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IMX6ULL参考手册
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IMX6ULL参考手册,英文文档,4127页的IMX6Ull芯片的超详细介绍。NXP官方出版。共分为60个章节,全方面的概括了IMX6Ull的特性以及配置方式
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i.MX 6ULL Applications Processor
Reference Manual
Document Number: IMX6ULLRM
Rev. 1, 11/2017
i.MX 6ULL Applications Processor Reference Manual, Rev. 1, 11/2017
2 NXP Semiconductors
Contents
Section number Title Page
Chapter 1
Introduction
1.1 About This Document...................................................................................................................................................159
1.1.1 Audience.................................................................................................................................................... 159
1.1.2 Organization...............................................................................................................................................159
1.1.3 Suggested Reading.....................................................................................................................................160
1.1.3.1 General Information...............................................................................................................160
1.1.3.2 Related Documentation..........................................................................................................160
1.1.4 Conventions............................................................................................................................................... 160
1.1.5 Register Access..........................................................................................................................................162
1.1.5.1 Register Diagram Field Access Type Legend........................................................................162
1.1.5.2 Register Macro Usage............................................................................................................163
1.1.6 Signal Conventions.................................................................................................................................... 164
1.1.7 Acronyms and Abbreviations.....................................................................................................................164
1.2 Introduction...................................................................................................................................................................167
1.3 Target Applications.......................................................................................................................................................167
1.4 Features.........................................................................................................................................................................167
1.5 Architectural Overview.................................................................................................................................................171
1.5.1 Simplified Block Diagram......................................................................................................................... 171
1.5.2 Architectural Partitioning...........................................................................................................................172
1.5.3 Endianness Support....................................................................................................................................174
1.5.4 Memory Interfaces..................................................................................................................................... 174
Chapter 2
Memory Maps
2.1 Memory system overview.............................................................................................................................................175
2.2 ARM Platform Memory Map....................................................................................................................................... 175
2.3 DMA memory map.......................................................................................................................................................181
Chapter 3
i.MX 6ULL Applications Processor Reference Manual, Rev. 1, 11/2017
NXP Semiconductors 3
Section number Title Page
Interrupts and DMA Events
3.1 Overview.......................................................................................................................................................................183
3.2 Cortex A7 interrupts..................................................................................................................................................... 183
3.3 SDMA event mapping.................................................................................................................................................. 188
Chapter 4
External Signals and Pin Multiplexing
4.1 Overview.......................................................................................................................................................................191
4.1.1 Muxing Options......................................................................................................................................... 191
Chapter 5
Fusemap
5.1 Boot Fusemap............................................................................................................................................................... 215
5.2 Lock Fusemap...............................................................................................................................................................226
5.3 Fusemap Descriptions Table.........................................................................................................................................227
Chapter 6
External Memory Controllers
6.1 Overview.......................................................................................................................................................................235
6.2 Multi-mode DDR controller (MMDC) overview and feature summary...................................................................... 235
6.3 EIM-PSRAM/NOR flash controller overview..............................................................................................................236
6.3.1 EIM features...............................................................................................................................................236
6.3.2 EIM boot scenarios.................................................................................................................................... 237
6.3.3 EIM boot configuration..............................................................................................................................237
6.3.4 OneNAND requirements............................................................................................................................238
Chapter 7
System Debug
7.1 Overview.......................................................................................................................................................................239
7.2 Chip and ARM Platform Debug Architecture.............................................................................................................. 239
7.2.1 Debug Features.......................................................................................................................................... 240
7.2.2 Debug system components.........................................................................................................................240
7.2.2.1 AMBA Trace Bus (ATB).......................................................................................................241
7.2.2.2 ATB replicator....................................................................................................................... 241
i.MX 6ULL Applications Processor Reference Manual, Rev. 1, 11/2017
4 NXP Semiconductors
Section number Title Page
7.2.2.3 Embedded Cross Triggering.................................................................................................. 241
7.2.2.3.1 Cross-Trigger Matrix (CTM)..........................................................................242
7.2.2.3.2 Cross-Trigger Interface (CTI).........................................................................243
7.2.2.4 Debug Access Port (DAP)..................................................................................................... 243
7.2.3 Chip-Specific SJC Features....................................................................................................................... 244
7.2.3.1 JTAG Disable Mode.............................................................................................................. 244
7.2.3.2 JTAG ID.................................................................................................................................244
7.2.4 System JTAG Controller - SJC..................................................................................................................244
7.2.5 System JTAG controller main features......................................................................................................245
7.2.6 SJC TAP Port.............................................................................................................................................245
7.2.7 SJC main blocks.........................................................................................................................................245
7.3 Smart DMA (SDMA) core............................................................................................................................................246
7.3.1 SDMA On Chip Emulation Module (OnCE) Feature Summary............................................................... 246
7.3.1.1 Other SDMA Debug Functionality........................................................................................247
7.3.1.2 SDMA ROM Patching...........................................................................................................248
7.4 Miscellaneous............................................................................................................................................................... 248
7.4.1 Clock/Reset/Power.....................................................................................................................................248
7.5 Supported tools............................................................................................................................................................. 248
Chapter 8
System Boot
8.1 Overview.......................................................................................................................................................................249
8.2 Boot modes................................................................................................................................................................... 250
8.2.1 Boot mode pin settings...............................................................................................................................251
8.2.2 High-level boot sequence...........................................................................................................................251
8.2.3 Boot From Fuses mode (BOOT_MODE[1:0] = 00b)................................................................................252
8.2.4 Serial Downloader......................................................................................................................................253
8.2.5 Internal Boot mode (BOOT_MODE[1:0] = 0b10).................................................................................... 255
8.2.6 Boot security settings.................................................................................................................................255
8.3 Device configuration.....................................................................................................................................................256
i.MX 6ULL Applications Processor Reference Manual, Rev. 1, 11/2017
NXP Semiconductors 5
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