4
600VCoolMOSªP6PowerTransistor
IPB60R380P6,IPP60R380P6,IPD60R380P6,IPA60R380P6
Rev.2.3,2017-08-22Final Data Sheet
2Thermalcharacteristics
Table3Thermalcharacteristics(NonFullPAK)TO-220
Values
Min. Typ. Max.
Parameter Symbol Unit Note/TestCondition
Thermal resistance, junction - case R
thJC
- - 1.5 °C/W -
Thermal resistance, junction - ambient R
thJA
- - 62 °C/W leaded
Soldering temperature, wavesoldering
only allowed at leads
T
sold
- - 260 °C 1.6mm (0.063 in.) from case for 10s
Table4Thermalcharacteristics(FullPAK)TO-220FP
Values
Min. Typ. Max.
Parameter Symbol Unit Note/TestCondition
Thermal resistance, junction - case R
thJC
- - 4 °C/W -
Thermal resistance, junction - ambient R
thJA
- - 80 °C/W leaded
Soldering temperature, wavesoldering
only allowed at leads
T
sold
- - 260 °C 1.6mm (0.063 in.) from case for 10s
Table5ThermalcharacteristicsTO-252,TO-263
Values
Min. Typ. Max.
Parameter Symbol Unit Note/TestCondition
Thermal resistance, junction - case R
thJC
- - 1.5 °C/W -
Thermal resistance, junction - ambient R
thJA
- - 62 °C/W device on PCB, minimal footprint
Thermal resistance, junction - ambient
for SMD version
R
thJA
- 35 45 °C/W
Device on 40mm*40mm*1.5mm
epoxy PCB FR4 with 6cm² (one
layer, 70µm thickness) copper area
for drain connection and cooling.
PCB is vertical without air stream
cooling.
Soldering temperature, wave & reflow
soldering allowed
T
sold
- - 260 °C reflow MSL1