首页Microchip Fabrication A Practical Guide to Semiconductor Processing 5th.pdf
Microchip Fabrication A Practical Guide to Semiconductor Processing 5th.pdf 中文名《芯片制造——半导体工艺制程实用教程》 我找不到中文版，各位谁有的分享一下吧
A Practical Guide to Semiconductor Processing
Peter Van Zant
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VanZant.book Page iii Monday, April 26, 2004 1:26 PM
Library of Congress Cataloging-in-Publication Data
Van Zant, Peter.
Microchip fabrication / Peter Van Zant.—5th ed.
1. Semiconductors—Design and construction. 2. Integrated circuits—Design
and construction. I. Title.
Copyright © 2004, 2000, 1997, 1984 by The McGraw-Hill Companies, Inc. All
rights reserved. Printed in the United States of America. Except as permitted under
the United States Copyright Act of 1976, no part of this publication may be repro-
duced or distributed in any form or by any means, or stored in a data base or re-
trieval system, without the prior written permission of the publisher.
The sponsoring editor for this book was Stephen S. Chapman and the
production supervisor was Pamela Pelton. It was set in Century Schoolbook
by J. K. Eckert & Company, Inc.
Printed and bound by R. R. Donnelley.
McGraw-Hill books are available at special quantity discounts to use as premiums
and sales promotions, or for use in corporate training programs. For more informa-
tion, please write to the Director of Special Sales, McGraw-Hill Professional, Two
Penn Plaza, New York, NY 10121-2298. Or contact your local bookstore.
This book is printed on recycles, acid-free paper containing a minimum of 50% re-
cycled, de-inked ﬁber.
Information contained in this work has been obtained by The McGraw-Hill
Companies, Inc. (“McGraw-Hill”) from sources believed to be reliable.
However, neither McGraw-Hill nor its authors guarantee the accuracy or
completeness of any information published herein and neither McGraw-
Hill nor its authors shall be responsible for any errors, omissions, or dam-
ages arising out of use of this information. This work is published with the
understanding that McGraw-Hill and its authors are supplying information
but are not attempting to render engineering or other professional services.
If such services are required, the assistance of an appropriate professional
should be sought.
VanZant.book Page iv Monday, April 26, 2004 1:26 PM
This edition is dedicated to two exceptional women,
Marilyn (Van Zant) O’Connor and Anne Miller.
Marilyn is my lovely and loving sister. She is also
my good friend, enthusiastic supporter, and a wise
conﬁdant. Thanks, sis.
For over twenty years Anne has been a
collaborator, business partner, and friend. Her wise
business counsel and contributions to this text are
VanZant.book Page v Monday, April 26, 2004 1:26 PM
to the Fifth Edition
Despite recessions, the microchip industry continues its evolutionary
march to the physical limits of silicon-based ICs. Fortunately, the end
seems always just over the hill, and the industry keeps chugging
along. Unfortunately, keeping a textbook current with the advances in
microchip fabrication means frequent updates. Hence this ﬁfth edi-
This edition follows the same chapter sequence as the previous edi-
tions. Hopefully, this will assist instructors in upgrading their course
curriculums. Fortunately, the basics of semiconductor device operation
and wafer processing remain the same and will be found in this edi-
My thanks go to Steve Chapman, my editor at McGraw-Hill. His
guidance and patience with my writing schedule are appreciated.
Many thanks to Anne Miller and Michael Heynes of Semiconductor
Services for their consultation and input. Alex Braun, of Semiconduc-
tor International, and Nikki Wood, of Future Fab International, were
most helpful with securing permission to reproduce material from
their ﬁne publications. Jeff Eckert, of J. K. Eckert & Co., did a ﬁne job
on organizing the over 600 ﬁgures and editing the manuscript. Mark
Hall, Mark Hall Design, and David Wellner did yeoman’s work trans-
forming my hand drawings into understandable illustrations.
Last, but not least, thanks to my wife Mary Dewitt for enduring my
A.M. writing sessions and her unending support.
