CC2591
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SWRS070B –MARCH 2008–REVISED SEPTEMBER 2014
3.1 Pin Attributes
Table 3-1. Pin Attributes
TERMINAL
TYPE DESCRIPTION
NO. NAME
The exposed die attach pad must be connected to a solid ground plane. See
— GND Ground
CC2591EM reference design for recommended layout.
1 2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA . See
AVDD_PA1 Power
CC2591EM reference design for recommended layout.
2 RF_N RF RF interface towards CC24xx or CC25xx device.
RXTX switching voltage when connected to CC24xx devices. See Table 5-2 and
3 RXTX Analog/Control
Table 5-3 for details.
4 RF_P RF RF interface towards CC24xx or CC25xx device
5 PAEN Digital Input Digital control pin. See Table 5-2 and Table 5-3 for details.
6 EN Digital Input Digital control pin. See Table 5-2 and Table 5-3 for details.
Digital control pin.
7 HGM Digital Input HGM=1 → Device in High Gain Mode
HGM=0 → Device in Low Gain Mode (RX only)
Secondary ground connections. Should be shorted to the die attach pad on the top
8, 9, 12, 14 GND Ground
PCB layer.
2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA. See
10 AVDD_PA2 Power
CC2591EM reference design for recommended layout.
11 ANT RF Antenna interface.
2 V – 3.6 V Power. PCB trace to this pin serves as inductive load to LNA. See
13 AVDD_LNA Power
CC2591EM reference design for recommended layout.
15 BIAS Analog Biasing input. Resistor between this node and ground sets bias current to PAs.
16 AVDD_BIAS Power 2 V – 3.6 V Power.
Copyright © 2008–2014, Texas Instruments Incorporated Terminal Configuration and Functions 5
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