MPC8548E PowerPC处理器技术规格解析

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"MPC8548E DataSheet 是一份关于PowerPC处理器MPC8548E的详细技术文档，适用于硬件驱动开发的参考。这份文档由Freescale Semiconductor公司发布，涵盖了该芯片的主要功能单元、电气特性、电源特性、输入时钟、复位初始化、DDR和DDR2 SDRAM接口、DUART、增强型三速以太网(eTSEC)、以太网管理接口电气特性、局部总线和可编程中断控制器等多个方面的内容。" MPC8548E是PowerPC系列的一款高性能处理器，广泛应用于网络和通信设备。该芯片的主要特点是其强大的处理能力、灵活的内存接口和丰富的外设接口。在概述部分，文档介绍了MPC8548E的基本架构，包括其内部的主要功能单元，如CPU核心、内存控制器、网络接口等，并指出虽然主要以MPC8548E为中心，但大部分内容也适用于MPC8547E、MPC8545E和MPC8543E等其他家族成员。在电气特性章节，文档详细列出了MPC8548E的电压、电流、频率等参数，这对于设计电源系统和确保电路兼容性至关重要。电源特性部分则讨论了芯片在运行过程中的功耗情况，对于优化能源效率和散热设计具有指导意义。输入时钟章节详细描述了处理器所需的时钟信号，包括时钟源、时钟频率和时钟分布，这对于理解和配置系统的时序至关重要。复位初始化部分则阐述了如何正确启动和初始化MPC8548E，包括不同的复位方式和初始化流程。 DDR和DDR2 SDRAM接口章节提供了与这些高速内存交互的规范，包括地址映射、控制信号和数据传输，这对于实现高效的内存访问至关重要。DUART（双通用异步接收发送器）章节详细介绍了芯片的串行通信能力，而增强型三速以太网(eTSEC)部分则涵盖了高速网络接口的详细规格。以太网管理接口电气特性描述了网络接口的电气标准，确保了与其他网络设备的互操作性。局部总线部分说明了MPC8548E如何通过局部总线扩展外部设备，而可编程中断控制器则涉及中断处理机制，这对于实时操作系统和设备驱动程序的开发至关重要。 MPC8548E DataSheet是硬件开发者和系统集成者的重要参考资料，它提供了全面的技术细节，帮助他们设计和实现基于MPC8548E的高效、可靠的系统。

MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 10

16 Freescale Semiconductor

Input Clocks

4 Input Clocks

This section discusses the timing for the input clocks.

4.1 System Clock Timing

The following table provides the system clock (SYSCLK) AC timing specifications for the device.

4.2 Real Time Clock Timing

The RTC input is sampled by the platform clock (CCB clock). The output of the sampling latch is then

used as an input to the counters of the PIC and the TimeBase unit of the e500. There is no jitter

specification. The minimum pulse width of the RTC signal must be greater than 2x the period of the CCB

clock. That is, minimum clock high time is 2 × t

CCB

, and minimum clock low time is 2 × t

CCB

. There is

no minimum RTC frequency; RTC may be grounded if not needed.

Table 5. SYSCLK AC Timing Specifications

At recommended operating conditions (see Table 2) with OV

= 3.3 V ± 165 mV.

Parameter/Condition Symbol Min Typ Max Unit Notes

SYSCLK frequency f

SYSCLK

16 — 133 MHz 1, 6, 7, 8

SYSCLK cycle time t

SYSCLK

7.5 — 60 ns 6, 7, 8

SYSCLK rise and fall time t

, t

0.6 1.0 1.2 ns 2

SYSCLK duty cycle t

KHK

SYSCLK

40 — 60 % 3

SYSCLK jitter — — — ±150 ps 4, 5

Notes:

1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting

SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum

operating frequencies.See Section 20.2, “CCB/SYSCLK PLL Ratio,” and Section 20.3, “e500 Core PLL Ratio,” for ratio

settings.

2. Rise and fall times for SYSCLK are measured at 0.6 and 2.7 V.

3. Timing is guaranteed by design and characterization.

4. This represents the total input jitter—short term and long term—and is guaranteed by design.

5. The SYSCLK driver’s closed loop jitter bandwidth must be <500 kHz at –20 dB. The bandwidth must be set low to allow

cascade-connected PLL-based devices to track SYSCLK drivers with the specified jitter.

6. This parameter has been adjusted slower according to the workaround for device erratum GEN 13.

7. For spread spectrum clocking. Guidelines are + 0% to –1% down spread at modulation rate between 20 and 60 kHz on

SYSCLK.

