没有合适的资源?快使用搜索试试~ 我知道了~
首页硅实验室Si864x数字隔离器:低功耗,高效替代方案
硅实验室的Si864x系列数字隔离器是一款专为低功耗应用设计的四通道数字隔离器。与传统光电耦合器相比,它在数据速率、传输延迟、功率消耗、尺寸、可靠性和外部物料清单(BOM)成本方面提供了显著的优势。这些隔离器的特点是其工作参数在宽温范围内稳定且在整个产品生命周期内保持一致性,确保设计的简便性和性能的一致性。 Si864x支持高达150Mbps的数据传输速率,具有低于10ns的极低传播延迟,这对于需要快速数据交换的应用非常关键。设备配备施密特触发输入,能有效抵抗噪声干扰,并且仅需为VDD电源线提供旁路电容即可运行。这种设计灵活性使得它们在工业自动化系统和医疗电子设备等应用场景中表现出色。 在功能上,Si864x提供了可配置的输出驱动控制,通过Enable输入实现开关控制,方便用户根据需要启用或禁用输出。此外,该系列产品提供多种隔离等级选择,包括1.0、2.5、3.75和5kV,以满足不同安全电压要求。对于1kV以上的型号,已经获得了UL、CSA、VDE和CQC等权威机构的安全认证,确保了产品的高可靠性。 对于宽体封装的版本,Si864x还具备强化绝缘设计,能够承受高达5kVRMS的电压冲击,进一步增强了其在恶劣环境下的防护能力。硅实验室的Si864x数字隔离器以其高性能、低功耗和高度灵活性,成为替代传统光耦合器的理想解决方案,特别适用于对信号质量和稳定性有极高要求的工业自动化和医疗电子应用领域。
资源详情
资源推荐
![](https://csdnimg.cn/release/download_crawler_static/10337823/bg8.jpg)
3.1 Device Startup
Outputs are
held low during powerup until VDD is above the UVLO threshold for time period tSTART. Following this, the outputs follow
the states of inputs.
3.2 Undervoltage Lockout
Undervoltage Lockout (UVLO) is provided to prevent erroneous operation during device startup and shutdown or when VDD is below its
specified operating circuits range. Both Side A and Side B each have their own undervoltage lockout monitors. Each side can enter or
exit UVLO independently. For example, Side A unconditionally enters UVLO when V
DD1
falls below V
DD1(UVLO–)
and exits UVLO when
V
DD1
rises above V
DD1(UVLO+)
. Side B operates the same as Side A with respect to its V
DD2
supply.
Figure 3.1. Device Behavior during Normal Operation
3.3 Layout Recommendations
To ensure
safety in the end-user application, high-voltage circuits (i.e., circuits with >30 V
AC
) must be physically separated from the
safety extra-low-voltage circuits (SELV is a circuit with <30 V
AC
) by a certain distance (creepage/clearance). If a component, such as a
digital isolator, straddles this isolation barrier, it must meet those creepage/clearance requirements and also provide a sufficiently large
high-voltage breakdown protection rating (commonly referred to as working voltage protection). Table 4.6 Insulation and Safety-Related
Specifications on page 21 and Table 4.8 IEC 60747-5-5 Insulation Characteristics for Si86xxxx
1
on page 22 detail the working volt-
age and creepage/clearance capabilities of the Si86xx. These tables also detail the component standards (UL1577, IEC60747, CSA
5A), which are readily accepted by certification bodies to provide proof for end-system specifications requirements. Refer to the end-
system specification (61010-1, 60950-1, 60601-1, etc.) requirements before starting any design that uses a digital isolator.
3.3.1 Supply Bypass
The Si864x family requires a 0.1 µF bypass capacitor between V
DD1
and GND1 and V
DD2
and GND2. The capacitor should be placed
as close as possible to the package. To enhance the robustness of a design, the user may also include resistors (50–300 Ω ) in series
with the inputs and outputs if the system is excessively noisy.
