xviii Lumped Elements for RF and Microwave Circuits
The printed inductors are covered in Chapter 3. The realization of induc-
tors on several different substrates are treated. These include inductors on Si,
GaAs, printed circuit board, and hybrid integrated circuit substrates. Wire
inductors are the subject of Chapter 4. Analysis and design of wire-wound and
bond wire inductors are discussed. A brief description of magnetic materials is
also included.
Capacitors, including discrete, MIM, and interdigital, are described in
Chapters 5, 6, and 7, respectively. The basic definition of capacitor parameters,
chip capacitor types, the analysis of parallel plate capacitors, voltage and current
ratings, and the electrical representation of capacitors are included in Chapter
5. Monolithic capacitors are treated in Chapter 6. Equivalent circuit models of
capacitors, high-density capacitors, and capacitor shapes are discussed in this
chapter. The treatment of interdigital capacitors is included in Chapter 7,
describing its equivalent circuit models, design considerations, and applications.
Chapters 8, 9, and 10 deal with lumped resistors, via holes, and airbridge/
dielectric crossovers, respectively. The basic definitions of resistor parameters,
resistor types, high-power resistors, resistor equivalent circuit models, and resis-
tor-circuit representations are included in Chapter 8. The effective conductivity
of resistor materials and thermistor as an application of a resistor are discussed.
Chapter 9 deals with via hole connection and via hole ground. The analysis
and equivalent circuit models and design considerations, including coupling
and layout of via holes, are described. Types of airbridge and crossover, analysis
techniques, equivalent circuit models, and design consideration are discussed
in Chapter 10.
The applications of lumped elements including transformers, baluns, and
other passive circuits are treated in Chapters 11 and 12. The basic theory of
transformers, wire wrapped, transmission line transformers, and ferrite trans-
formers are discussed in Chapter 11. This chapter also describes parallel conduc-
tor transformers on Si substrate and spiral transformers on GaAs substrate.
Passive lumped element circuits are discussed in Chapter 12. The circuit types
include filters, hybrids, dividers, matching networks, biasing networks, switches,
phase shifters, and attenuators.
Chapter 13 deals with fabrication technologies for lumped elements,
including materials, salient features of fabrication, and examples. The fabrication
technologies discussed are printed circuit board, microwave printed circuit,
hybrid microwave integrated circuit, monolithic microwave integrated circuit,
monolithic integrated CMOS, and micromachining.
The microstrip overview is given in Chapter 14 in order to make this book
self-contained. The topics discussed are design equations, design considerations,
thermal design, coupled lines, and discontinuities. The appendix is included to
facilitate readers in their designs. I hope that the selection of topics and their
presentation will meet the expectations of the readers.