STM32L151/2x6/8/B-A超低功耗MCU技术规格与应用

STM32L15x

官方手册

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"STM32L151/2x6/8/B-A使用手册" STM32L151x6/8/B-A和STM32L152x6/8/B-A系列微控制器是STMicroelectronics推出的一系列超低功耗32位微控制器，基于ARM Cortex-M3处理器内核，设计用于需要高效能和节能特性的应用。这些微控制器具备丰富的功能集，包括不同类型的存储器和外设接口，使其在物联网(IoT)、可穿戴设备、便携式医疗设备等领域具有广泛应用。主要特点和优势： 1. **超低功耗平台**：该系列微控制器特别注重电源效率，工作电压范围从1.65V到3.6V，能够适应各种电池供电的应用。温度范围宽泛，可在-40°C到105°C之间稳定工作。多种低功耗模式如待机、停机和运行模式，确保在不牺牲性能的前提下实现极低的电流消耗。 - 待机模式下，配备3个唤醒引脚时，电流仅为0.28µA；若加上RTC（实时时钟），电流则为1.11µA。 - 停机模式下，有16个唤醒线路时，电流为0.44µA；加上RTC后，电流为1.38µA。 - 低功耗运行模式下，电流为10.9µA；高速运行模式下，电流为185µA/MHz。 - I/O端口漏电流极低，达到10nA，唤醒时间小于8µs。 2. **高性能ARM Cortex-M3内核**：32位Cortex-M3处理器提供最高32MHz的时钟频率，执行速度可达1.25 DMIPS/MHz，确保了高效的计算能力。内含内存保护单元(Memory Protection Unit, MPU)，增强系统安全。 3. **复位和电源管理**：提供超安全的低功耗复位(BOR)功能，有5个可选阈值，以及超低功耗的上电复位(POR)/掉电复位(PDR)。同时具备可编程电压检测器(PVD)，监控电源电压，确保系统稳定性。 4. **时钟源**：多种时钟源可供选择，包括1到24MHz的晶体振荡器，专为RTC设计的32kHz振荡器，内部16MHz高精度工厂校准的RC振荡器（误差±1%），低功耗37kHz RC振荡器，以及可扩展至4.2MHz的多速低功耗65kHz RC振荡器。此外，还集成了一个CPU时钟用的锁相环(PLL)。 5. **内存配置**：STM32L151/2x6/8/B-A系列提供了128KB的闪存和32KB的SRAM，以及4KB的EEPROM，满足不同存储需求。闪存支持在系统编程(ISP)和在应用编程(IAP)，方便固件更新。 6. **丰富的外设集**：这些微控制器内置LCD控制器，支持直接驱动LCD显示，还集成了USB接口，便于数据传输。模拟电路部分包含高精度ADC（模数转换器）和DAC（数模转换器），适用于信号采集和输出。此外，还有多个GPIO（通用输入/输出）引脚，支持各种外设连接。 STM32L151/2x6/8/B-A系列微控制器因其低功耗特性、高性能ARM内核、多样化的时钟源和丰富的外设集，成为了对能耗敏感且需要复杂功能集成的嵌入式系统开发的理想选择。开发者可以通过官方手册深入了解其详细功能和应用指南，以充分利用这些微控制器的优势。

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Functional overview STM32L151x6/8/B-A STM32L152x6/8/B-A

16/130 DocID024330 Rev 5

2. CPU frequency changes from initial to final must respect "F

CPU

initial < 4*F

CPU

final" to limit V

CORE

drop

due to current consumption peak when frequency increases. It must also respect 5 µs delay between two

changes. For example to switch from 4.2 MHz to 32 MHz, you can switch from 4.2 MHz to 16 MHz, wait

5 µs, then switch from 16 MHz to 32 MHz.

3. Should be USB-compliant from I/O voltage standpoint, the minimum V

is 3.0 V.

Table 4. CPU frequency range depending on dynamic voltage scaling

CPU frequency range Dynamic voltage scaling range

16 MHz to 32 MHz (1ws)

32 kHz to 16 MHz (0ws)

Range 1

8 MHz to 16 MHz (1ws)

32 kHz to 8 MHz (0ws)

Range 2

2.1 MHz to 4.2 MHz (1ws)

32 kHz to 2.1 MHz (0ws)

Range 3

Functional overview STM32L151x6/8/B-A STM32L152x6/8/B-A

18/130 DocID024330 Rev 5

3.2 ARM

Cortex

-M3 core with MPU

The ARM

Cortex

-M3 processor is the industry leading processor for embedded systems.

It has been developed to provide a low-cost platform that meets the needs of MCU

implementation, with a reduced pin count and low-power consumption, while delivering

outstanding computational performance and an advanced system response to interrupts.

The ARM

Cortex

-M3 32-bit RISC processor features exceptional code-efficiency,

delivering the high-performance expected from an ARM core in the memory size usually

associated with 8- and 16-bit devices.

The memory protection unit (MPU) improves system reliability by defining the memory

attributes (such as read/write access permissions) for different memory regions. It provides

up to eight different regions and an optional predefined background region.

Owing to its embedded ARM core, the STM32L151x6/8/B-A and STM32L152x6/8/B-A

devices are compatible with all ARM tools and software.

