没有合适的资源?快使用搜索试试~ 我知道了~
首页联发科MT7686_Datasheet
资源详情
资源评论
资源推荐
© 2017 Airoha Technology Corp.
This document contains information that is proprietary to Airoha Technology Corp. (“Airoha”) and/or its licensor(s). Airoha cannot grant you
permission for any material that is owned by third parties. You may only use or reproduce this document if you have agreed to and been
bound by the applicable license agreement with Airoha (“License Agreement”) and been granted explicit permission within the License
Agreement (“Permitted User”). If you are not a Permitted User, please cease any access or use of this document immediately. Any
unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited. THIS DOCUMENT IS PROVIDED ON AN
“AS-IS” BASIS ONLY. AIROHA EXPRESSLY DISCLAIMS ANY AND ALL WARRANTIES OF ANY KIND AND SHALL IN NO EVENT BE LIABLE FOR ANY
CLAIMS RELATING TO OR ARISING OUT OF THIS DOCUMENT OR ANY USE OR INABILITY TO USE THEREOF. Specifications contained herein are
subject to change without notice.
MT7686 Datasheet
Version: 2.6
Release date: 17 May 2018
MT7686 Datasheet
© 2017 Airoha Technology Corp.
Page 2 of 65
This document contains information that is proprietary to Airoha Technology Corp. (“Airoha”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
Document Revision History
Revision Date Description
1.0 5 May 2017 Initial draft
1.1 30 June 2017 Modified performance values
2.0 14 August 2017
• Modified condition values in Table 6.2-5, “Electrical characteristics”
• Modified performance values
• Added section 2.4, “Analog baseband”
• Added section 3.2, “Radio MCU subsystem”
• Added section 4.5, “Power-on sequence”
• Modified Table 4.4-1, “Current consumption in different power
modes”.
2.1 26 October 2017
• Modified Table 7.1-1
2.2 21 November 2017
• Modified Section 7
2.3 27 December 2017
• Modified “Feature” and section 1.2.1
2.4 7 January 2018
• Modified Table 5.2-2
2.5 7 February 2018
• Modified Table 5.2-2,Table 5.3-2and Table 7.1-1
2.6 17 May 2018
• Added Section 2.4.3, “external clock source”
• Modified Section 2.5.1, “UART”
• Modified Section 2.5.2, “SPI”
MT7686 Datasheet
© 2017 Airoha Technology Corp.
Page 3 of 65
This document contains information that is proprietary to Airoha Technology Corp. (“Airoha”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
Features
Wi-Fi
• IEEE 802.11 b/g/n (2.4GHz, 1x1)
• Supports 20MHz, 40MHz bandwidth in 2.4GHz
band
• Wi-Fi security WEP/WPA2/WPS
• SoftAP, sniffer
• Dynamically switching between STA and SoftAP
modes at runtime
• Airoha Smart Connection
• Multi-cloud connectivity
• RX antenna diversity
• Integrated balun, PA/LNA
• Optional external LNA and PA support
• Support Wi-Fi/BLE coexistence
Microcontroller subsystem
• 192MHz ARM® Cortex®-M4 with FPU
• 16 DMA channels
• An RTC timer, one 64-bit and five 32-bit general
purpose timers
• Hardware DFS from 3MHz to 192MHz
• Development support: SWD, JTAG
• Crypto engine
o AES 128, 192, 256 bits
o DES, 3DES
o MD5, SHA-1, 224, 256, 384, 512
• True random number generator
• JTAG password protection
Memory
• Up to 384KB SRAM, with zero-wait state, max
frequency 96MHz
• Up to 32KB L1 cache, with high hit rate, zero-
wait state, maximum frequency at 192MHz
• Embedded 32Mbits flash, with less than 0.1µA
(typical) and 80MHz maximum frequency deep
power-down current
• Embedded 32Mbits pseudo SRAM with half
sleep mode current: 10µA (PASR 1/8 at 25°C 1x
Refresh) and 96MHz maximum frequency
Communication interfaces
• An SDIO 2.0 master and SDIO 2.0 slave
• Two I2C (3.4Mbps) interfaces
• Three UART interfaces (3Mbps)
• An SPI master and SPI slave with up to 48MHz
SCK, quad mode
• Two I2S interfaces
o One 16/24-bit, master/slave mode;
One 16-bit, master/slave mode with TDM
o Two TX/RX channels with 16, 24, 48, 96,
192, 11.025, 22.05 and 44.1kHz
frequencies
• Six PWM channels
• 21 GPIOs (fast IOs, 5V-tolerant)
• Four channel 12-bit AUXADC
Power management
• Integrated DC-DC
• Power input
o V
RTC
: from 1.62V to 3.63V
o V
PMU
/ V
RF
: 3.3V (+/-10%)
o V
IO*
: 1.8V, 2.8V, 3.3V (+/-10%)
• Off mode: <0.5µA
• Retention mode (with RTC)
o <2.7µA (RTC only)
o ~4.7µA with 8KB RAM sleep mode
• Deep sleep mode (with external 32kHz clock,
SDIO off)
o 90µA with 0KB RAM sleep mode
o 118µA with 384KB RAM sleep mode
• G-band RX power: 42mA
• G-band TX power
o FPA: 248mA 19dBm CCK
o FPA: 220mA 16.5dBm OFDM
• DTIM interval with 32kHz external clock source
and 384KB SRAM
MT7686 Datasheet
© 2017 Airoha Technology Corp.
