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Property of Molex - For Internal Use Only – External Distribution Prohibited
PICMG® AMC.0 R2.0
Advanced Mezzanine Card
Base Specification
November 15, 2006
Property of Molex - For Internal Use Only – External Distribution Prohibited
ii PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006
©Copyright 2006, PCI Industrial Computer Manufacturers Group.
The attention of adopters is directed to the possibility that compliance with or adoption of PICMG® specifications may require use of an invention
covered by patent rights. PICMG® shall not be responsible for identifying patents for which a license may be required by any PICMG® specification or
for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG® specifications are prospective
and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.
NOTICE:
The information contained in this document is subject to change without notice. The material in this document details a PICMG® specification in
accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this
specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG® MAKES NO WARRANTY OF ANY KIND,
EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP,
IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.
In no event shall PICMG® be liable for errors contained herein or for indirect, incidental, special, consequential, reliance or cover damages, including
loss of profits, revenue, data or use, incurred by any user or any third party. Compliance with this specification does not absolve manufacturers of
CompactPCI® Express equipment from the requirements of safety and regulatory agencies (UL, CSA, FCC, IEC, etc.).
PICMG®, CompactPCI®, AdvancedTCA®, ATCA®, CompactPCI® Express and the PICMG, CompactPCI, AdvancedTCA and ATCA logos are regis-
tered trademarks, and COM Express™, MicroTCA™, µTCA™, CompactTCA™, AdvancedMC™ and SHB Express™ are trademarks of the PCI Indus-
trial Computer Manufacturers Group. All other brand or product names may be trademarks or registered trademarks of their respective holders.
Property of Molex - For Internal Use Only – External Distribution Prohibited
PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 iii
Revision History
Revision Level Date Action
R1.0 03-Jan-05 Revision 1.0 with minor changes to Sections 1-
5 listed in the Release Notes.
R2.0 15-Nov-06 Revision 2.0 (Incorporates ECN001 and
ECN002)
Property of Molex - For Internal Use Only – External Distribution Prohibited
iv PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006
This page intentionally left blank.
Property of Molex - For Internal Use Only – External Distribution Prohibited
PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 v
Contents
1 Introduction and objectives...........................................................................................................1-1
1.1 Overview............................................................................................................................1-1
1.2 Introduction ........................................................................................................................1-1
1.2.1 Scope....................................................................................................................1-2
1.2.2 Design goals .........................................................................................................1-3
1.3 Theory and operation of usage..........................................................................................1-4
1.3.1 AdvancedMC Bays and Slots ...............................................................................1-5
1.3.2 AdvancedMC Modules..........................................................................................1-5
1.3.2.1 AdvancedMC Module in a Conventional Bay...........................................1-6
1.3.2.2 AdvancedMC Module in a Cutaway Bay..................................................1-6
1.3.2.3 Module Width...........................................................................................1-7
1.3.2.4 Module Sizes ...........................................................................................1-7
1.3.3 Carrier Types ........................................................................................................1-8
1.3.4 AdvancedMC Connector.......................................................................................1-9
1.3.5 Module Management ............................................................................................1-9
1.3.6 Module Power.......................................................................................................1-9
1.3.7 Module Interconnect .............................................................................................1-9
1.4 Special word usage .........................................................................................................1-10
1.5 Statement of compliance .................................................................................................1-10
1.6 Dimensions......................................................................................................................1-11
1.7 Regulatory guidelines ......................................................................................................1-11
1.8 Reference specifications..................................................................................................1-11
1.9 Name and logo usage......................................................................................................1-12
1.10 Signal naming convention................................................................................................1-13
1.11 Intellectual property .........................................................................................................1-13
1.12 Glossary...........................................................................................................................1-14
2 Mechanical ...................................................................................................................................2-1
2.1 Mechanical overview .........................................................................................................2-2
2.1.1 Orientation and references ...................................................................................2-4
2.1.2 Dimensions and tolerances ..................................................................................2-7
2.2 Module requirements .........................................................................................................2-8
2.2.1 Module PCB dimensions ......................................................................................2-8
2.2.1.1 Single Module PCB dimensions...............................................................2-9
2.2.1.2 Double Module PCB dimensions ...........................................................2-10
2.2.1.3 Suggested/ vendor-specific Module PCB Face Plate attachment .........2-11
2.2.1.4 Module ESD Strip ..................................................................................2-14
2.2.1.5 Module PCB thickness...........................................................................2-17
2.2.1.6 Module PCB warpage and stiffening......................................................2-17
2.2.2 Module Card-edge Interface dimensions............................................................2-18
2.2.3 Module sizes.......................................................................................................2-21
2.2.3.1 Compact Module dimensions.................................................................2-22
2.2.3.2 Mid-size Module dimensions..................................................................2-23
2.2.3.3 Full-size Module dimensions..................................................................2-25
2.2.3.4 Voltage limits for components on Modules ............................................2-26
2.2.4 Module Face Plate..............................................................................................2-26
2.2.4.1 Module LEDs .........................................................................................2-29
2.2.4.2 Module Face Plate labels.......................................................................2-33
2.2.5 Module Handle....................................................................................................2-34
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