FIDES
FIDES Guide 2009 issue A
FIDES Group
AIRBUS France - Eurocopter - Nexter Electronics - MBDA missile systems - Thales Systèmes Aéroportés
SA - Thales Avionics - Thales Corporate Services SAS - Thales Underwater Systems
5
Contents
I FIDES Guide presentation ........................................................................................ 9
1. Introduction........................................................................................................ 10
2. Warning about the FIDES methodology.......................................................... 11
3. Terminology....................................................................................................... 12
3.1. Acronyms...........................................................................................................................12
3.2. Definitions ..........................................................................................................................13
4. References ......................................................................................................... 15
5. Application field................................................................................................. 16
5.1. Application domains...........................................................................................................16
5.2. Model coverage .................................................................................................................16
5.3. Nature of the prediction .....................................................................................................17
5.4. Confidence in the prediction ..............................................................................................19
5.5. Covered items....................................................................................................................20
II Predicted reliability evaluation guide .................................................................... 21
1. Introduction to models...................................................................................... 22
1.1. Origins of reliability data ....................................................................................................22
1.2. FIDES approach ................................................................................................................23
1.3. Complete method and simplified methods ........................................................................23
1.4. Generic input data .............................................................................................................24
1.5. General model ...................................................................................................................25
1.6. Life profile and time unit.....................................................................................................26
1.7. Failure rate for an electronic product.................................................................................27
1.8. Physical and technological contributing factors
physical
.....................................................28
1.9. Process contributing factors ..............................................................................................31
2. Life profiles ........................................................................................................ 34
2.1. Principles for construction of the life profile.......................................................................34
2.2. Phase duration...................................................................................................................35
2.3. Applicability domains .........................................................................................................35
2.4. Temperature (temperature and thermo-electrical stresses) ..............................................36
2.5. Temperature cycling (thermo-mechanical stress) .............................................................38
2.6. Relative humidity ...............................................................................................................41
2.7. Vibration amplitude (mechanical stress)............................................................................44
2.8. Chemical stress .................................................................................................................48
2.9. Application type .................................................................................................................49
2.10. Data sources......................................................................................................................50
2.11. Standard life profile............................................................................................................50
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