CC2530: 2.4 GHz IEEE 802.15.4 System-on-Chip for ZigBee Applications

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"CC2530数据手册详细介绍了这款芯片，它是针对2.4GHz IEEE 802.15.4和ZigBee应用的真正的系统级芯片解决方案。" CC2530是德州仪器（TI）推出的一款集成微控制器与射频收发器的SoC（System on Chip）芯片，特别适用于2.4GHz的无线通信，如IEEE 802.15.4标准和ZigBee网络。该芯片提供了多样化的功能和高效的性能，使得它成为构建低功耗无线传感器网络的理想选择。在硬件特性方面，CC2530具有以下关键特点： 1. **MAC定时器和通用定时器**：包括一个16位定时器和两个8位定时器，这些定时器对于实时控制和系统管理至关重要。 2. **RF/布局**：内置了符合IEEE 802.15.4标准的2.4GHz射频收发器，保证了无线通信的兼容性。 3. **32kHz睡眠定时器**：支持低功耗模式，确保设备在待机时节能。 4. **优秀的接收灵敏度和抗干扰能力**：确保在复杂的无线环境中保持稳定通信。 5. **数字RSSI/LQI支持**：可编程的输出功率最高可达4.5dBm，提供准确的信号强度指示。 6. **电池监控和温度传感器**：为电池供电的设备提供电量监测和环境温度监测功能。 7. **12位ADC与8个通道**：允许进行多种模拟信号的数字化处理，分辨率可配置。 8. **单一晶体需求**：简化了外部组件，降低了系统成本和复杂性。 9. **强大的USART**：支持多种串行协议，便于与其他设备进行通信。 10. **21个通用I/O引脚**：提供了灵活的接口，可以驱动不同类型的外设。软件和安全方面，CC2530集成了： 1. **AES安全协处理器**：提供高级加密标准，增强了无线网络的安全性。 2. **CSMA/CA硬件支持**：实现载波监听多址/冲突避免机制，降低网络中的碰撞概率。封装形式为6mm×6mm的QFN40封装，小巧且易于焊接。此外，CC2530还符合多种全球无线电频率规定，如欧洲的ETSI EN300328和EN300440标准，确保产品在全球范围内具备合规性。 CC2530是一款设计精良、功能全面的无线SoC芯片，适用于需要高效能、低功耗和高可靠性的无线连接应用，如智能家居、工业自动化和物联网设备。其丰富的功能集和对各种无线标准的支持使其成为开发人员构建2.4GHz无线解决方案的首选平台。

CC2530F32, CC2530F64

CC2530F128, CC2530F256

www.ti.com

SWRS081B –APRIL 2009–REVISED FEBRUARY 2011

RF TRANSMIT SECTION

Measured on Texas Instruments CC2530 EM reference design with T

= 25°C, VDD = 3 V and f

= 2440 MHz, unless

otherwise noted.

Boldface limits apply over the entire operating range, T

= –40°C to 125°C, VDD = 2 V to 3.6 V and f

= 2394 MHz to 2507

MHz.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Delivered to a single-ended 50-Ω load through a balun using

0 4.5 8

maximum-recommended output-power setting

Nominal output power dBm

–8 10

[1] requires minimum –3 dBm

Programmable output power 32 dB

range

Spurious emissions Max recommended output power setting

(1)

Measured conducted 25 MHz–1000 MHz (outside restricted bands) –60

according to stated

25 MHz–2400 MHz (within FCC restricted bands) –60

regulations. Only largest

25 MHz–1000 MHz (within ETSI restricted bands) –60

spurious emission stated

1800–1900 MHz (ETSI restricted band) –57

within each band.

5150–5300 MHz (ETSI restricted band)

–55

dBm

At 2 × f

and 3 × f

(FCC restricted band)

–42

At 2 × f

and 3 × f

(ETSI EN 300-440 and EN 300-328)

(2)

–31

1 GHz–12.75 GHz (outside restricted bands)

–53

At 2483.5 MHz and above (FCC restricted band)

= 2480 MHz

(3)

–42

Measured as defined by [1] using maximum-recommended

output-power setting

Error vector magnitude (EVM) 2%

[1] requires maximum 35%.

Differential impedance as seen from the RF port (RF_P and RF_N)

Optimum load impedance 69 + j29 Ω

towards the antenna

(1) Texas Instruments CC2530 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC

CFR47 Part 15 and ARIB STD-T-66.

(2) Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass filter connected

between matching network and RF connector (1.8 pF in parallel with 1.6 nH); this filter must be connected to a good RF ground.

(3) Margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz can be improved by using a lower

output-power setting or having less than 100% duty cycle.

Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256

CC2530F32, CC2530F64

CC2530F128, CC2530F256

SWRS081B –APRIL 2009–REVISED FEBRUARY 2011

www.ti.com

32-MHz CRYSTAL OSCILLATOR

Measured on Texas Instruments CC2530 EM reference design with T

= 25°C and VDD = 3 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Crystal frequency 32 MHz

Crystal frequency accuracy

–40 40 ppm

requirement

(1)

ESR Equivalent series resistance 6 60 Ω

Crystal shunt capacitance 1 7 pF

Crystal load capacitance 10 16 pF

Start-up time 0.3 ms

The crystal oscillator must be in power down for a

guard time before it is used again. This

Power-down guard time requirement is valid for all modes of operation. The 3 ms

need for power-down guard time can vary with

crystal type and load.

(1) Including aging and temperature dependency, as specified by [1]

32.768-kHz CRYSTAL OSCILLATOR

Measured on Texas Instruments CC2530 EM reference design with T

= 25°C and VDD = 3 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Crystal frequency 32.768 kHz

Crystal frequency accuracy

–40 40 ppm

requirement

(1)

ESR Equivalent series resistance 40 130 kΩ

Crystal shunt capacitance 0.9 2 pF

Crystal load capacitance 12 16 pF

Start-up time 0.4 s

(1) Including aging and temperature dependency, as specified by [1]

32-kHz RC OSCILLATOR

Measured on Texas Instruments CC2530 EM reference design with T

= 25°C and VDD = 3 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Calibrated frequency

(1)

32.753 kHz

Frequency accuracy after calibration ±0.2%

Temperature coefficient

(2)

0.4 %/°C

Supply-voltage coefficient

(3)

3 %/V

Calibration time

(4)

2 ms

(1) The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977.

(2) Frequency drift when temperature changes after calibration

(3) Frequency drift when supply voltage changes after calibration

(4) When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator

is performed while SLEEPCMD.OSC32K_CALDIS is 0.

Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256

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