2018年802.3标准：200Gbps和400Gbps Ethernet物理层规格概述

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本篇文档是IEEE 802.3标准的第八部分，涵盖了Clause 116至Clause 126以及Annex 119A至Annex 120E。主要内容聚焦于200 Gb/s和400 Gb/s网络技术，以及与之相关的物理层规格，同时包括了对2.5 Gb/s和5 Gb/s操作的概述。在Clause 116（200 Gb/s和400 Gb/s网络介绍）中，首先阐述了该标准的适用范围，明确了与ISO/OSI参考模型的关系，介绍了术语定义，如物理层信号系统。这部分详细解释了不同的子层，如Reconciliation Sublayer (RS) 和 Media Independent Interface (MII)，以及其扩展版本如200 GMII和400 GMII。PCS（Physical Coding Sublayer，物理编码子层）负责数据的编码和解码，PMA（Physical Medium Attachment，物理介质接入）子层处理与传输媒介的交互，而PMD（Physical Medium Dependent，物理介质依赖）子层确保与特定物理介质的兼容性。接着，Clause 116.2进一步描述了管理接口（MDIO/MDC），包括如何进行设备管理和数据通信。这部分强调了服务接口规范方法和符号表示，定义了不同子层间的交互和服务接口实例，以及接口原语的语义。 Clause 116.3专门讨论服务接口的规范，如何定义子层之间的服务接口，以及实例化这些接口时的含义。这部分对于理解和设计实现高效、兼容的网络架构至关重要。此外，文档还包含了针对2.5 Gb/s和5 Gb/s速率的通用信息，尽管这部分的详细程度可能不如200 Gb/s和400 Gb/s那样深入。这部分内容同样关注物理层规范，确保了标准的全面性和适用性。整个Section 8的内容不仅深入剖析了高速以太网技术的底层细节，也涉及了管理和维护方面的要求，为工程师提供了设计和实施高带宽网络的完整指导。通过阅读和理解这部分内容，技术人员可以掌握最新的以太网标准，从而优化网络性能并确保设备间的兼容性。

126.12.3.3 Other PCS functions ............................................................................................... 333

126.12.4 Physical Medium Attachment (PMA) ............................................................................. 333

126.12.5 PMA Electrical Specifications.........................................................................................335

126.12.6 PMA Management Interface............................................................................................ 336

126.12.7 Characteristics of the link segment.................................................................................. 337

126.12.8 MDI requirements............................................................................................................ 338

126.12.9 General safety and environmental requirements ............................................................. 339

126.12.10 Timing requirements...................................................................................................... 339

Annex 119A (informative) 200GBASE-R and 400GBASE-R PCS FEC codeword examples ................. 340

Annex 120A (informative) 200 Gb/s and 400 Gb/s PMA sublayer partitioning examples........................ 346

120A.1 Partitioning example supporting 400GBASE-SR16................................................................ 346

120A.2 Partitioning examples supporting 200GBASE-DR4/FR4/LR4 and 400GBASE-FR8/LR8 .... 347

120A.3 Partitioning examples supporting 400GBASE-DR4................................................................ 349

120A.4 Partitioning example using 200GXS and 400GXS.................................................................. 350

Annex 120B (normative) Chip-to-chip 200 Gb/s eight-lane Attachment Unit Interface (200GAUI-8

C2C) and 400 Gb/s sixteen-lane Attachment Unit Interface (400GAUI-16 C2C)......................... 351

120B.1 Overview.................................................................................................................................. 351

120B.2 200GAUI-8 and 400GAUI-16 chip-to-chip compliance point definition ............................... 353

120B.3 200GAUI-8 and 400GAUI-16 chip-to-chip electrical characteristics ..................................... 354

120B.3.1 200GAUI-8 and 400GAUI-16 C2C transmitter characteristics ..................................... 354

120B.3.2 200GAUI-8 and 400GAUI-16 C2C receiver characteristics .......................................... 354

120B.4 200GAUI-8 and 400GAUI-16 chip-to-chip channel characteristics ....................................... 355

