联发科MT2523：智能家居与穿戴设备解决方案

IOT方案

Datasheet

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"MT2523_Datasheet_public.pdf 是联发科(MediaTek)推出的MT2523芯片的数据手册，版本1.2，发布日期为2016年9月30日。该芯片主要应用于物联网(IoT)解决方案，如智能家居、智能手表和手环等穿戴设备。文档中包含的资料属于MediaTek及其许可方的专有信息，只有在与MediaTek签订相关许可协议并被明确允许的情况下才能使用或复制。未经许可，禁止任何部分或全部的使用或披露。MediaTek对文档本身或其使用不做任何明示或暗示的保证，并且对于由此引发的任何索赔不承担责任。文档中的规格可能在不另行通知的情况下进行更改。 MT2523D/G芯片是MT2523系列的核心，是一款专为低功耗应用设计的集成电路。此芯片可能集成了微处理器、无线通信模块（例如蓝牙或Wi-Fi）、传感器接口和其他必要的外围设备，以支持智能穿戴设备的运行。其低功耗特性使其在长时间使用下仍能保持良好的电池寿命，这对于依赖于小型电池的可穿戴设备至关重要。在数据手册中，用户可以找到MT2523的技术规格，包括电气特性、功能描述、封装信息、操作条件、引脚配置、功耗详情以及可能的性能指标。这些信息对于硬件设计人员来说是至关重要的，他们需要这些数据来确保MT2523与他们的系统设计兼容，优化电路板布局，以及合理规划电源管理系统。此外，数据手册可能还会提供关于如何集成MT2523到产品设计中的指导，包括软件开发工具、编程接口、应用示例和调试信息。对于开发者来说，这将有助于他们快速理解和实现MT2523的功能，缩短产品开发周期。 MT2523的广泛应用表明，它可能支持多种定制化功能，如健康监测（心率、步数等）、消息通知、定位服务和用户交互界面等。随着物联网技术的发展，这种高度集成的芯片解决方案将继续推动智能穿戴设备市场的发展，提供更高效、更节能的产品。 MT2523_Datasheet_public.pdf 是一份关键的技术参考资料，为开发者和制造商提供了详细的设计和实现MT2523芯片的必要信息，帮助他们在物联网领域打造创新的智能家居和穿戴设备解决方案。"

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MT2523D/G Datasheet

Page 12 of 124

This document contains information that is proprietary to MediaTek Inc.

Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

• Supports three types of video modes − sync-event, sync-pulse and burst mode.

• Supports non-continuous high-speed transmission in data lanes.

• Supports command mode frame transmission free run.

• Supports peripheral tearing effect (TE) and external TE signal detection.

• Supports low power mode control.

• Supports low frame-rate (LFR) technique.

1.2.3. 2D accelerator

• Supports 32-bpp ARGB8888, 24-bpp RGB888, 16-bpp RGB565 and 24-bpp ARGB6666.

• Four layers of overlay with individual color format, window size, source key, constant alpha and rotation.

• Rectangle fill with constant.

• Bit-boundary block transfer (BitBlt). Supports up to seven rotation types.

• Alpha blending with seven rotation types, per-pixel alpha and pre-multiplied alpha.

• Font drawing. Normal font and anti-aliasing font (Display Adaptive Ambient Light Controller).

1.2.4. Display adaptive ambient light controller

• 33-bin weighted histogram.

• DRE enhancement for sunlight visibility.

• CABC compensation for backlight power saving.

1.3. Audio

Using a highly integrated mixed-signal audio front-end, the MT2523D/G architecture enables audio interfacing

with direct connection to the audio transducers. The audio interface integrates A/D converters for voice band, as

well as high-resolution stereo D/A converters for both audio and voice bands.

1.3.1. Audio CODEC

• Supports AAC and SBC codec decoding for Bluetooth audio.

• Supports CVSD and mSBC codec for Bluetooth speech.

• Pure PCM playback for 8-48kHz sample rate.

