ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
THERMAL CHARACTERISTICS
SN75DP118
SLLS916B – SEPTEMBER 2008 – REVISED APRIL 2009 ................................................................................................................................................
www.ti.com
ORDERING INFORMATION
PART NUMBER PART MARKING PACKAGE
(1)
SN75DP118RHHR DP118 36-pin QFN Reel (large)
SN75DP118RHHT DP118 36-pin QFN Reel (small)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
Supply Voltage Range
(2)
V
CC
, V
DD
– 0.3 to 5.5 V
Main Link I/O (ML_IN x, ML_OUT x) Differential Voltage 1.5 V
Voltage Range HPD and CAD I/O – 0.3 to VCC + 0.3 V
Control I/O – 0.3 to VCC + 0.3 V
Human body model
(3)
± 12000 V
Electrostatic discharge Charged-device model
(4)
± 1000 V
Machine model
(5)
± 200 V
Continuous power dissipation See Dissipation Rating Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B.
(4) Tested in accordance with JEDEC Standard 22, Test Method C101-A.
(5) Tested in accordance with JEDEC Standard 22, Test Method A115-A.
DERATING FACTOR
(1)
T
A
= 85 ° C
PACKAGE PCB JEDEC STANDARD T
A
< 25 ° C
ABOVE T
A
= 25 ° C POWER RATING
Low-K 759 mW 7.5 mW/ ° C 303 mW
36-pin QFN (RHH)
High-K 2127 mW 21.2 mW/ ° C 851 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX
(1)
UNIT
R
θ JB
Junction-to-board thermal resistance 4x4 Thermal vias under powerpad 28.11 ° C/W
R
θ JC
Junction-to-case thermal resistance 32.77 ° C/W
LP = 5.5 V; ML: V
PP
= 1200 mV, 2.7 Gbps,
PRBS; HPD_IN/CAD_IN/CAD_INV = 5.5 V;
P
D
Device power dissipation 240 280 mW
V
CC
= 5.5 V,
V
DD
= 5.25 V; Temp = 85 ° C; DP
adj
= 6.49 k Ω
LP = 0V; HPD_IN/CAD_IN/CAD_INV = 5.5V ;
Device power dissipation under low
V
CC
= 5.5V ,
P
SD
40 µ W
power
V
DD
= 5.2 V; Temp = 85 ° C; DP
adj
= 6.49 k Ω
(1) Maximum Rating is simulated under worse case condition.
4 Submit Documentation Feedback Copyright © 2008 – 2009, Texas Instruments Incorporated
Product Folder Link(s): SN75DP118
剩余19页未读，继续阅读
不觉明了
- 粉丝: 3278
- 资源: 5614
我的内容管理
收起
- 我的资源
快来上传第一个资源
我的收益 登录查看自己的收益
我的积分
登录查看自己的积分
我的C币
登录后查看C币余额
我的收藏 
我的下载 
下载帮助
会员权益专享
最新资源
- 谷歌文件系统下的实用网络编码技术在分布式存储中的应用
- 跨国媒体对南亚农村社会的影响：以斯里兰卡案例的社会学分析
- RFM2g接口驱动操作手册：API与命令行指南
- 基于裸手的大数据自然人机交互关键算法研究
- ABAQUS下无人机机翼有限元分析与局部设计研究
- TCL基础教程：语法、变量与操作详解
- FPGA与数字前端面试题集锦：流程、设计与Verilog应用
- 2022全球互联网技术人才前瞻：元宇宙驱动下的创新与挑战
- 碳排放权交易实战手册（第二版）：设计与实施指南
- 2022新经济新职业洞察：科技驱动下的百景变革
- 红外与可见光人脸融合识别技术探究
- NXP88W8977：2.4/5 GHz 双频 Wi-Fi4 + Bluetooth 5.2 合体芯片
- NXP88W8987：集成2.4/5GHz Wi-Fi 5与蓝牙5.2的单芯片解决方案
- TPA3116D2DADR: 单声道数字放大器驱动高达50W功率
- TPA3255-Q1：315W车载A/D类音频放大器，高保真、宽频设计
- 42V 输入 5A 降压稳压器 TPS54540B-Q1 的特点和应用
资源上传下载、课程学习等过程中有任何疑问或建议，欢迎提出宝贵意见哦~我们会及时处理！
点击此处反馈
