填补空白：RF与SoC设备生产测试指南

需积分: 9 116 浏览量更新于2024-07-18 收藏 3.3MB PDF 举报

《无线通信中的RF与SoC设备生产测试》是一本由Keith B. Schaub和Joe Kelly合著的专业书籍，填补了市场上的空白。该书专注于为工程师们提供关于生产环境中RF（无线电频率）设备和系统级芯片（System-on-a-Chip, SOC）的测试概念。在当前的科技文献中，虽然有许多关于RF测量技术的优秀教材和应用指南，以及混合信号分析和测量的实践手册，但鲜有将RF和混合信号测试领域融于一体的专著。本书的核心内容围绕以下几个关键知识点展开： 1. **RF和SoC设备测试的重要性**：作者指出，随着无线通信技术的发展，对这两种类型设备的生产测试变得越来越关键，因为它们直接影响到通信系统的性能和可靠性。 2. **理论与实践结合**：书中不仅深入讲解理论概念，还提供了实际操作和案例研究，帮助读者理解如何在生产线环境中有效地进行RF和SoC的测试，确保产品质量和一致性。 3. **测试方法和技术**：涵盖了广泛的测试方法，如频率响应测试、信号完整性测试、噪声分析、功耗评估等，这些都是生产测试过程中必不可少的技术。 4. **系统集成与验证**：书中还讨论了如何在无线通信系统的上下文中集成和验证RF和SoC组件，确保它们在复杂系统中的协同工作。 5. **标准与法规遵从性**：强调了生产和测试过程中的法规遵循，例如符合电磁兼容性（EMC）和辐射发射规范，确保产品的合规性和市场准入。 6. **最新趋势与未来展望**：鉴于无线通信领域的快速发展，书中的内容紧跟技术前沿，提到了最新的测试技术和趋势，为读者提供了前瞻性的视角。《无线通信中的RF与SoC设备生产测试》是工程技术人员必备的参考工具，无论是对于正在从事RF和SoC测试的专业人士，还是希望了解这个领域的研究人员或学生，都是一份极具价值的参考资料。通过本书，读者将能够掌握全面且实用的测试策略，提高生产效率和产品质量。

Following the format of Chapter 4, Chapter 5 provides algorithms on measure

ments used with more highly integrated SOC devices. The tests discussed in this sec

tion are typical of those found in wireless communications.

Chapter 6 is an introduction to many facets of mixed-signal testing. Common

tests that are finding their way into SOC device production testing are explained.

Chapter 7 covers new methods for improving the efficiency of production test

ing, taking it beyond simply performing the measurements faster. Concepts such as

parallel and concurrent testing are presented.

Chapter 8 is dedicated to the measurement of noise. Both noise figure and phase

noise measurements are discussed. The intention of this chapter is to educate the

engineer in what goes on behind the scenes of today’s easy-to-use noise figure ana

lyzers and automated test equipment (ATE). Gone are the days when the engineer

had to manually extract noise measurements, but it is important to understand the

algorithms, which even today, within analyzers, effectively remain unchanged.

There is further explanation on how to perform noise measurements in a

production-test environment. Phase noise is also be considered and examined.

Appendixes 4A, A, and B are included to cover the common items that every

engineer is often running hastily to find from their notes.

We look forward to helping to merge the worlds of RF and mixed-signal pro-

duction testing.

Keith Schaub

Joe Kelly

March 2004

Preface xv

CHAPTER 1

An Introduction to Production Testing

1.1 Introduction

For many years, radio frequency (RF) devices have been tested only to ensure that

they perform to specifications. Up until the early 1980s there were not many wire

less consumer devices. Most wireless devices at the time were used in military appli

cations. The tests performed on these devices were long and time-consuming to

assure near-perfect operation in radar-based applications or their other intended

purposes.

In the later 1980s the pager was introduced. Consisting of simply a receiver, this

was the beginning of the need for testing of RF devices in large volumes. In the early

1990s RF technology emerged into the consumer market in the form of cordless and

wireless (cellular, mobile) phones. There was a subsequent market explosion and an

immediate proliferation of mobile phones. It was apparent that the industry had

expanded and as a result the prices of semiconductor devices dropped significantly,

especially when compared to the RF devices used for military applications.

Now, as it is critical to produce quality and properly working products, RF and

system-on-a-chip (SOC) semiconductor devices are tested 100% for their intended

functionality. The difficult task is to derive a means to provide an efficient and com-

prehensive test methodology that can accurately sort good parts from defective

parts, and at a low cost. As will be discussed in Chapter 3, the cost of test of modern

RF and SOC devices has become a significant part of the overall cost of producing

these devices.

Therefore, production testing of RF and SOC devices is the act of performing

numerous tests in a short amount of time on high volumes of parts. The major

objective is to have high throughput and low overhead, or low cost of test, such that

the production testing does not adversely impact the marketable value of the device.

1.2 Characterization Versus Production Testing

Testing of a device under test (DUT

) can be performed in a number of ways. In pro

duction testing, it is optimal to have the shortest test needed to pass good DUTs and

fail bad DUTs. When a test program reaches the full production-testing stage, there

should be a minimal number of tests utilized. In contrast, during the early stages of

production and preproduction runs, the test program is often conservatively

1. The term UUT, for unit under test, is a more general production-testing terminology that is sometimes used

when discussing testing of electronic devices.

剩余271页未读，继续阅读

恋风恋歌的干货铺

粉丝: 1121
资源: 13

填补空白：RF与SoC设备生产测试指南

VMware Lab setup - A virtualized lab for testing HA and DRS

ASIC Artwork

Describe the background information of Significance of analyzing metal-transfer images for quality control and process optimization in detail

Can you show me a real application in reality about Dynamic part average testing?

You are running Vue in development mode. Make sure to turn on production mode when deploying for production. See more tips a

for production in productions: if production[0] == production[3]: left_recursion = True break for production in productions: if production[0] == production[3]: continue for i in range(3, len(production)): if production[i] in productions: backtracking = True break if backtracking: break优化代码

Please introduce the following in detail: Significance of analyzing metal-transfer images for quality control and process optimization.

最新资源