• Pure PCM record for 8kHz and 16kHz sample rates.

1.3.2. Audio interface and audio front-end

• Supports master I2S interface.

• Supports master PCM interface.

• Supports Dual PDM MIC.

• High-resolution D/A converters for stereo audio playback.

• Voice band A/D converter support.

MT2523D/G Datasheet

Page 13 of 124

This document contains information that is proprietary to MediaTek Inc.

Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

• Stereo to mono conversion.

1.4. Bluetooth

MT2523D/G offers a highly integrated Bluetooth radio and baseband processor. Only a minimum of external

components are required.

MT2523D/G is fully compliant with Bluetooth version 4.2, upgradable to later versions, including BR/EDR and

Bluetooth LE and offers enhanced data rates of up to 3Mbps. It also provides the coexistence protocol with IEEE

802.11 protocol.

1.4.1. Radio

• Fully compliant with Bluetooth core specification 4.2.

• Low out-of-band spurious emissions support simultaneous operation with GNSS and GSM/GPRS worldwide

radio systems.

• Low-IF architecture with high degree of linearity and high order channel filter.

• Integrated T/R switch and balun.

• Fully integrated PA provides 7.5dBm output power.

• -95dBm sensitivity with interference rejection performance.

• Hardware AGC dynamically adjusts receiver performance in changing environments.

1.4.2. Baseband

• Up to seven simultaneous active ACL links.

• Up to eight simultaneous active Bluetooth LE links.

• A single SCO or eSCO link with CVSD/mSBC coding.

• Up to two simultaneous ACL slave links and four simultaneous Bluetooth LE links for audio or voice application,

basic rate A2DP.

• AFH and PTA collaborative support for WLAN/Bluetooth coexistence.

• Idle mode and sleep mode enables ultra-low power consumption.

• Supports PCM interface and built-in programmable transcoders for linear voice with re-transmission.

• Built-in hardware modem engine for access code correlation, header error correction, forward error correction,

CRC, whitening and encryption.

• Channel quality driven data rate adaptation.

• Channel assessment for AFH.

1.4.3. Core

• Feasibility Bluetooth host subsystem in Cortex-M4 to support customized applications.

• Embedded processor for Bluetooth controller subsystem with built-in memory system.

• Fully verified ROM based system with code patch for feature enhancement.

MT2523D/G Datasheet

Page 15 of 124

This document contains information that is proprietary to MediaTek Inc.

Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

2. Functional Overview

2.1. Host Processor Subsystem

2.1.1. ARM® Cortex®-M4 with FPU

The Cortex-M4 with FPU is a low-power processor with 3-stage pipeline Harvard architecture. It has reduced pin

count and low power consumption and delivers very high performance efficiency and low interrupt latency,

making it ideal for embedded microcontroller products.

The processor incorporates:

• IEEE754-compliant single-precision floating-point computation unit (FPU).

• A Nested Vectored Interrupt Controller (NVIC) to achieve low latency interrupt processing.

• Enhanced system debugging with extensive breakpoint and trace capabilities.

• An optional Memory Protection Unit (MPU) to ensure platform security robustness.

The Cortex-M4 executes the Thumb®-2 instruction set with 32-bit architecture, with the high code density of 8-bit

and 16-bit microcontrollers. The instruction set is fully backward compatible with Cortex-M3/M0+.

MT2523D/G has further enhanced the Cortex-M4 with floating point processor to reduce the power by another 11%

(in Dhrystone) compared to the original Cortex-M4. Low power consumption is a significant feature for IoT and

Wearables application development.

2.1.2. Cache controller

A configurable 32kB cache is implemented to improve the code fetch performance when CPU accesses a non-zero

wait-state memory such as EMI, external flash or boot ROM through the on-chip bus.

The core cache is a small block of memory containing a copy of small portion of cacheable data in the external

memory. If CPU reads a cacheable datum, the datum will be copied to the core cache. Once CPU requests the same

datum again, it can be obtained directly from the core cache (called cache hit) instead of fetching it again from the

external memory to achieve zero wait-state latency.

