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ULN2003LV
ZHCS846B –APRIL 2012–REVISED JUNE 2015
www.ti.com.cn
6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
INX
= 3.3V, V
pull-up
= 3.3 V, R
pull-up
= 50 Ω 25
OUT1–OUT7 logic high propagation
t
PHL
ns
delay
V
INX
= 5.0V, V
pull-up
= 5 V, R
pull-up
= 1 kΩ 15
V
INX
= 3.3V, V
pull-up
= 3.3 V, R
pull-up
= 50 Ω 45
t
PLH
OUT1–OUT7 logic low propagation delay ns
V
INX
= 5.0V, V
pull-up
= 5 V, R
pull-up
= 1kΩ 80
R
PD
IN1–IN7 input pull-down Resistance 210 300 390 kΩ
ζ IN1–IN7 Input filter time constant 9 ns
C
OUT
OUT1–OUT7 output capacitance V
INX
= 3.3 V, V
OUTX
= 0.4 V 15 pF
(1) Rise and Fall propagation delays, t
PHL
and t
PLH
, are measured between 50% values of the input and the corresponding output signal
amplitude transition.
(2) Specified by design only.
6.7 Dissipation Ratings
See
(1)(2)
DERATING
BOARD PACKAGE R
θJC
R
θJA
(3)
FACTOR ABOVE T
A
< 25°C T
A
= 70°C T
A
= 85°C
T
A
= 25ºC
High-K 16-Pin SOIC 69°C/W 112°C/W 8.88 mW/ºC 1.11 W 0.71 W 0.58 W
High-K 16-Pin TSSOP 74°C/W 142°C/W 7.11 mW/ºC 0.88 W 0.56 W 0.45 W
(1) Maximum dissipation values for retaining device junction temperature of 150°C
(2) Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance
(3) Operating at the absolute T
J-max
of 150°C can affect reliability– for higher reliability it is recommended to ensure T
J
< 125°C
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