AD18 PCB底层开窗

对于AD18 PCB底层开窗的问题，根据引用和引用的信息，PCB底层接地铜皮与底板接触的地方都需要开窗处理，以使其更好地接触。一般在大电流走线的情况下，可以切换到TopSolder或者Bottom Solder层，并使用Place->Fill命令来画填充图形，完成开窗处理。这样可以提高信号线与底板的接触质量。具体操作可参考下图所示：(PCB板的上半部分与底座接触)[1][2。<span class="em">1</span><span class="em">2</span><span class="em">3</span>
#### 引用[.reference_title]
- *1* *3* [pcb只开窗不镀锡_案例图解射频PCB设计的几个要点](https://blog.csdn.net/weixin_39801879/article/details/111637678)[target="_blank" data-report-click={"spm":"1018.2226.3001.9630","extra":{"utm_source":"vip_chatgpt_common_search_pc_result","utm_medium":"distribute.pc_search_result.none-task-cask-2~all~insert_cask~default-1-null.142^v93^chatsearchT3_2"}}] [.reference_item style="max-width: 50%"]
- *2* [【AD小知识】PCB快速开窗的方法](https://blog.csdn.net/ReCclay/article/details/84335828)[target="_blank" data-report-click={"spm":"1018.2226.3001.9630","extra":{"utm_source":"vip_chatgpt_common_search_pc_result","utm_medium":"distribute.pc_search_result.none-task-cask-2~all~insert_cask~default-1-null.142^v93^chatsearchT3_2"}}] [.reference_item style="max-width: 50%"]
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