The cache can be disabled and this block of memory can be turned into tightly coupled memory (TCM), a high-

speed memory for normal data storage. The sizes of TCM and cache can be set to one of the following four

configurations:

• 32kB cache, 128kB TCM

• 16kB cache, 144kB TCM

• 8kB cache, 152kB TCM

• 0kB cache, 160kB TCM

2.1.3. Memory management

Three types of memories are implemented for use:

1) On-die memories (SRAMs) up to 160kB at CPU clock speed with zero wait state.

MT2523D/G Datasheet

Page 16 of 124

This document contains information that is proprietary to MediaTek Inc.

Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

2) Embedded flash of 32Mbits to store programs and data.

3) Embedded pseudo SRAM (PSRAM) of 32Mbits for application storage.

160kB SRAMs are composed of TCMs and L1 caches. L1 cache (up to 32kB) is implemented to improve processor

access performance of the long latency memories (flash and PSRAM).

TCMs are designed for high speed, low latency and low power demanding applications. Each TCM has its own

power state; active, retention or power-down. TCM must be in active state for normal read and write access.

Retention state saves the SRAM content and consumes the minimum leakage current with no access. Power-down

loses the content and consumes almost zero power.

The TCMs can also be accessed by other internal AHB masters like DMA or multimedia sub-system for low power

applications. These applications can run on TCM without powering on PSRAM or Flash to save more power.

Boot ROM is also implemented for processor boot–up and its content is unchangeable.

2.1.4. Memory Protection Unit

The Memory Protection Unit (MPU) is an optional component to manage the CPU access to memory. The MPU

provides full support for:

• Protection regions (up to 8 regions and can be further divided up into 8 sub-regions).

• Overlapping protection regions, with region priority.

• Access permissions.

• Exporting memory attributes to the system.

The MPU is useful for applications where a critical code has to be protected against the misbehavior of other tasks.

It can be used to define access rules, enforce privilege rules and separate processes.

2.1.5. Nested Vectored Interrupt Controller

The Nested Vectored Interrupt Controller (NVIC) supports up to 64 maskable interrupts and 16 interrupt lines of

Cortex-M4 with 64 priority levels. The NVIC and the processor core interface are closely coupled to enable low

latency interrupt processing and efficient processing of late arriving interrupts. The NVIC maintains knowledge of

the stacked or nested interrupts to enable tail-chaining of interrupts. The processor supports both level and pulse

interrupts with programmable active-high or low control.

2.1.6. External Interrupt Controller

The external interrupt or event controller (EINT) consists of 32 edge/level detector lines used to generate interrupt

or event requests. Each line can be independently configured to select the trigger event (rising edge, falling edge,

both and level) and can be masked independently. A pending register maintains the status of the interrupt

requests. Up to 31 GPIOs can be connected to 20 external interrupt lines.

2.1.7. Bus architecture

To better support various IoT applications, MT2523D/G adopts 32-bit multi-AHB matrix to provide low-power, fast

and flexible data operation. Table 2.1-1 shows the interconnections between bus masters and slaves.

• The bus masters include Cortex-M4, four SPI masters, SPI slave, Debug system, Multimedia (MM) system, USB,

and three DMAs.

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df_boxplot_exp_mt.gene <- as.data.frame(p_boxplot_exp_mt.gene) Error in (function (..., row.names = NULL, check.rows = FALSE, check.names = TRUE, : 参数值意味着不同的行数: 5, 84, 2, 1493

mt19937_64 rnd(chrono::steady_clock::now().time_since_epoch().count());

load('MT_12_May_2023_12_34_12.mat') data_str=G_out_data.data_path_str ; %读取数据的路径 dataO1=readtable('工作簿1.xlsx','VariableNamingRule','preserve');

MT4_time = 2023.05.26 12:00 , 用python提前小时

Error in p_boxplot_exp_mt.gene + geom_boxplot(color = "black", size = 0.25, : non-numeric argument to binary operator

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