PCB设计技术：实现EMC合规的指南

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"Printed Circuit Board Design Techniques for EMC Compliance, Second Edition.pdf" 《印制电路板设计技术：电磁兼容性合规手册（第二版）》由Mark I. Montrose编写，是针对设计者的专业指南，旨在帮助他们理解和实现印制电路板（PCB）的电磁兼容性（EMC）合规。本书由IEEE电磁兼容学会赞助，由IEEE The Institute of Electrical and Electronics Engineers, Inc.出版，由Wiley-Interscience（John Wiley & Sons, Inc.）发行。在设计电子设备时，确保印制电路板的电磁兼容性至关重要，因为它关系到设备能否在各种电磁环境中正常工作，不干扰其他设备，也不受其他设备的干扰。这本书详细探讨了以下关键知识点： 1. **电磁兼容性基础**：介绍EMC的基本概念、法规要求以及在设计阶段考虑EMC的重要性。 2. **PCB设计原则**：涵盖了布局、布线、接地和屏蔽等核心设计原则，以减少电磁辐射和敏感性。 3. **信号完整性与电源完整性**：讲解如何通过优化信号路径和电源网络来控制噪声和干扰，以确保系统性能。 4. **仿真与测试**：讨论了使用电磁仿真工具预测PCB的EMC性能，以及在实验室进行实际测试的方法和标准。 5. **EMC问题诊断与解决**：提供了对常见EMC问题的分析方法，以及如何通过设计修改来解决问题的策略。 6. **案例研究**：通过实际工程案例，展示如何应用这些设计理念和技术来解决具体的EMC挑战。 7. **法规与标准**：介绍了全球主要地区的EMC法规和标准，指导设计者满足合规要求。 8. **材料与工艺选择**：讨论不同材料和制造工艺对EMC性能的影响，以及如何选择合适的选项。本书不仅适合经验丰富的PCB设计师，也适合希望深入了解EMC设计的工程师和学生。通过深入阅读和实践，读者将能够掌握创建符合EMC要求的高效PCB设计所需的技能和知识。《印制电路板设计技术：电磁兼容性合规手册（第二版）》是一部全面且实用的参考书，对于确保电子产品的电磁兼容性具有重要指导价值。

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Table of Contents

Chapter 1

1.1: FUNDAMENTAL

DEFINITIONS

1.2: ELEMENTS OF THE

ELECTROMAGNETIC

ENVIRONMENT

1.3: NATURE OF

INTERFERENCE

1.4: REGULATORY

REQUIREMENTS—NORTH

MERIC

1.5: REGULATORY

REQUIREMENTS—

WORLDWIDE

1.6: STANDARDS

1.7: EMISSION

REQUIREMENTS

1.8: IMMUNITY

REQUIREMENTS

1.9: ADDITIONAL

REGULATORY

REQUIREMENTS—NORTH

MERIC

1.10: SUPPLEMENTAL

INFORMATION

REFERENCES

Chapter 1 - Introduction

Printed Circuit Board Design Techniques for EMC Compliance: A Handbook for Designers, Second Edition

by Mark I. Montrose

IEEE Press

Recommend this title?

1.3 NATURE OF INTERFERENCE

EMC is grouped into two categories: internal and external. The internal

category is the result of signal degradation along a transmission path,

including parasitic coupling between circuits in addition to field coupling

between internal subassemblies, such as a power supply to a disk drive.

Stated more specifically, the problems are signal losses and reflections

along the path, along with crosstalk between adjacent signal traces.

External problems are divided into emissions and immunity. Emissions

derive primarily from harmonics of clocks or other periodic signals.

Remedies concentrate on containing the periodic signal to as small an area

as possible, blocking parasitic coupling paths to the outside world.

Susceptibility to external influences, such as ESD or radio frequency

interference, is related initially to propagated fields that couple into I/O

lines, which then transfer to the inside of the unit, and secondarily to case

shielding. The principal recipients are high-speed transmission lines and

sensitive adjacent traces, particularly those terminated with edge-triggered

components.

There are five major considerations when performing EMC analysis on a

product or design [1].