120B.5 Protocol implementation conformance statement (PICS) proforma for Annex 120B, Chip-

to-chip 200 Gb/s eight-lane Attachment Unit Interface (200GAUI-8 C2C) and 400 Gb/s

sixteen-lane Attachment Unit Interface (400GAUI-16 C2C) .................................................. 356

120B.5.1 Introduction..................................................................................................................... 356

120B.5.2 Identification................................................................................................................... 356

120B.5.2.1 Implementation identification.............................................................................. 356

120B.5.2.2 Protocol summary ................................................................................................. 356

120B.5.3 Major capabilities/options............................................................................................... 357

120B.5.4 PICS proforma tables for Chip-to-chip 200 Gb/s eight-lane Attachment Unit

Interface (200GAUI-8 C2C) and 400 Gb/s sixteen-lane Attachment Unit Interface

(400GAUI-16 C2C) ........................................................................................................ 357

120B.5.4.1 Transmitter............................................................................................................ 357

120B.5.4.2 Receiver ............................................................................................................

.... 358

120B.5.4.3 Channel ................................................................................................................. 358

Annex 120C (normative) Chip-to-module 200 Gb/s eight-lane Attachment Unit Interface (200GAUI-

8 C2M) and 400 Gb/s sixteen-lane Attachment Unit Interface (400GAUI-16 C2M) .................... 359

120C.1 Overview.................................................................................................................................. 359

120C.1.1 Bit error ratio .................................................................................................................. 361

120C.2 200GAUI-8 and 400GAUI-16 chip-to-module compliance point definitions......................... 361

120C.3 200GAUI-8 and 400GAUI-16 chip-to-module electrical characteristics ................................ 361

120C.3.1 200GAUI-8 and 400GAUI-16 C2M host output characteristics .................................... 361

120C.3.2 200GAUI-8 and 400GAUI-16 C2M module output characteristics............................... 361

120C.3.3 200GAUI-8 and 400GAUI-16 C2M host input characteristics ...................................... 361

120C.3.4 200GAUI-8 and 400GAUI-16 C2M module input characteristics................................. 362

120C.4 200GAUI-8 and 400GAUI-16 C2M measurement methodology............................................ 362

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120C.5 Protocol implementation conformance statement (PICS) proforma for Annex 120C, Chip-

to-module 200 Gb/s eight-lane Attachment Unit Interface (200GAUI-8 C2M) and

400 Gb/s sixteen-lane Attachment Unit Interface (400GAUI-16 C2M).................................. 363

120C.5.1 Introduction..................................................................................................................... 363

120C.5.2 Identification................................................................................................................... 363

120C.5.2.1 Implementation identification.............................................................................. 363

120C.5.2.2 Protocol summary ................................................................................................. 363

120C.5.3 Major capabilities/options............................................................................................... 364

120C.5.4 PICS proforma tables for Chip-to-module 200 Gb/s eight-lane Attachment Unit

Interface (200GAUI-8 C2M) and 400 Gb/s sixteen-lane Attachment Unit Interface

(400GAUI-16 C2M) ....................................................................................................... 364

120C.5.4.1 Host output............................................................................................................ 364

120C.5.4.2 Module output....................................................................................................... 365

120C.5.4.3 Host input.............................................................................................................. 365

120C.5.4.4 Module input.........................................................................................................365

Annex 120D (normative) Chip-to-chip 200 Gb/s four-lane Attachment Unit Interface (200GAUI-4

C2C) and 400 Gb/s eight-lane Attachment Unit Interface (400GAUI-8 C2C) .............................. 366

120D.1 Overview.................................................................................................................................. 366

120D.2 200GAUI-4 and 400GAUI-8 chip-to-chip compliance point definition ................................. 369

120D.3 200GAUI-4 and 400GAUI-8 chip-to-chip electrical characteristics ....................................... 369

120D.3.1 200GAUI-4 and 400GAUI-8 C2C transmitter characteristics ....................................... 369

