DIAGRAM
BM0,BM1
CS0,CS1
RST
CD
ID
POR_DIS
WR0,WR1
D7-D0
Ultrachip Confidential
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