Frequency

. Where in the frequency spectrum is the problem

observed?

Amplitude

. How strong is the source energy level, and how great is its

potential to cause harmful interference?

Time

. Is the problem continuous (periodic signals), or does it exist

only during certain cycles of operation (e.g., disk drive write operation

or network burst transmission)?

Impedance

. What is the impedance of both the source and receptor

units, and the impedance of the transfer mechanism between the

two?

Dimensions

. What are the physical dimensions of the emitting device

that cause emissions to occur? RF currents will produce

electromagnetic fields that will exit an enclosure through chassis leaks

that equal significant fractions of a wavelength or significant fractions

of a "rise-time distance." Trace lengths on a PCB have a direct

relationship as transmission paths for RF currents.

Whenever an EMI problem is approached, it is helpful to review this list

based on product application. Understanding these five items will clear up

much of the mystery of how EMI exists within a PCB. Applying these five

considerations teaches us that design techniques make sense in certain

contexts but not in others. For example, single-point grounding is excellent

when applied to low-frequency applications, but it is completely

inappropriate for radio frequency signals, which is where most of the EMI

problems occur. Many engineers blindly apply single-point grounding for all

product designs, without realizing that additional and more complex

problems are created using this grounding methodology.

When designing a PCB, we are concerned with current flow within the

assembly. Current is preferable to voltage for a simple reason: current

always travels around a closed-loop circuit following one or more paths. It

Personal account | University of Southern Queensland

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Table of Contents

Chapter 1

1.1: FUNDAMENTAL

DEFINITIONS

1.2: ELEMENTS OF THE

ELECTROMAGNETIC

ENVIRONMENT

1.3: NATURE OF

INTERFERENCE

1.4: REGULATORY

REQUIREMENTS—NORTH

AMERICA

1.5: REGULATORY

REQUIREMENTS—

WORLDWIDE

1.6: STANDARDS

1.7: EMISSION

REQUIREMENTS

1.8: IMMUNITY

REQUIREMENTS

1.9: ADDITIONAL

REGULATORY

REQUIREMENTS—NORTH

MERIC

1.10: SUPPLEMENTAL

INFORMATION

REFERENCES

Chapter 1 - Introduction

Printed Circuit Board Design Techniques for EMC Compliance: A Handbook for Designers, Second Edition

by Mark I. Montrose

IEEE Press

Recommend this title?

1.4 REGULATORY REQUIREMENTS—NORTH

AMERICA

Electrical and electronic products generate RF energy. Electromagnetic

emission levels are set by rules and regulations mandated by domestic and

international governments or agencies. In the United States, the Federal

Communications Commission (FCC) regulates the use of radio and wire

communications. The FCC is an independent government agency,

responsible for ensuring interstate and international communication by

radio, television, satellite, and cable.

In Canada, Industry Canada (IC) is the agency responsible for regulating

radio and wire communication. Industry Canada performs a function similar

to that of the Federal Communications Commission. Harmonized test

requirements and standards for North America exist between both the FCC

and IC.

The FCC regulates electronic products by specifying technical standards

and operational requirements through the Code of the Federal Register

(CFR), Title 47. The sections within 47CFR that are most applicable to

products discussed herein are Parts 2, 15, 18, and 68. These regulations,

developed over many years, are based on complaints filed with the

Commission. The most prominent FCC Parts are summarized in the

following list. In Canada, the specification equivalent to 47CFR, Part 15, is

SOR 88/475.

1. Part 2 is an administrative section that details aspects of how to

comply with 47CFR. Included are allocated frequency bands, radio

treaty matters, and general rules and regulations. The rules and

regulations include registration requirements, authorization

procedures, definitions, and various processes to ensure that the

federal code is properly administered.

2. Part 15 regulates products that generate unlicensed radio frequency

energy, both intentional and non-intentional. Information Technology

Equipment (ITE) falls within Part 15.

3. Part 18 regulates Industrial, Scientific, and Medical (ISM) equipment.

These devices use radio waves for proper operation.

4. Part 68 regulates electronic equipment connected to a telephone

network. This part provides a uniform standard for protecting the

telephone network from harm caused by connection of terminal

equipment.

