PCI Express M.2规格3.0版V1.2：2019年6月发布，无保障声明

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PCI Express M.2 Specification

June 26, 2019

PCI Express M.2 Specification

| 16

Revision 3.0, Version 1.2

Figure 6-11. Mid-mount Add-in Card Test Fixture PCB Layout ............................................................... 210

Figure 6-12. Mid-mount Motherboard Test Fixture PCB .......................................................................... 211

Figure 6-13. Detail of Top-side SMA End Launch Connector Pad........................................................... 211

Figure 6-14. Ground Void on Backside .................................................................................................... 212

Figure 6-15. Detail of Mid-mount Vias on Top-side Motherboard ............................................................ 213

Figure 6-16. Detail of Ground Void on Mid-mount Bottom Side Motherboard ......................................... 213

Figure 6-17. VSWR Test Setup for Receptacle RF Connector ................................................................ 214

Figure 6-18. Contact Resistance Measurement Definitions ..................................................................... 214

Figure 6-19. Prepared Wires .................................................................................................................... 215

Figure 6-20. Prepared Wire with Plug ...................................................................................................... 215

Figure 6-21. Example View of Notebook Motherboard ............................................................................ 225

Figure 6-22. Example View of Edge Vents ............................................................................................... 225

Figure 6-23. Example View of Bottom Vents (vent opening where inside boards are visible

through the opening) ............................................................................................................ 226

Figure 6-24. Example View of Region Over Adapters ............................................................................. 226

Figure 6-25. Example View of Hot Spot Over Adapters ........................................................................... 227

Figure 6-26. Example View of Motherboard for Thin Platform Notebook with Fan .................................. 230

Figure 6-27. Thin Platform Notebook Layout with Vents and Key Components ...................................... 231

Figure 6-28. Example View of Region and Hot Spots Over Adapters ..................................................... 232

Figure 6-29. Example View of Region and Hot Spots Under Adapters.................................................... 233

Figure 6-30. Example View of Tablet Motherboard .................................................................................. 236

Figure 6-31. Example View of System Layout, Including Table ............................................................... 237

Figure 6-32. Example View of Display Surface Temperature with WWAN Use Case Estimate II ........... 238

Figure 6-33. AC Coupling Capacitor Location – PCIe and USB3.1 Pluggable Add-in Card Example ..... 243

Figure 6-34. AC Coupling Capacitor Location – Soldered Down LGA Module on System

Board Example..................................................................................................................... 244

Figure 6-35. AC Coupling Capacitor Location – All-On-Same-Board Example ....................................... 245

Figure 6-36. AC Coupling Capacitor Location - SSD BGA on Pluggable M.2 Form Factor Example ..... 245

Figure 6-37. SATA-IO AC Coupling Capacitor Location – SATA Pluggable Add-in Card Example ........ 246

Figure 6-38. SATA-IO AC Coupling Capacitor Location - SSD BGA On Pluggable

Add-in Card Example .......................................................................................................... 246

PCI Express M.2 Specification

June 26, 2019

PCI Express M.2 Specification

| 17

Revision 3.0, Version 1.2

List of Tables

Table 2-1. Optional Adapter Configurations ............................................................................................ 30

Table 2-2. General Tolerance ................................................................................................................. 31

Table 2-3. Key Location/Pin Block Dimensions for Keys A to F ............................................................. 46

Table 2-4. Key Location/Pin Block Dimensions for Keys G to M ............................................................ 46

Table 2-5. RF Connector Physical Characteristics ................................................................................. 71

Table 2-6. RF Connector Mechanical Requirements .............................................................................. 71

Table 2-7. RF Connector Electrical Requirements ................................................................................. 72

Table 2-8. RF Connector Environmental Requirements ......................................................................... 72

Table 2-9. Recommended Antenna Function Allocation Table............................................................... 73

Table 2-10. Connector/Adapter Height Supported Matrix ......................................................................... 76

Table 2-11. Connector Physical Requirements......................................................................................... 77

Table 2-12. Connector Environmental Requirements ............................................................................... 78

Table 2-13. Connector Electrical Requirements ....................................................................................... 78

Table 2-14. Stand-off Height Descriptor Table........................................................................................ 101

Table 3-1. Socket 1 System Interface Signals and Voltage Table ........................................................ 108

Table 3-2. Power-up CLKREQ# Timings .............................................................................................. 114

Table 3-3. Power-up Timing Variables .................................................................................................. 116

Table 3-4. DP_MLDIR Pin Termination ................................................................................................. 118

Table 3-5. SDIO Reset and Power-up Timing....................................................................................... 119

Table 3-6. Simple Indicator Protocol for LED States ............................................................................ 125

Table 3-7. Radio Operational States ..................................................................................................... 126

Table 3-8. SDIO Based Add-in Card Pinouts (Key E) ........................................................................... 128

Table 3-9. DisplayPort Based Add-in Card Pinouts (Key A) ................................................................. 129

