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6 Specifications
6.1 绝对最大额定值
在 25°C 的自然通风温度下(除非另有说明)
(1)
最小值 最大值 单位
V
CE
集电极 - 发射极的电压
50 V
V
I
输入电压
(2)
30 V
集电极峰值电流
500 mA
I(clamp)
输出钳位电流
500 mA
基板端子总电流
-2.5 A
T
J
结温
-65 150 °C
T
stg
贮存温度
–65
150 °C
(1) 超出绝对最大额定值运行可能会对器件造成永久损坏。绝对最大额定值并不表示器件在这些条件下或在建议运行条件以外的任何其他条
件下能够正常运行。如果超出建议运行条件但在绝对最大额定值范围内使用,器件可能不会完全正常运行,这可能影响器件的可靠性、
功能和性能并缩短器件寿命。
(2) 除非特别说明,否则所有电压值都以发射极/基板端子 GND 为基准。
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged device model (CDM), per ANSI/ESDA/ JEDEC JS-002
(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CE
Collector-emitter voltage 0 50 V
T
A
Ambient temperature
–40
85 °C
6.4 Thermal Information
THERMAL METRIC
(1)
ULN2803C
UNITDW (SOIC)
20 PINS
R
θJA
Junction-to-ambient thermal resistance 68.8 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 34.3 °C/W
R
θJB
Junction-to-board thermal resistance 37.5 °C/W
ψ
JT
Junction-to-top characterization parameter 10.7 °C/W
ψ
JB
Junction-to-board characterization parameter 37.0 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
ULN2803C
ZHCSQB7 – AUGUST 2022
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