The FCC defines a digital device as

An unintentional radiator (device or system) that generates and

uses timing signal or pulses at a rate in excess of 9,000 pulses

(cycles) per second and uses digital techniques; inclusive of

telephone equipment that uses digital techniques or any device or

system that generates and uses radio frequency energy for the

purpose of performing data processing functions, such as

electronic computations, operations, transformation, recording,

filing, sorting, storage, retrieval or transfer.

Digital computing products are classified into two categories: Class A and

B. The FCC and IC use the same definitions.

Personal account | University of Southern Queensland

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Table of Contents

Chapter 1

1.1: FUNDAMENTAL

DEFINITIONS

1.2: ELEMENTS OF THE

ELECTROMAGNETIC

ENVIRONMENT

1.3: NATURE OF

INTERFERENCE

1.4: REGULATORY

REQUIREMENTS—NORTH

MERIC

1.5: REGULATORY

REQUIREMENTS—

WORLDWIDE

1.6: STANDARDS

1.7: EMISSION

REQUIREMENTS

1.8: IMMUNITY

REQUIREMENTS

1.9: ADDITIONAL

REGULATORY

REQUIREMENTS—NORTH

MERIC

1.10: SUPPLEMENTAL

INFORMATION

REFERENCES

Chapter 1 - Introduction

Printed Circuit Board Design Techniques for EMC Compliance: A Handbook for Designers, Second Edition

by Mark I. Montrose

IEEE Press

Recommend this title?

1.5 REGULATORY REQUIREMENTS—WORLDWIDE

Test requirements, standards, and procedures have been harmonized on a

worldwide basis. The principles discussed herein will allow regulatory

compliance to be achieved with minimal development cost and shorter

design cycles. The harmonization process is based on the work of expert

technical committees reporting to the International Electrotechnical

Commission (IEC).

The IEC works closely with the International Standards Organization (ISO),

which is chartered by the United Nations. Many countries throughout the

world are members. The IEC oversees the work of technical committees

working on a particular product sector. The IEC's objectives are to

"promote international co-operation on all questions of standardization ...

achieved by issuing publications including recommendations in the form of

international standards."

Two IEC technical committees work on EMC standards. The first is TC77,

Electromagnetic compatibility between equipment including networks

. The

second committee is

International Special Committee on Radio

Interference

(Comité International Spécial des Perturbations

Radioélectriques or CISPR). CISPR publications deal primarily with limits

and measurements of the radio interference characteristics of potentially

disturbing sources or emissions. CISPR and IEC standards coexist to

define most technical aspects related to EMC compliance.

The IEC publications themselves have no legal requirements. National

committees do not have to adopt them, although several countries outside

of Europe have incorporated them into their national laws. The important

aspect of IEC standards is that they have been adopted and harmonized

as a European standard for all members of the European Union. Once

published as a harmonized document, a legal requirement now exists.

A separate organization, the Committee for European Electrotechnical

Standardization (Comité Européen de Normalisation Electrotechnique, or

CENELEC), is responsible for developing European standards for electrical

equipment. CENELEC received its charter from the Parliamentary

Commission of the European Union and produces EMC standards for use

with the EMC Directive, usually based on IEC and CISPR publications.

For telecommunications equipment, the European Telecommunications

Standards Institute, or ETSI, is the standards-making body. ETSI develops

standards for telecommunications network equipment not supplied to the

subscriber, in addition to radio communication equipment and broadcast

transmitters.

CENELEC and ETSI adopt IEC and CISPR publications, whenever

possible, as a basis for preparing a formal standard. The CENELEC

committee responsible for preparing EMC standards is TC110. Technical

Committee TC110 has several subcommittees, including SC110A, which is

responsible for immunity requirements of Information Technology

Equipment (ITE).

International EMC publications are commonly referred to as CISPR or IEC,

when in fact the real standard, after adoption and publication by the

European Commission, is prefixed with an EN (European Normalization)

number. To summarize, the European Commission adopts into law

requirements developed by CISPR and the IEC, as well as other European

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