- 3 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
Table Of Contents
datasheet
eMMC
Rev. 1.0
KLMxGxJENB-B041
SAMSUNG CONFIDENTIAL
1.0 PRODUCT LIST..........................................................................................................................................................4
2.0 KEY FEATURES.........................................................................................................................................................4
3.0 PACKAGE CONFIGURATIONS ................................................................................................................................. 5
3.1 153 Ball Pin Configuration ....................................................................................................................................... 5
3.1.1 11.5mm x 13mm x 0.8mm Package Dimension ............................................................................................... 6
3.1.2 11.5mm x 13mm x 1.0mm Package Dimension ............................................................................................... 6
3.1.3 11.5mm x 13mm x 1.2mm Package Dimension ............................................................................................... 7
3.2 Product Architecture ................................................................................................................................................ 8
4.0 HS400 mode...............................................................................................................................................................9
5.0 New eMMC5.1 Features ............................................................................................................................................. 10
5.1 Overview.................................................................................................................................................................. 10
5.2 Command Queuing ................................................................................................................................................. 10
5.2.1 CMD Set Description......................................................................................................................................... 10
5.2.2 New Response : QSR (Queue Status Register) .............................................................................................. 10
5.2.3 Send Status : CMD13 ...................................................................................................................................... 10
5.2.4 Mechanism of CMD Queue operation............................................................................................................... 11
5.2.5 CMD Queue Register description ..................................................................................................................... 11
5.3 Enhanced Strobe Mode........................................................................................................................................... 11
5.4 RPMB Throughput improve ..................................................................................................................................... 11
5.5 Secure Write Protection........................................................................................................................................... 12
6.0 Technical Notes ..........................................................................................................................................................13
6.1 S/W Algorithm.......................................................................................................................................................... 13
6.1.1 Partition Management ....................................................................................................................................... 13
6.1.1.1 Boot Area Partition and RPMB Area Partition ............................................................................................ 13
6.1.1.2 Enhanced Partition (Area) .......................................................................................................................... 13
6.1.2 Boot operation................................................................................................................................................... 14
6.1.3 User Density...................................................................................................................................................... 15
6.1.4 Auto Power Saving Mode.................................................................................................................................. 15
6.1.5 Performance..............................................................................................................
........................................ 16
7.0 REGISTER VALUE..................................................................................................................................................... 17
7.1 OCR Register .......................................................................................................................................................... 17
7.2 CID Register ............................................................................................................................................................ 17
7.2.1 Product name table (In CID Register) ............................................................................................................... 17
7.3 CSD Register........................................................................................................................................................... 18
7.4 Extended CSD Register .......................................................................................................................................... 19
8.0 AC PARAMETER........................................................................................................................................................ 24
8.1 Timing Parameter .................................................................................................................................................... 24
8.2 Previous Bus Timing Parameters for DDR52 and HS200 mode are defined by JEDEC standard.......................... 24
8.3 Bus Timing Specification in HS400 mode ............................................................................................................... 24
8.3.1 HS400 Device Input Timing .............................................................................................................................. 24
8.3.2 HS400 Device Output Timing............................................................................................................................ 25
8.4 Bus signal levels...................................................................................................................................................... 26
8.4.1 Open-drain mode bus signal level..................................................................................................................... 26
8.4.2 Push-pull mode bus signal level eMMC ............................................................................................................ 26
9.0 DC PARAMETER .......................................................................................................................................................27
9.1 Active Power Consumption during operation .......................................................................................................... 27
9.2 Standby Power Consumption in auto power saving mode and standby state........................................................ 27
9.3 Sleep Power Consumption in Sleep State.............................................................................................................. 27
9.4 Bus Signal Line Load............................................................................................................................................... 28
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