Page 4 of 65
This document contains information that is proprietary to Airoha Technology Corp. (“Airoha”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
o DTIM=1: 0.63mA
o DTIM=3: 0.30mA
• Ambient temperature from -30°C to 85°C
Clock source
• 26MHz or 40MHz crystal oscillator
• 32kHz crystal oscillator or internal 32kHz RC for
RTC
Package type
• 6-mm x 6-mm x 0.9-mm 48-pin QFN with 0.4-
mm lead pitch
Note:
The power consumption data is measured at 25°C.
MT7686 Datasheet
© 2017 Airoha Technology Corp.
Page 5 of 65
This document contains information that is proprietary to Airoha Technology Corp. (“Airoha”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
Table of Contents
1. System Overview ................................................................................................................................... 8
1.1. Platform features ................................................................................................................................ 8
1.2. Wi-Fi subsystem features ................................................................................................................... 9
1.3. System block diagram ....................................................................................................................... 10
2. Functional Overview ............................................................................................................................. 11
2.1. Host processor subsystem ................................................................................................................ 11
2.2. Boot source ....................................................................................................................................... 13
2.3. Clock architecture ............................................................................................................................. 14
2.4. Analog baseband .............................................................................................................................. 16
2.5. Serial interfaces ................................................................................................................................ 20
2.6. Peripherals ........................................................................................................................................ 28
3. Wi-Fi RF Subsystem .............................................................................................................................. 30
3.1. Wi-Fi radio characteristics ................................................................................................................ 30
3.2. Radio MCU subsystem ...................................................................................................................... 32
4. Power Management Unit...................................................................................................................... 37
4.1. Overview ........................................................................................................................................... 37
4.2. Low-power operating mode ............................................................................................................. 37
4.3. PMU architecture ............................................................................................................................. 38
4.4. Power performance .......................................................................................................................... 38
4.5. Power-on sequence .......................................................................................................................... 40
5. Pin Description ..................................................................................................................................... 41
5.1. MT7686D pin list ............................................................................................................................... 41
5.2. MT7686 pins ..................................................................................................................................... 42
5.3. MT7686 series pin multiplexing........................................................................................................ 47
6. Electrical Characteristics ....................................................................................................................... 53
6.1. Absolute maximum ratings ............................................................................................................... 53
6.2. Operating conditions ........................................................................................................................ 53
7. System Configuration ........................................................................................................................... 63
7.1. Mode selection ................................................................................................................................. 63
8. Package Description.............................................................................................................................. 64
8.1. MT7686 mechanical data of the package ......................................................................................... 64
8.2. MT7686 thermal operating specifications ........................................................................................ 65
8.3. MT7686 lead-frame packaging ......................................................................................................... 65
9. Ordering Information ............................................................................................................................ 66
9.1. MT7686 top marking definition ........................................................................................................ 66
剩余65页未读,继续阅读
天空的眼眸
- 粉丝: 4
- 资源: 15
上传资源 快速赚钱
- 我的内容管理 收起
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
会员权益专享
最新资源
- zigbee-cluster-library-specification
- JSBSim Reference Manual
- c++校园超市商品信息管理系统课程设计说明书(含源代码) (2).pdf
- 建筑供配电系统相关课件.pptx
- 企业管理规章制度及管理模式.doc
- vb打开摄像头.doc
- 云计算-可信计算中认证协议改进方案.pdf
- [详细完整版]单片机编程4.ppt
- c语言常用算法.pdf
- c++经典程序代码大全.pdf
- 单片机数字时钟资料.doc
- 11项目管理前沿1.0.pptx
- 基于ssm的“魅力”繁峙宣传网站的设计与实现论文.doc
- 智慧交通综合解决方案.pptx
- 建筑防潮设计-PowerPointPresentati.pptx
- SPC统计过程控制程序.pptx
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功
评论5