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AP6256 datasheet_V1.3_12202017.pdf
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更新于2023-05-15
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AMPAK正基WIFI模块资料,双频WIFI模组AP6256 datasheet详细资料,包含产品设计参考,更多详细咨询咨询深圳市世联芯科技有限公司!
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AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
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正基科技股份有限公司
SPECIFICATION
SPEC. NO.: REV: 1.3
DATE: 12.20. 2017
PRODUCT NAME: AP6256
Customer APPROVED
Company
Representative
Signature
REVIEW
PREPARED
PM QA
APPROVED DCC ISSUE
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
1
AMPAK
AP6256
WiFi 11ac + Bluetooth V5.0
Module Spec Sheet
AP6256 Datasheet
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
2
Revision History
Date Revision Content Revised By
Version
2017/06/13 - Preliminary Richard 1.0
2017/09/07 - Modify WLAN Specification Harry 1.1
2017/12/15 - Modify WLAN/BT Specification Harry 1.2
2017/12/20 - Modify WLAN/BT Specification Harry 1.3
AP6256 Datasheet
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
3
Contents
1. Introduction......................................................................................................... 4
2. Features............................................................................................................... 5
3. Deliverables ........................................................................................................ 6
3.1 Deliverables.................................................................................................... 6
3.2 Regulatory certifications ................................................................................. 6
4. General Specification......................................................................................... 7
4.1 General Specification...................................................................................... 7
4.2 Voltages.......................................................................................................... 7
4.2.1 Absolute Maximum Ratings.................................................................... 7
4.2.2 Recommended Operating Rating........................................................... 7
5. Wi-Fi RF Specification........................................................................................ 8
5.1 2.4GHz RF Specification................................................................................. 8
5.1 5GHz RF Specification.................................................................................... 9
6. Bluetooth Specification.................................................................................... 12
6.1 Bluetooth Specification ................................................................................. 12
7. Pin Assignments............................................................................................... 13
7.1 Pin Outline.................................................................................................... 13
7.2 Pin Definition ................................................................................................ 13
8. Dimensions ....................................................................................................... 15
8.1 Physical Dimensions..................................................................................... 15
8.2 Layout Recommendation.............................................................................. 16
9. External clock reference .................................................................................. 17
10.1 SDIO Pin Description.................................................................................. 17
10. Host Interface Timing Diagram........................................................................ 18
10.1 Power-up Sequence Timing Diagram ......................................................... 18
10.2 SDIO Default Mode Timing Diagram........................................................... 20
10.3 SDIO High Speed Mode Timing Diagram ................................................... 21
10.4 SDIO Bus Timing Specifications in SDR Modes ......................................... 22
10.5 SDIO Bus Timing Specifications in DDR50 Mode....................................... 25
11. Recommended Reflow Profile ......................................................................... 27
12. Package Information........................................................................................ 30
12.1 Label........................................................................................................... 30
12.2 Dimension................................................................................................... 31
12.3 MSL Level / Storage Condition ................................................................... 33
AP6256 Datasheet
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
4
1. Introduction
AMPAK Technology would like to announce a low-cost and low-power consumption module
which has all of the Wi-Fi, Bluetooth functionalities. The highly integrated module makes the
possibilities of web browsing, VoIP, Bluetooth headsets applications. With seamless roaming
capabilities and advanced security, also could interact with different vendors’ 802.11a/b/g/n/
ac Access Points in the wireless LAN.
The wireless module complies with IEEE 802.11 a/b/g/n/ac standard and it can achieve up
to a speed of 433.3Mbps with single stream in 802.11ac draft to connect to the wireless LAN.
The integrated module provides SDIO interface for Wi-Fi, UART / PCM interface for
Bluetooth.
This compact module is a total solution for a combination of Wi-Fi + BT technologies. The
module is specifically developed for Smart phones and Portable devices.
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