Qseven嵌入式模块：小型化、低能耗的未来

Qseven

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"Qseven嵌入式计算机模块规范是2008年由欧洲三家公司合作创建的一个开放标准，旨在推动小型、低功耗的嵌入式系统设计。此标准专注于45纳米及更先进技术的移动和超便携应用，以适应严格的能源效率和便携性需求。Qseven与传统的COM（Computer On Module）标准不同，它特别针对移动领域的应用。" Qseven规范详细说明了模块的电气和机械特性，包括接口布局、尺寸和实施指南。例如，修订1.11版纠正了Qseven模块的整体高度，更新了边缘连接器的引脚分配，并对Foxconn和Speedtech连接器的部件编号进行了修正。此外，还增加了底部安装孔的尺寸，增强了边缘连接器的详细尺寸，并在信号定义中加入了热管理相关的信号描述。在Qseven模块的物理设计方面，它定义了一个紧凑的外形，允许在有限的空间内实现高性能计算。模块的尺寸和连接器布局确保了与其他硬件组件的兼容性和互换性。例如，1.11版本中，对MXM连接器的部件编号进行了修正，增加了底部安装孔的尺寸，以增强模块的稳定性和安装灵活性。在电气特性上，Qseven规范涵盖了模块的电源管理、I/O接口、信号定义以及热管理。例如，修订版增加了USB_HOST_PRES#信号，并添加了USB_HC_SEL信号，这有助于优化模块与主机系统之间的通信。热管理部分的更新，如THRMTRIP#信号的描述，确保了在高负荷运行时能有效监测和控制温度，防止过热。 Qseven标准的推出，使得开发者能够快速地构建低功耗、高性能的嵌入式解决方案，尤其适用于移动设备、物联网(IoT)设备、工业自动化、医疗设备等应用领域。通过标准化接口和模块化设计，制造商可以减少开发时间和成本，同时提高产品的可靠性与可维护性。 Qseven规范为嵌入式计算提供了统一的标准，推动了行业的发展，使得小型化、智能化和节能的设备得以广泛应用。随着技术的进步，Qseven标准可能会继续演进，以适应更先进的处理器技术和其他新兴需求。

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Qseven

™

Specification Revision 1.11

Tables

Table 1-1 MXM Connector.............................................................................................................15

Table 1-2 Environmental Characteristics for MXM Connectors......................................................15

Table 1-3 Electrical Characteristics for MXM Connectors..............................................................16

Table 2-1 Qseven™ Supported Features.......................................................................................19

Table 3-1 Connector Pinout Description.........................................................................................20

Table 3-2 Signal Terminology.........................................................................................................23

Table 3-3 Signal Definition PCI Express.........................................................................................24

Table 3-4 Signal Definition ExpressCard........................................................................................24

Table 3-5 Signal Definition Ethernet...............................................................................................25

Table 3-6 Signal Definition SATA...................................................................................................25

Table 3-7 Signal Definition USB.....................................................................................................26

Table 3-8 Signal Definition SDIO....................................................................................................27

Table 3-9 Signal Definition HDA.....................................................................................................27

Table 3-10 Signal LVDS.................................................................................................................28

Table 3-11 Signal Definition SDVO................................................................................................29

Table 3-12 Signal Definition DisplayPort........................................................................................30

Table 3-13 Signal Definition HDMI.................................................................................................31

Table 3-14 Signal Definition LPC...................................................................................................32

Table 3-15 Signal Definition Input Power.......................................................................................32

Table 3-16 Signal Definition Power Control....................................................................................32

Table 3-17 Signal Definition Power Management...........................................................................33

Table 3-18 Signal Definition Miscellaneous....................................................................................34

Table 3-19 Signal Definition Thermal Management........................................................................34

Table 3-20 Signal Definition Fan Control........................................................................................34

Table 3-21 Input Power Characteristics..........................................................................................35

Table 3-22: Input Power Sequencing.............................................................................................36

Table 4-1 PCI Express Budget Allocation.......................................................................................37

Table 4-2 Carrier Board PCI Express Insertion Loss Budget.........................................................40

Table 4-3 SATA Loss Budget Allocation.........................................................................................41

Table 4-4 USB Loss Budget Allocation...........................................................................................42

Table 4-5 Gigabit Ethernet Loss Budget Allocation........................................................................43

Table 6-1 Industry Specifications...................................................................................................49

Qseven

™

Specification Revision 1.11

1 Qseven™ Mechanical Characteristics

The Qseven™ module, including the heatspreader plate, PCB thickness and bottom

components, is up to approximately 12mm thick.

Edge-fingers on the module are referenced to the PCB slot center with an overall PCB

thickness of 1.2mm ±0.1 measured across the fingers including the plating and/or

metalization on both sides. Bevel is optional, but edge shall be free of burrs and shall

not have sharp edges. The components located on the top side of the module are up to

5.5mm high. The bottom components have a maximum height of 2.5mm while the

standard distance between the standard MXM connector on the carrier board and the

Qseven™ module is 2.7mm. When using the standard MXM connector, with an overall

height of 5.5mm, carrier board component placement below the Qseven module is not

permitted.

If it is necessary to place carrier board components below the Qseven module, then a

MXM connector with an overall height of 7.8mm must be used and no carrier board

component can exceed a maximum height of 2.5mm. Refer to section 1.3 regarding

MXM connector specifications.

The heatspreader offered for Qseven™ modules acts as a thermal coupling device and

is not a heat sink. Heat dissipation devices such as a heat sink with fan or heat pipe may

need to be connected to the heatspreader. The dissipation of heat will fluctuate between

different CPU boards. Refer to the Qseven™ module's user's guide for heatspreader

dimensions and specifications.

The standoffs for the heatspreader and carrier board must not exceed 5.6mm overall

external diameter. This ensures that the standoff contact area does not exceed the

defined mounting hole footprint on the Qseven™ module. The screw that is to be used

for mounting must be a metric thread M2.5 DIN7985 / ISO7045.

Qseven™ modules are defined to feature ultra low power CPU and chipset solutions

with an ultra low “Thermal Design Power” (TDP). Furthermore, the modules power

consumption should not exceed 12W.

Figure 1-1 Overall Height including Heatspreader of the Qseven™ Module

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