120D.3.1.1 Transmitter differential output return loss ............................................................ 370

120D.3.1.2 Transmitter linearity ............................................................................................. 371

120D.3.1.2.1 Measurement of mean signal levels.............................................................. 371

120D.3.1.3 Linear fit to the measured waveform .................................................................... 372

120D.3.1.4 Steady-state voltage and linear fit pulse peak....................................................... 372

120D.3.1.5 Transmitter equalization settings .......................................................................... 372

120D.3.1.6 Transmitter output noise and distortion ................................................................ 374

120D.3.1.7 Transmitter output residual ISI ............................................................................. 374

120D.3.1.8 Output jitter........................................................................................................... 374

120D.3.1.8.1 J4u and JRMS jitter....................................................................................... 375

120D.3.1.8.2 Even-odd Jitter.............................................................................................. 376

120D.3.2 200GAUI-4 and 400GAUI-8 C2C receiver characteristics ............................................ 376

120D.3.2.1 Receiver interference tolerance ............................................................................ 376

120D.3.2.2 Receiver jitter tolerance ............................

............................................................ 378

120D.3.2.3 Transmitter equalization feedback (optional) ....................................................... 378

120D.4 200GAUI-4 and 400GAUI-8 chip-to-chip channel characteristics ......................................... 379

120D.4.1 Channel Operating Margin ............................................................................................. 379

120D.4.2 Channel return loss ......................................................................................................... 380

120D.5 Protocol implementation conformance statement (PICS) proforma for Annex 120D, Chip-

to-chip 200 Gb/s four-lane Attachment Unit Interface (200GAUI-4 C2C) and 400 Gb/s

eight-lane Attachment Unit Interface (400GAUI-8 C2C) ....................................................... 382

120D.5.1 Introduction..................................................................................................................... 382

120D.5.2 Identification................................................................................................................... 382

120D.5.2.1 Implementation identification.............................................................................. 382

120D.5.2.2 Protocol summary ................................................................................................. 382

120D.5.3 Major capabilities/options............................................................................................... 383

120D.5.4 PICS proforma tables for Chip-to-chip 200 Gb/s four-lane Attachment Unit

Interface (200GAUI-4 C2C) and 400 Gb/s eight-lane Attachment Unit Interface

(400GAUI-8 C2C) .......................................................................................................... 383

120D.5.4.1 Transmitter............................................................................................................ 383

120D.5.4.2 Receiver ................................................................................................................ 384

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120D.5.4.3 Channel ................................................................................................................. 384

Annex 120E (normative) Chip-to-module 200 Gb/s four-lane Attachment Unit Interface (200GAUI-4

C2M) and 400 Gb/s eight-lane Attachment Unit Interface (400GAUI-8 C2M) ............................ 385

120E.1 Overview.................................................................................................................................. 385

120E.1.1 Bit error ratio .................................................................................................................. 387

120E.2 200GAUI-4 and 400GAUI-8 chip-to-module compliance point definitions........................... 387

120E.3 200GAUI-4 and 400GAUI-8 chip-to-module electrical characteristics .................................. 388

120E.3.1 200GAUI-4 and 400GAUI-8 C2M host output characteristics ...................................... 388

120E.3.1.1 Signaling rate and range ....................................................................................... 389

120E.3.1.2 Signal levels.......................................................................................................... 389

120E.3.1.3 Output return loss.................................................................................................. 390

120E.3.1.4 Differential termination mismatch........................................................................ 390

120E.3.1.5 Transition time......................................................................................................390

120E.3.1.6 Host output eye width and eye height................................................................... 390

120E.3.1.7 Reference receiver for eye width and eye height evaluation ................................ 391

120E.3.2 200GAUI-4 and 400GAUI-8 C2M module output characteristics................................. 393

120E.3.2.1 Module output eye width, eye height, and pre-cursor ISI ratio ............................ 394

120E.3.2.1.1 Reference receiver for module output evaluation......................................... 395

120E.3.2.1.2 Far-end pre-cursor ISI ratio .......................................................................... 395

