Cisco 300-430 V15.75 实施企业无线网络指南

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本学习文档手册针对的是Cisco的300-430考试,该考试标题为"Implementing Cisco Enterprise Wireless Networks",版本为V15.75。这份文档旨在帮助考生准备和理解企业无线网络的实施,尤其是在大型公司环境中高效部署和管理Wi-Fi解决方案。 首先,关于题目NO.1,一个工程师在Cisco Prime Infrastructure中运行客户端流量流指标报告时,必须先完成哪个任务?答案是(D):定期报告。这意味着在执行此报告之前,系统可能需要先设置好自动或预定的报告周期,以便收集和分析相关数据。 第二题涉及mDNS(多播DNS)的配置限制。选择两个正确的选项:(B) mDNS不支持IPv6,以及(D) mDNS不支持FlexConnect AP上的本地交换式WLAN。mDNS通常用于发现网络设备,但IPv6和FlexConnect AP的具体环境限制了其适用性。 第三个问题是关于在一个大型公司部署无线网络时的优化策略。有300名员工分布在不同的部门,需要支持32个VLAN。最有效的解决方案是(B),配置单一SSID(服务集标识符)并利用Cisco ISE(Identity Services Engine)来实现基于VLAN的网络访问控制。这允许对不同部门的员工分配不同的网络资源,而无需额外的硬件配置。 这份文档深入探讨了Cisco企业无线网络的配置、管理和优化技术,包括客户端流量管理、mDNS的使用限制以及如何在大规模环境中实现高效的VLAN划分策略。通过学习和掌握这些知识点,考生可以更好地准备300-430考试,为实际工作中实施企业级无线网络提供理论基础。

n the present research, a hybrid laser polishing technology combining pulsed laser and continuous wave laser was applied to polish the surface of laser directed energy deposition (LDED) Inconel 718 superalloy components. The surface morphology, microstructure evolution and microhardness of the as-fabricated, the single pulsed laser polishing (SPLP) and the hybrid laser polishing (HLP) processed samples were investigated. The results revealed that the as-fabricated sample has a rough surface with sintered powders. In the matrix, the NbC carbide and Cr2Nb based Laves phase array parallel to the build direction and the small γʺ-Ni3Nb particles precipitate in matrix uniformly. The surface roughness of the as-fabricated sample is 15.75 μm which is decreased to 6.14 μm and 0.23 μm by SPLP and HLP processing, respectively. The SPLP processing refines the grains and secondary phase significantly in the remelted layer which is reconstructured with the cellular structure and plenty of substructures. The HLP processing also refines the grain and secondary phase but the secondary phases still exhibit array distribution. In addition, the tangled dislocations pile up along the interface of secondary phases. Compared with the as-fabricated sample, the SPLP processing decreases the surface microhardness but the HLP processing increases the surface microhardness, and the Young's elasticity modulus of surface layer is improved by SPLP and HLP processing to 282 ± 5.21 GPa and 304 ± 5.57 GPa, respectively. 翻译

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