VanZant.book Page xiii Monday, April 26, 2004 1:26 PM
About the Author
Peter Van Zant is an internationally known semiconductor profes-
sional with an extensive background in process engineering, training,
consulting, and writing. Principal of Peter Van Zant Associates, a ﬁrm
that supplies writing, training, and consulting services to business
and industry, he is the author of Semiconductor Technology Glossary,
Third Edition; Integrated Circuits Text; Safety First Manual; and Chip
Packaging Manual. His books and training materials are used by chip
manufacturers, industry suppliers, colleges, and universities. Peter
Van Zant Associates’ customers include Intel, National Semiconductor,
Applied Materials, Air Products and Chemicals, SCP Global Inc., and
a number of educational institutions. Mr. Van Zant is also the elected
District 1 Supervisor in his home county of Nevada in California.
VanZant.book Page xiv Monday, April 26, 2004 1:26 PM
请翻译：The fabrication process of inverted pyramids on Si surface involved two steps, i.e., diamond tip indentation and selective etching in HF/ HNO3 mixtures. Consider the fabrication process for the inverted triangular pyramids as an example, as demonstrated in Fig. 1a. First, a Berkovich diamond indenter was used for conducting indentation process on an in-situ nanomechanical test system (TI750, Hysitron Inc., USA). Then, the Si wafers with indents were immersed in a mixture of HF and HNO3 solution. As a result, the depth of the indent rapidly increased from ~ 30 to 360 nm after the etching in HF/HNO3 mixtures for 10 s, forming inverted pyramids from indented regions in situ. To demonstrate fabrication flexibility of inverted Si architecture produced by the proposed selective etching, indentation experiments were carried out using a Vickers indenter
帮忙翻译以下内容：By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 3x3x0.75 mm (16-pin LGA), to provide a very small yet high-performance, low-cost package. The device provides high robustness by supporting 10,000g shock reliability.
英语翻译：Bioorthogonal catalysis broadens the functional possibilities of intracellular chemistry. Effective delivery and regulation of synthetic catalytic systems in cells are challenging due to the complex intracellular environment and catalyst instability. Here, we report the fabrication of protein-sized bioorthogonal nanozymes through the encapsulation of hydrophobic transition metal catalysts into the monolayer of water-soluble gold nanoparticles. The activity of these catalysts can be reversibly controlled by binding a supramolecular cucurbituril ‘gate-keeper’ onto the monolayer surface, providing a biomimetic control mechanism that mimics the allosteric regulation of enzymes. The potential of this gated nanozyme for use in imaging and therapeutic applications was demonstrated through triggered cleavage of allylcarbamates for pro-fluorophore activation and propargyl groups for prodrug activation inside living cells.
1.Micro-LED displays: A review of technology and applications，2020，IEEE Communications Surveys & Tutorials，作者：D. Y. C. Lie, M. K. J. Mortada, H. Ji 这篇文章总结了微型LED显示技术及其应用，首先介绍了微型LED显示技术的历史发展，并对技术的基本原理进行了概述，接下来着重介绍了两大主要微型LED显示技术——纳米LED和太阳能LED，详细介绍了它们在构造、制造、封装、背光、驱动、控制和集成等方面的关键技术，最后针对应用场景提出了一些有关微型LED显示技术的发展建议。 2.Highly Efficient Micro-LED Displays Using Phosphor-Converted InGaN White LEDs，2020，IEEE Transactions on Electron Devices，作者：T. Sato, H. Kanda, H. Ishikawa 这篇文章介绍了使用磷光转换的InGaN白光LED来实现高效微型LED显示器的方法。文章首先介绍了磷光转换的原理，然后提出了一种结构，该结构利用InGaN LED在晶圆表面形成多个微型LED，能够实现高分辨率和高亮度的微型LED显示器，最后详细介绍了实验结果，验证了该方案的可行性和可靠性。 3.Design and Fabrication of Micro-LED Display Using Flip-Chip Technology，2020，IEEE Access，作者：K. N. Lee, S. H. Kim 这篇文章介绍了使用翻转芯片技术来设计和制造微型LED显示器的方法。文章首先介绍了微型LED的结构原理，然后研究了翻转芯片技术在微型LED显示器中的应用，包括构造、制造和封装等，最后提出了一种微型LED显示器的设计方案，并进
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