120E.3.3 200GAUI-4 and 400GAUI-8 C2M host input characteristics ........................................ 395

120E.3.3.1 Input return loss ....................................................................................................395

120E.3.3.2 Host stressed input test ......................................................................................... 396

120E.3.3.2.1 Host stressed input test procedure ................................................................ 396

120E.3.4 200GAUI-4 and 400GAUI-8 C2M module input characteristics................................... 398

120E.3.4.1 Module stressed input test..................................................................................... 398

120E.3.4.1.1 Module stressed input test procedure............................................................ 398

120E.4 200GAUI-4 and 400GAUI-8 C2M measurement methodology.............................................. 400

120E.4.1 HCB/MCB characteristics .............................................................................................. 400

120E.4.2 Eye width and eye height measurement method ............................................................ 401

120E.4.3 Vertical eye closure ........................................................................................................ 403

120E.5 Protocol implementation conformance statement (PICS) proforma for Annex 120E, Chip-

to-module 200 Gb/s four-lane Attachment Unit Interface (200GAUI-4 C2M) and

400 Gb/s eight-lane Attachment Unit Interface (400GAUI-8 C2M) ....................................... 405

120E.5.1 Introduction..................................................................................................................... 405

120E.5.2 Identification........................................................................................................

........... 405

120E.5.2.1 Implementation identification.............................................................................. 405

120E.5.2.2 Protocol summary ................................................................................................. 405

120E.5.3 Major capabilities/options............................................................................................... 406

120E.5.4 PICS proforma tables for Chip-to-module 200 Gb/s four-lane Attachment Unit

Interface (200GAUI-4 C2M) and 400 Gb/s eight-lane Attachment Unit Interface

(400GAUI-8 C2M) ......................................................................................................... 406

120E.5.4.1 Host output............................................................................................................ 406

120E.5.4.2 Module output....................................................................................................... 407

120E.5.4.3 Host input.............................................................................................................. 407

120E.5.4.4 Module input.........................................................................................................407

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IEEE Std 802.3-2018, IEEE Standard for Ethernet

SECTION EIGHT

116. Introduction to 200 Gb/s and 400 Gb/s networks

116.1 Overview

116.1.1 Scope

This clause describes the general requirements for 200 Gigabit and 400 Gigabit Ethernet.

200 Gigabit Ethernet uses the IEEE 802.3 MAC sublayer operating at a data rate of 200 Gb/s, coupled with

any IEEE 802.3 200GBASE Physical Layer implementation and is defined for full duplex operation only.

400 Gigabit Ethernet uses the IEEE 802.3 MAC sublayer operating at a data rate of 400 Gb/s, coupled

with any IEEE 802.3 400GBASE Physical Layer implementation and is defined for full duplex operation

only.

116.1.2 Relationship of 200 Gigabit and 400 Gigabit Ethernet to the ISO OSI reference

model

200 Gigabit and 400 Gigabit Ethernet couples the IEEE 802.3 MAC to a family of 200 Gb/s and 400 Gb/s

Physical Layers. The relationships among 200 Gigabit and 400 Gigabit Ethernet, the IEEE 802.3 MAC, and

the ISO Open System Interconnection (OSI) reference model are shown in Figure 116–1.

While this specification defines interfaces in terms of bits, octets, and frames, implementations may choose

other data-path widths for implementation convenience. The only exceptions are as follows:

Figure 116–1—Architectural positioning of 200 Gigabit and 400 Gigabit Ethernet

ETHERNET

LAYERS

LLC OR OTHER MAC CLIENT

MAC

HIGHER LAYERS

MAC CONTROL (OPTIONAL)