Table 3-10. Socket 1 Add-in Card Pinouts (Key A-E) ............................................................................. 130

Table 3-11. Socket 2 System Interface Signal Table .............................................................................. 134

Table 3-12. GPIO Pin Function Assignment per Port Configuration ....................................................... 142

Table 3-13. Audio Pin Mode and Function Assignment .......................................................................... 145

Table 3-14. Antenna Control Pin Mode and Function Assignment ......................................................... 147

Table 3-15. Socket 2 Add-in Card Configuration .................................................................................... 148

Table 3-16. Socket 2 Key B SSIC-based WWAN Adapter Pinouts ........................................................ 151

Table 3-17. Socket 2 Key B USB3.1 Gen1-based WWAN Adapter Pinout ............................................ 152

Table 3-18. Socket 2 Key B PCIe-based WWAN Adapter Pinout........................................................... 153

Table 3-19. Socket 2 Key B PCIe/USB3.1 Gen1-based WWAN Adapter Pinout ................................... 154

Table 3-20. Socket 2 Key B-M SATA-based SSD Adapter Pinout ......................................................... 155

Table 3-21. Socket 2 Key B-M PCIe-based SSD Adapter Pinout ........................................................... 156

PCI Express M.2 Specification

June 26, 2019

PCI Express M.2 Specification

| 18

Revision 3.0, Version 1.2

Table 3-22. Socket 2 Key C WWAN Adapter Pinout .............................................................................. 157

Table 3-23. Socket 3 System Interface Signal Table .............................................................................. 158

Table 3-24. Socket 3 SATA-based Adapter Pinouts (Key M) ................................................................. 161

Table 3-25. Socket 3 PCIe-based Adapter Pinouts (Key M) ................................................................... 162

Table 3-26. BGA SSD System Interface Signal Table for Types 1620, 2024, 2228, and 2828 ............ 163

Table 3-27. BGA SSD System Interface Signal Table for Type 1113..................................................... 165

Table 4-1. DC Specification for 3.3 V Logic Signaling .......................................................................... 174

Table 4-2. DC Specification for 1.8 V Logic Signaling .......................................................................... 175

Table 4-3. Power Ramp Timing ............................................................................................................ 177

Table 4-4. Power Rail Slew Rate .......................................................................................................... 178

Table 4-5. Regulated Power Rail Parameters for BGA SSD Types ..................................................... 178

Table 4-6. Key Regulated Power Rail Parameters ............................................................................... 179

Table 4-7. Key V

BAT

Power Rail Parameters ......................................................................................... 180

Table 4-8. Power Rating Table for M.2 Add-in Cards ........................................................................... 180

Table 5-1. Mechanical Key Assignments .............................................................................................. 183

Table 5-2. Socket 1 Versions ................................................................................................................ 183

Table 5-3. DisplayPort Based Socket 1 Pinout Diagram (Mechanical Key A) On Platform ................. 185

Table 5-4. SDIO Based Socket 1 Pinout Diagram (Mechanical Key E) On Platform .......................... 187

Table 5-5. Socket 2 Add-in Card Configuration Table .......................................................................... 189

Table 5-6. Socket 2 Pinout Diagram (Mechanical Key B) On Platform ................................................ 191

Table 5-7. Socket 2 Pinout Diagram (Mechanical Key C) On Platform ................................................ 193

Table 5-8. Socket 3 SSD Pinout (Mechanical Key M) On Platform ...................................................... 194

Table 6-1. Signal Integrity Parameters and Test Procedures for M.2 Connectors .............................. 204

Table 6-2. Example of Prepared Wire with Plug ................................................................................... 216

Table 6-3. Contact Resistance for the Sample Wires/Plugs ................................................................. 217

Table 6-4. Assumptions for Typical Components and Dissipation........................................................ 218

Table 6-5. Maximum Dissipation for WWAN Adapters ......................................................................... 219

Table 6-6. Generic Assumptions for Package Designations and Types Expected to

Populate Adapters ............................................................................................................... 219

Table 6-7. Assumptions for Generic System Environments ................................................................. 220

Table 6-8. Slot Definitions, Systems with Fans ..................................................................................... 221

Table 6-9. Slot Definitions, Systems without Fans ................................................................................ 221

Table 6-10. Example Use Case Applicable to Adapters for Notebooks ................................................. 224

Table 6-11. Thermal Design Power Response – Notebook Category .................................................... 228

Table 6-12. Skin Temperature Limit Assumptions, Notebook ................................................................. 228

Table 6-13. Skin Temperature Effect of Adapter Position ....................................................................... 229

Table 6-14. Use Cases Applicable to Adapters for Thin Platform Notebook with Fan .......................... 229

Table 6-15. Thermal Design Power Response – Thin Platform Notebook with Fan Category ............... 234

Table 6-16. Skin Temperature Limit Assumptions, Thin Platform Notebook with Fan ........................... 234

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