"RA内训1：设备和包装资格测试介绍"

The RA Introduction for internal training provides an overview of the device and package qualification tests, including ELFR (Early Life Failure Rate), HTOL (High Temperature Operating Life test), LTOL (Low Temperature Operating Life test), HTSL (High Temperature Storage Life test), and Pre-Con (Pre-conditioning). These tests are crucial in ensuring the reliability and performance of electronic components in various operating conditions. Device qualification tests, such as ELFR, HTOL, LTOL, and HTSL, are conducted according to JESD22-A108 and are aimed at assessing the early life failure rate and the operating and storage life of the devices. These tests are essential in evaluating the robustness and durability of the devices, especially in high-temperature and low-temperature environments. Package qualification tests, including Pre-Con, are performed according to JESD22-A113, and are designed to evaluate the package's ability to withstand various environmental stresses and conditions. Pre-conditioning tests are critical in determining the package's reliability and its performance under different operating conditions. In conclusion, the RA Introduction for internal training emphasizes the significance of device and package qualification tests in ensuring the reliability and performance of electronic components. These tests are essential in validating the robustness and durability of devices and packages under different operating conditions, ultimately contributing to the overall quality and reliability of electronic products.