DAC Y Y Y Y Y - - -

Temperature

sensor

YYYYY---

Comparators Y Y Y Y Y Y - -

16-bit Timers Y Y Y Y - - - -

IWDG Y Y Y Y Y Y Y Y

WWDG Y Y Y Y - - - -

Touch sensing Y - - - - - - -

Systick Timer Y Y Y Y - - - -

GPIOs Y Y Y Y Y Y - 3 pins

Wakeup time to

Run mode

0 µs 0.4 µs 3 µs 46 µs < 8 µs 58 µs

Consumption

=1.8V to 3.6V

(Typ)

Down to

185 µA/MHz

(from Flash)

Down to

36.9 µA/MHz

(from Flash)

Down to

10.9 µA

Down to

5.5 µA

0.43 µA (No

RTC) V

=1.8 V

0.27 µA (No

RTC) V

=1.8 V

1.13 µA (with

RTC) V

=1.8 V

0.87 µA (with

RTC) V

=1.8 V

0.44 µA (No

RTC) V

=3.0 V

0.28 µA (No

RTC) V

=3.0 V

1.38 µA (with

RTC) V

=3.0 V

1.11 µA (with

RTC) V

=3.0 V

1. The startup on communication line wakes the CPU which was made possible by an EXTI, this induces a delay before

entering run mode.

Table 5. Working mode-dependent functionalities (from Run/active down to standby) (continued)

Ips Run/Active Sleep

Low-

power

Run

Low-

power

Sleep

Stop Standby

Wakeup

capability

Wakeup

capability

DocID024330 Rev 5 19/130

STM32L151x6/8/B-A STM32L152x6/8/B-A Functional overview

Nested vectored interrupt controller (NVIC)

The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A devices embed a

nested vectored interrupt controller able to handle up to 45 maskable interrupt channels (not

including the 16 interrupt lines of Cortex-M3) and 16 priority levels.

• Closely coupled NVIC gives low-latency interrupt processing

• Interrupt entry vector table address passed directly to the core

• Closely coupled NVIC core interface

• Allows early processing of interrupts

• Processing of late arriving, higher-priority interrupts

• Support for tail-chaining

• Processor state automatically saved on interrupt entry, and restored on interrupt exit,

with no instruction overhead

This hardware block provides flexible interrupt management features with minimal interrupt

latency.

3.3 Reset and supply management

3.3.1 Power supply schemes

• V

= 1.65 to 3.6 V: external power supply for I/Os and the internal regulator.

Provided externally through V

pins.

• V

SSA

, V

DDA

= 1.65 to 3.6 V: external analog power supplies for ADC, reset blocks, RCs

and PLL (minimum voltage to be applied to V

DDA

is 1.8 V when the ADC is used).

DDA

and V

SSA

must be connected to V

and V

, respectively.

3.3.2 Power supply supervisor

The device has an integrated ZEROPOWER power-on reset (POR)/power-down reset

(PDR) that can be coupled with a brownout reset (BOR) circuitry.

The device exists in two versions:

• The version with BOR activated at power-on operates between 1.8 V and 3.6 V.

• The other version without BOR operates between 1.65 V and 3.6 V.

After the V

threshold is reached (1.65 V or 1.8 V depending on the BOR which is active or

not at power-on), the option byte loading process starts, either to confirm or modify default

thresholds, or to disable the BOR permanently: in this case, the V

min value becomes

1.65 V (whatever the version, BOR active or not, at power-on).

When BOR is active at power-on, it ensures proper operation starting from 1.8 V whatever

the power ramp-up phase before it reaches 1.8 V. When BOR is not active at power-up, the

power ramp-up should guarantee that 1.65

V is reached on V

at least 1 ms after it exits

the POR area.

Functional overview STM32L151x6/8/B-A STM32L152x6/8/B-A

20/130 DocID024330 Rev 5

Five BOR thresholds are available through option bytes, starting from 1.8 V to 3 V. To

reduce the power consumption in Stop mode, it is possible to automatically switch off the

internal reference voltage (V

REFINT

) in Stop mode. The device remains in reset mode when

is below a specified threshold, V

POR/PDR

or V

BOR

, without the need for any external

reset circuit.

Note: The start-up time at power-on is typically 3.3 ms when BOR is active at power-up, the start-

up time at power-on can be decreased down to 1

ms typically for devices with BOR inactive

at power-up.

The device features an embedded programmable voltage detector (PVD) that monitors the

DDA

power supply and compares it to the V

PVD

threshold. This PVD offers 7 different

levels between 1.85

V and 3.05 V, chosen by software, with a step around 200 mV. An

interrupt can be generated when V

DDA

drops below the V

PVD

threshold and/or when

DDA

is higher than the V

PVD

threshold. The interrupt service routine can then generate

a warning message and/or put the MCU into a safe state. The PVD is enabled by software.

3.3.3 Voltage regulator

The regulator has three operation modes: main (MR), low-power (LPR) and power down.

• MR is used in Run mode (nominal regulation)

• LPR is used in the Low-power run, Low-power sleep and Stop modes

• Power down is used in Standby mode. The regulator output is high impedance, the

kernel circuitry is powered down, inducing zero consumption but the contents of the

registers and RAM are lost are lost except for the standby circuitry (wakeup logic,

IWDG, RTC, LSI, LSE crystal 32K osc, RCC_CSR).

3.3.4 Boot modes

At startup, boot pins are used to select one of three boot options:

• Boot from Flash memory

• Boot from System Memory

• Boot from embedded RAM

The boot loader is located in System Memory. It is used to reprogram the Flash memory by

using USART1 or USART2. See the application note “STM32 microcontroller system

memory boot mode” (AN2606) for details.

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