Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Introduction
1.6 Intellectual Property
The Consortium draws attention to the fact that it is claimed that compliance with this
specification may involve the use of a patent claim(s) ("IPR"). The Consortium takes no
position concerning the evidence, validity or scope of this IPR.
The holder of this IPR has assured the Consortium that it is willing to license or sublicense all
such IPR to those licensees (Members and non-Members alike) desiring to implement this
specification. The statement of the holder of this IPR to such effect has been filed with the
Consortium.
Attention is also drawn to the possibility that some of the elements of this specification may
be the subject of IPR other than those identified below. The Consortium shall not be
responsible for identifying any or all such IPR.
No representation is made as to the availability of any license rights for use of any IPR
inherent in this specification for any purpose other than to implement this specification.
This specification conforms to the current PICMG® Intellectual Property Rights Policy and
the Policies and Procedures for Specification Development and does not contain any known
intellectual property that is not available for licensing under Reasonable and Non-
discriminatory terms. In the course of Membership Review the following disclosures were
made:
1.6.1 Necessary Claims (referring to mandatory or recommended features)
Tyco Electronics has the following patents, which may cover some aspects of the PICMG® COM
Express® Module and Carrier Board Connector as detailed in Section 6. Contact Tyco
Electronics for further information.
• USA patent 6,095,832 “Cap housing for electrical connectors”
• USA patent 6,159,021 “Electrical connector for printed circuit boards”
• USA patent 6,558,195 “Electrical connector for printed circuit boards”
• Japan patent 11-040243 “ELECTRICAL CONNECTOR CAP AND ELECTRICAL
CONNECTOR ASSEMBLY”
• Japan patent 11-074027 “BOARD-MOUNTING TYPE CONNECTOR”
• Japan patent 11-260464 “CAP ON ELECTRIC CONNECTOR”
• Japan patent 11-354227 “BASE BOARD INSTALLING TYPE CONNECTOR
ASSEMBLY”
• Japan patent 2000-003751 “SUBSTRATE MOUNTING TYPE CONNECTOR
ASSEMBLY”
• Japan patent 2000-048876 “ELECTRICAL CONNECTOR FOR CONNECTING
MUTUAL BOARDS”
Foxconn Electronics (Hon Hai Precision) has the following patents, which may cover some
aspects of the PICMG® COM Express® Module and Carrier Board Connector as detailed in
Section 6. Contact Foxconn Electronics for further information.
• USA patent 7,578,701 “Electrical connector for PCB”
• China patent 200720131412.4 “Electrical Connector for PCB”
• Taiwan patent M339102 “Electrical Connector for PCB”
1.6.2 Unnecessary Claims (referring to optional features or non-normative
elements)
No disclosures in this category were made during subcommittee review.
8 PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012
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