8. System with operating core frequency less than 1200 MHz must limit SYSCLK frequency to 100 MHz maximum.

MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 17

Input Clocks

4.3 eTSEC Gigabit Reference Clock Timing

The following table provides the eTSEC gigabit reference clocks (EC_GTX_CLK125) AC timing

specifications for the device.

4.4 PCI/PCI-X Reference Clock Timing

When the PCI/PCI-X controller is configured for asynchronous operation, the reference clock for the

PCI/PCI-x controller is not the SYSCLK input, but instead the PCIn_CLK. The following table provides

the PCI/PCI-X reference clock AC timing specifications for the device.

Table 6. EC_GTX_CLK125 AC Timing Specifications

Parameter/Condition Symbol Min Typ Max Unit Notes

EC_GTX_CLK125 frequency f

G125

—125—MHz—

EC_GTX_CLK125 cycle time t

G125

—8—ns

EC_GTX_CLK125 rise and fall time

L/TVDD = 2.5 V

L/TVDD = 3.3 V

G125R

, t

G125F

——

0.75

1.0

ns 1

EC_GTX_CLK125 duty cycle

GMII, TBI

1000Base-T for RGMII, RTBI

G125H

G125

—

%2, 3

Notes:

1. Rise and fall times for EC_GTX_CLK125 are measured from 0.5 and 2.0 V for L/TV

= 2.5 V, and from 0.6 and 2.7 V for

L/TV

= 3.3 V.

2. Timing is guaranteed by design and characterization.

3. EC_GTX_CLK125 is used to generate the GTX clock TSECn_GTX_CLK for the eTSEC transmitter with 2% degradation.

EC_GTX_CLK125 duty cycle can be loosened from 47/53% as long as the PHY device can tolerate the duty cycle generated

by the TSECn_ GTX_CLK. See Section 8.2.6, “RGMII and RTBI AC Timing Specifications,” for duty cycle for 10Base-T and

100Base-T reference clock.

Table 7. PCIn_CLK AC Timing Specifications

At recommended operating conditions (see Table 2) with OV

= 3.3 V ± 165 mV.

Parameter/Condition Symbol Min Typ Max Unit Notes

PCIn_CLK frequency f

PCICLK

16 — 133 MHz —

PCIn_CLK cycle time t

PCICLK

7.5 — 60 ns —

PCIn_CLK rise and fall time t

PCIKH

, t

PCIKL

0.6 1.0 2.1 ns 1, 2

PCIn_CLK duty cycle t

PCIKHKL

PCICLK

40 — 60 % 2

Notes:

1. Rise and fall times for SYSCLK are measured at 0.6 and 2.7 V.

2. Timing is guaranteed by design and characterization.

MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 19

RESET Initialization

5 RESET Initialization

This section describes the AC electrical specifications for the RESET initialization timing requirements of

the device. The following table provides the RESET initialization AC timing specifications for the DDR

SDRAM component(s).

The following table provides the PLL lock times.

5.1 Power-On Ramp Rate

This section describes the AC electrical specifications for the power-on ramp rate requirements.

Controlling the maximum power-on ramp rate is required to avoid falsely triggering the ESD circuitry. The

following table provides the power supply ramp rate specifications.

Table 8. RESET Initialization Timing Specifications

Parameter/Condition Min Max Unit Notes

Required assertion time of HRESET

100 — μs—

Minimum assertion time for SRESET 3 — SYSCLKs 1

PLL input setup time with stable SYSCLK before HRESET negation 100 — μs—

Input setup time for POR configs (other than PLL config) with respect to

negation of HRESET

4 — SYSCLKs 1

Input hold time for all POR configs (including PLL config) with respect to

negation of HRESET

2 — SYSCLKs 1

Maximum valid-to-high impedance time for actively driven POR configs with

respect to negation of HRESET

— 5 SYSCLKs 1

Note:

1. SYSCLK is the primary clock input for the device.

Table 9. PLL Lock Times

Parameter/Condition Min Max Unit

Core and platform PLL lock times — 100 μs

Local bus PLL lock time — 50 μs

PCI/PCI-X bus PLL lock time — 50 μs

Table 10. Power Supply Ramp Rate

Parameter Min Max Unit Notes

Required ramp rate for MVREF — 3500 V/s 1

Required ramp rate for VDD — 4000 V/s 1, 2

Note:

1. Maximum ramp rate from 200 to 500 mV is most critical as this range may falsely trigger the ESD circuitry.

2. VDD itself is not vulnerable to false ESD triggering; however, as per Section 22.2, “PLL Power Supply Filtering,” the

recommended AVDD_CORE, AVDD_PLAT, AVDD_LBIU, AVDD_PCI1 and AVDD_PCI2 filters are all connected to VDD.

Their ramp rates must be equal to or less than the VDD ramp rate.

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