没有合适的资源?快使用搜索试试~ 我知道了~
首页DRV8301半桥驱动电路设计
资源详情
资源评论
资源推荐
1
1
2
2
3
3
4
4
5
5
6
6
D D
C C
B B
A A
0 4
2/6/2014
BLDC Standard sheet cover.SchDoc
Sheet Title:
Size:
Mod. Date:
File:
Sheet: of
B http://www.ti.com
Contact: http://www.ti.com/support
Automotive BLDC Motor DriveProject Title:
Designed for: Public Release
Assembly Variant: 001
© Texas Instruments 2014
Drawn By:
Engineer: Clark Kinnaird
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
Not in version controlSVN Rev:
SAT0042Number: Rev: E5
Revision History
Revision Notes
IMPORTANT NOTICE FOR TI REFERENCE DESIGNS
Texas Instruments Incorporated (? TI? ) reference designs are solely intended to assist designers
(? Buyers? ) who are developing systems that incorporate TI semiconductor products (also referred to
herein as ? components? ). Buyer understands and agrees that Buyer remains responsible for using its
independent analysis, evaluation and judgment in designing Buyer? s systems and products.
TI reference designs have been created using TI-standard laboratory conditions and engineering
practices. TI has not conducted any testing other than that specifically described in the
published documentation for a particular reference design. TI may make corrections,
enhancements, improvements and other changes to its reference designs.
Buyers are authorized by TI to use TI reference designs only in applications that include the TI
component(s) that are identified in each particular reference design and to modify the reference design
in the development of their end products. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO
LICENSE TO ANY THIRD PARTY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT, IS
GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other
intellectual property right relating to any combination, machine, or process in which TI components or
services are used. Information published by TI regarding third-party products or services does not
constitute a license to use such products or services, or a warranty or endorsement thereof. Use of
such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
TI REFERENCE DESIGNS ARE PROVIDED STRICTLY ? AS IS? AND WITH ALL FAULTS. TI MAKES
NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE REFERENCE DESIGNS OR
USE OF THE REFERENCE DESIGNS, EXPRESS, IMPLIED OR STATUTORY, INCLUDING
ACCURACY OR COMPLETENESS. TI DISCLAIMS ANY WARRANTY OF TITLE AND ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,
QUIET ENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTY
INTELLECTUAL PROPERTY RIGHTS WITH REGARD TO TI REFERENCE DESIGNS OR USE
THEREOF. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY BUYERS
AGAINST ANY THIRD PARTY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON A
COMBINATION OF COMPONENTS PROVIDED IN A TI REFERENCE DESIGN. IN NO EVENT
SHALL TI BE LIABLE FOR ANY ACTUAL, SPECIAL, INCIDENTAL, CONSEQUENTIAL OR
INDIRECT DAMAGES, HOWEVER CAUSED, ON ANY THEORY OF LIABILITY AND WHETHER OR
NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES, ARISING IN ANY WAY
OUT OF TI REFERENCE DESIGNS OR BUYER? S USE OF TI REFERENCE DESIGNS.
TI reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or
service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All semiconductor products are
sold subject to TI? s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in
accordance with the warranty in TI? s terms and conditions of sale of semiconductor products.
Testing and other quality control techniques for TI components are used to the extent TI deems
necessary to support this warranty. Except where mandated by applicable law, testing of all
parameters of each component is not necessarily performed.
TI assumes no liability for applications assistance or the design of Buyers? products. Buyers are
responsible for their products and applications using TI components. To minimize the risks associated
with Buyers? products and applications, Buyers should provide adequate design and operating
safeguards.
Reproduction of significant portions of TI information in TI data books, data sheets or reference
designs is permissible only if reproduction is without alteration and is accompanied by all associated
warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory
and safety-related requirements concerning its products, and any use of TI components in its
applications, notwithstanding any applications-related information or support that may be provided by
TI. Buyer represents and agrees that it has all the necessary expertise to create and implement
safeguards that anticipate dangerous failures, monitor failures and their consequences, lessen the
likelihood of dangerous failures and take appropriate remedial actions. Buyer will fully indemnify TI
and its representatives against any damages arising out of the use of any TI components in Buyer? s
safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related
applications. With such components, TI? s goal is to help enable customers to design and create their
own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for
automotive use. In any case of use of non-designated products, TI will not be responsible for any
failure to meet ISO/TS16949 or use in automotive applications.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment)
unless authorized officers of the parties have executed a written agreement specifically governing
such use.
Only those TI components that TI has specifically designated as military grade or ? enhanced plastic?
are designed and intended for use in military/aerospace applications or environments. Buyer
acknowledges and agrees that any military or aerospace use of TI components that have not been so
designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
pchy1288
- 粉丝: 3
- 资源: 1
上传资源 快速赚钱
- 我的内容管理 收起
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
会员权益专享
最新资源
- zigbee-cluster-library-specification
- JSBSim Reference Manual
- c++校园超市商品信息管理系统课程设计说明书(含源代码) (2).pdf
- 建筑供配电系统相关课件.pptx
- 企业管理规章制度及管理模式.doc
- vb打开摄像头.doc
- 云计算-可信计算中认证协议改进方案.pdf
- [详细完整版]单片机编程4.ppt
- c语言常用算法.pdf
- c++经典程序代码大全.pdf
- 单片机数字时钟资料.doc
- 11项目管理前沿1.0.pptx
- 基于ssm的“魅力”繁峙宣传网站的设计与实现论文.doc
- 智慧交通综合解决方案.pptx
- 建筑防潮设计-PowerPointPresentati.pptx
- SPC统计过程控制程序.pptx
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功
评论5