3.3.2 Output Pin Termination
The nominal output impedance of an isolator driver channel is approximately 50 Ω, ±40%, which is a combination of the value of the on-
chip series termination resistor and channel resistance of the output driver FET. When driving loads where transmission line effects will
be a factor, output pins should be appropriately terminated with controlled impedance PCB traces.
3.4 Fail-Safe Operating Mode
Si86xx devices feature a selectable (by ordering option) mode whereby the default output state (when the input supply is unpowered)
can either be a logic high or logic low when the output supply is powered. See Table 3.1 Si86xx Logic Operation on page 5 and
1. Ordering Guide for more information.
Si864x Data Sheet
Device Operation
silabs.com | Smart. Connected. Energy-friendly. Rev. 1.9 | 7
![](https://csdnimg.cn/release/download_crawler_static/10337823/bg9.jpg)
3.5 Typical Performance Characteristics
The typical
performance characteristics depicted in the following diagrams are for information purposes only. Refer to 4. Electrical
Specifications for actual specification limits.
Figure 3.2. Si8640/45 Typical VDD1 Supply Current vs. Data
Rate 5, 3.3, and 2.5 V Operation
Figure 3.3. Si8640/45 Typical VDD2 Supply Current vs. Data
Rate 5, 3.3, and 2.5 V
Figure 3.4. Si8641 Typical VDD1 Supply Current vs. Data
Rate 5, 3.3, and 2.5 V Operation
Figure 3.5. Si8641 Typical VDD2 Supply Current vs. Data Rate
5, 3.3, and 2.5 V Operation (15 pF Load)
Figure 3.6. Si8642 Typical VDD1 or VDD2 Supply Current vs.
Data Rate 5, 3.3, and 2.5 V Operation (15 pF Load)
Figure 3.7. Propagation Delay vs. Temperature (5.0 V Data)
Si864x Data Sheet
Device Operation
silabs.com | Smart. Connected. Energy-friendly. Rev. 1.9 | 8
剩余41页未读,继续阅读
![pdf](https://img-home.csdnimg.cn/images/20210720083512.png)
![pdf](https://img-home.csdnimg.cn/images/20210720083512.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://csdnimg.cn/download_wenku/file_type_ask_c1.png)
![](https://profile-avatar.csdnimg.cn/default.jpg!1)
zhuyongs168
- 粉丝: 3
- 资源: 8
上传资源 快速赚钱
我的内容管理 展开
我的资源 快来上传第一个资源
我的收益
登录查看自己的收益我的积分 登录查看自己的积分
我的C币 登录后查看C币余额
我的收藏
我的下载
下载帮助
![](https://csdnimg.cn/release/wenkucmsfe/public/img/voice.245cc511.png)
最新资源
- Hadoop生态系统与MapReduce详解
- MDS系列三相整流桥模块技术规格与特性
- MFC编程:指针与句柄获取全面解析
- LM06:多模4G高速数据模块,支持GSM至TD-LTE
- 使用Gradle与Nexus构建私有仓库
- JAVA编程规范指南:命名规则与文件样式
- EMC VNX5500 存储系统日常维护指南
- 大数据驱动的互联网用户体验深度管理策略
- 改进型Booth算法:32位浮点阵列乘法器的高速设计与算法比较
- H3CNE网络认证重点知识整理
- Linux环境下MongoDB的详细安装教程
- 压缩文法的等价变换与多余规则删除
- BRMS入门指南:JBOSS安装与基础操作详解
- Win7环境下Android开发环境配置全攻略
- SHT10 C语言程序与LCD1602显示实例及精度校准
- 反垃圾邮件技术:现状与前景
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈
![](https://img-home.csdnimg.cn/images/20220527035711.png)
![](https://img-home.csdnimg.cn/images/20220527035711.png)
![](https://img-home.csdnimg.cn/images/20220527035111.png)
安全验证
文档复制为VIP权益,开通VIP直接复制
![](https://csdnimg.cn/release/wenkucmsfe/public/img/green-success.6a4acb44.png)