JEDEC Standard No. 47L
Page 2
2 Normative References
The revision of the referenced documents shall be that which is in effect on the date of the qualification plan.
2.1 Military
MIL-STD-883, Test Methods and Procedures for Microelectronics.
MIL-PRF 38535, General Specification for Integrated Circuit Manufacturing.
2.2 Industrial
UL94, Tests for Flammability of Plastic Materials for Parts in Devices and Appliances.
ASTM D2863, Flammability of Plastic Using the Oxygen Index Method.
IEC Publication 695, Fire Hazard Testing.
J-STD-020, Joint IPC/JEDEC Standard, Moisture/Reflow Sensitivity Classification for Non-hermetic Solid
State Surface-Mount Devices.
JP-001, Foundry Process Qualification Guidelines (Wafer Fabrication Manufacturing Sites).
JS-001, Joint JEDEC/ESDA Standard for Electrical Discharge Sensitivity Test - Human Body Model (HBM)
– Component Level
JS-002, ESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing – Charged Device
Model (CDM) – Device Level
J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
JESD22 Series, Reliability Test Methods for Packaged Devices
JESD46, Guidelines for User Notification of Product/process Changes by Semiconductor Suppliers.
JESD69, Information Requirements for the Qualification of Silicon Devices.
JESD74, Early Life Failure Rate Calculation Procedure for Electronic Components.
JESD78, IC Latch-Up Test.
JESD85, Methods for Calculating Failure Rates in Units of FITs.
JESD86, Electrical Parameters Assessment.
JESD91, Methods for Developing Acceleration Models for Electronic Component Failure Mechanisms.
JESD94, Application Specific Qualification using Knowledge Based Test Methodology.
JEP122, Failure Mechanisms and Models for Semiconductor Devices.
JEP143, Solid State Reliability Assessment Qualification Methodologies.
JEP150, Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State
Surface-Mount Components.
JEP156, Chip-Package interaction Understanding, Identification and Evaluation.
JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy
Surface Finishes.