PRESENTATION

APPLICATION

SESSION

TRANSPORT

NETWORK

DATA LINK

PHYSICAL

OSI

REFERENCE

MODEL

LAYERS

PCS = PHYSICAL CODING SUBLAYER

PHY = PHYSICAL LAYER DEVICE

PMA = PHYSICAL MEDIUM ATTACHMENT

PMD = PHYSICAL MEDIUM DEPENDENT

RECONCILIATION

PMD

400GBASE-R PCS

400GBASE-R

PHY

MEDIUM

MDI

400GMII

PMA

200GMII = 200 Gb/s MEDIA INDEPENDENT INTERFACE

400GMII = 400 Gb/s MEDIA INDEPENDENT INTERFACE

LLC = LOGICAL LINK CONTROL

MAC = MEDIA ACCESS CONTROL

MDI = MEDIUM DEPENDENT INTERFACE

PMD

200GBASE-R PCS

200GBASE-R

PHY

MEDIUM

MDI

200GMII

PMA

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IEEE Std 802.3-2018, IEEE Standard for Ethernet

SECTION EIGHT

a) The 200GMII and 400GMII, which, when implemented as logical interconnection points between

the MAC sublayer and the Physical Layer (PHY), use a 64-bit wide data path as specified in

Clause 117. Physical instantiations of this interface may use other data-path widths.

b) The management interface, which, when physically implemented as the MDIO/MDC (Management

Data Input/Output and Management Data Clock) at an observable interconnection port, uses a bit-

wide data path as specified in Clause 45.

c) The PMA service interface, which, when physically implemented as 400GAUI-16 (400 Gb/s

sixteen-lane Attachment Unit Interface) at an observable interconnection port, uses a 16-lane data

path as specified in Annex 120B or Annex 120C.

d) The PMA service interface, which, when physically implemented as 200GAUI-8 (200 Gb/s

eight-lane Attachment Unit Interface) or 400GAUI-8 (400 Gb/s eight-lane Attachment Unit

Interface) at an observable interconnection port, uses an 8-lane data path as specified in

Annex 120B, Annex 120C, Annex 120D, or Annex 120E.

e) The PMA service interface, which, when physically implemented as 200GAUI-4 (200 Gb/s

four-lane Attachment Unit Interface) at an observable interconnection port, uses a 4-lane data path

as specified in Annex 120D or Annex 120E.

f) The MDI as specified in Clause 123 for 400GBASE-SR16 uses a 16-lane data path.

g) The MDI as specified in Clause 122 for 400GBASE-FR8 and 400GBASE-LR8 uses an 8-lane data

path.

h) The MDIs as specified in Clause 121 for 200GBASE-DR4, in Clause 122 for 200GBASE-FR4 and

200GBASE-LR4, and in Clause 124 for 400GBASE-DR4, all use a 4-lane data path.

116.1.3 Nomenclature

The nomenclature employed by the 200 Gb/s and 400 Gb/s Physical Layer is explained as follows.

The alpha-numeric prefix 200GBASE in the port type (e.g., 200GBASE-R) represents a family of Physical

Layer devices operating at a speed of 200 Gb/s. The alpha-numeric prefix 400GBASE in the port type (e.g.,

400GBASE-R) represents a family of Physical Layer devices operating at a speed of 400 Gb/s.

200GBASE-R represents a family of Physical Layer devices using the Physical Coding Sublayer for

200 Gb/s operation over multiple PCS lanes (see Clause 119). Physical Layer devices listed in Table 116–1

are defined for operation at 200 Gb/s.

400GBASE-R represents a family of Physical Layer devices using the Physical Coding Sublayer for

400 Gb/s operation over multiple PCS lanes (see Clause 119). Physical Layer devices listed in Table 116–2

are defined for operation at 400 Gb/s.

Table 116–1—200 Gb/s PHYs

Name Description

200GBASE-DR4 200 Gb/s PHY using 200GBASE-R encoding over four lanes of single-mode

fiber, with reach up to at least 500 m (see Clause 121)

200GBASE-FR4 200 Gb/s PHY using 200GBASE-R encoding over four WDM lanes on single-

mode fiber, with reach up to at least 2 km (see Clause 122)

200GBASE-LR4 200 Gb/s PHY using 200GBASE-R encoding over four WDM lanes on single-

mode fiber, with reach up to at least 10 km (see Clause 122)

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