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NCP398
www.onsemi.com
3
Table 3. MAXIMUM RATINGS
Rating Symbol Value Unit
Minimum Voltage (All to GND) V
MIN
−0.3 V
Maximum Voltage (Ins to GND) V
INMAX
29 V
Maximum Voltage (All others to GND) V
MAX
7 V
Maximum DC current I
MAX
0.8 A
Thermal Resistance, Junction to Air WLCSP (Note 1)
DFN (Note 1)
R
q
JA
170
145
°C/W
Operating Ambient Temperature Range T
A
−40 to +85 °C
Storage Temperature Range T
STG
−65 to +150 °C
Junction Operating temperature T
J
+125 °C
Human Body Model (HBM) ESD Rating are (Note 2) ESD HBM 2 kV
Charged Device Model (CDM) ESD Rating are (Note 2) ESD CDM 1 kV
Latch Up Current (Note 3) I
LU
100 mA
Moisture Sensitivity MSL Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The R
q
JA
is highly dependent on the PCB heat sink area. As example UDFN6 R
q
JA
is 220°C/W with 50 mm
2
(copper 35 mm, 1 oz) and 145°C/W
with 200 mm
2
(copper 35 mm, 2 oz).
2. Human Body Model, 100 pF discharged through a 1.5 kW resistor following specification JESD22/A114, Charged Device Model (CDM) per
JEDEC standard: JESD22−C101 Class IV.
3. Latch Up Current per JEDEC standard: JESD78 class II.